Imaging device

Patent metadata

Field	Value
Publication number	US-10714518-B2
Application number	US-201816218702-A
Country	US
Kind code	B2
Filing date	Dec 13, 2018
Priority date	Dec 18, 2017
Publication date	Jul 14, 2020
Grant date	Jul 14, 2020

Abstract

An imaging device includes: a container including a bottom plate and a side wall provided on an outer circumferential portion of the bottom plate; a step portion which is formed in a top outer circumferential portion of the side wall and includes: a horizontal surface that is located at a lower position than a top surface of the side wall; and a side surface that connects the top surface of the side wall to the horizontal surface; an imaging element mounted on the bottom plate; a glass lid which is bonded to the top surface of the side wall with a first adhesive layer; and a cover frame which is disposed on the step portion and bonded to the side surface of the step portion and an outer circumferential surface of the glass lid with a second adhesive layer.

First claim

What is claimed is:

1. An imaging device comprising:
a container comprising a bottom plate and a side wall provided on an outer circumferential portion of the bottom plate;
a step portion which is formed in a top outer circumferential side surface of the side wall and comprises: a horizontal surface that is located at a lower position than a top surface of the side wall; and a side surface that connects the top surface of the side wall to the horizontal surface;
an imaging element mounted on the bottom plate;
a glass lid which is bonded to the top surface of the side wall with a first adhesive layer; and
a cover frame which is disposed on the step portion and bonded to the side surface of the step portion and directly to an outer circumferential surface of the glass lid with a second adhesive layer, the cover frame having a square frame shape with a central opening defined therein.

2. The imaging device according to claim 1 , wherein the second adhesive layer is made of a material that is different in characteristics from a material of the first adhesive layer.

3. The imaging device according to claim 2 , wherein the first adhesive layer is made of an adhesive material that is cured or semi-cured by illumination with ultraviolet light.

4. The imaging device according to claim 3 , wherein the second adhesive layer is made of a thermosetting adhesive material.

5. The imaging device according to claim 1 , wherein
the cover frame comprises:
a frame main body; and
a projected frame portion which projects from an inner surface of the frame main body, wherein the projected frame portion is bonded to the glass lid and an inner edge of the projected frame portion defines the central opening.

6. The imaging device according to claim 1 , wherein a top surface of the cover frame is flush with a top surface of the glass lid.

7. The imaging device according to claim 1 , wherein the cover frame is made of a heat-resistant plastic, a metal, or ceramic.

8. The imaging device according to claim 1 , wherein the container is made of ceramic.

9. The imaging device according to claim 1 , wherein at least a portion of the glass lid and the imaging element are exposed through the central opening of the cover frame.

Assignees

• Shinko Electric Ind Co

Inventors

• Matsuzawa Satoshi

Classifications

• H10F39/811

  Interconnections · CPC title

• H10F39/011

  Manufacture or treatment of image sensors covered by group H10F39/12 · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H01L27/14618 Primary

  Electricity · mapped topic

• H01L27/14636

  Electricity · mapped topic