Printing solder point quality identification and maintenance suggestion system and method thereof

Patent metadata

Field	Value
Publication number	US-12100129-B2
Application number	US-202117357396-A
Country	US
Kind code	B2
Filing date	Jun 24, 2021
Priority date	Jun 15, 2021
Publication date	Sep 24, 2024
Grant date	Sep 24, 2024

Abstract

A printing solder point quality identification and maintenance suggestion system and a method thereof are disclosed. In the system, when solder paste inspection data, component inspection data or circuit inspection data indicates presence of defect, an analysis and calculation device intercepts the operating data, the equipment data, the raw material data, the process data and the environment data from a time data stream, to generate a data feature portrait. The analysis and calculation device then sets a reliability value based on location association between the solder paste inspection data, the component inspection data, the circuit inspection data and the maintenance data in the location data stream, and performs similarity calculation on the data feature portrait and the comparison data feature portrait to calculate a similarity value, and then calculates a relative reliability value, and compares the relative reliability value with a reliability threshold value to generate maintenance suggestion information.

First claim

What is claimed is:

1. A printing solder point quality identification and maintenance suggestion system, adapted to an analysis and calculation device, and the printing solder point quality identification and maintenance suggestion system comprising:
a solder paste printing workstation configured to provide an operating data, an equipment data, a raw material data, a process data and an environment data;
a solder paste inspection configured to provide a solder paste inspection data;
an automated optical inspection configured to provide a component inspection data;
an in-line circuit inspection configured to provide a circuit inspection data;
a maintenance workstation machine configured to provide a maintenance data, wherein the maintenance data in correspondence to the solder paste inspection data, the component inspection data and the circuit inspection data; and
the analysis and calculation device comprising:
a data receiving module configured to receive the operating data, the equipment data, the raw material data, the process data and the environment data from the solder paste printing workstation, receive the solder paste inspection data from the solder paste inspection, receive the component inspection data from the automated optical inspection, receive the circuit inspection data from the in-line circuit inspection, and receive the maintenance data from a maintenance workstation machine;
a data integration module configured to associate and integrate the operating data, the equipment data, the raw material data, the process data and the environment data into a time data stream, based on time;
a location mapping module configured to map a solder point location of the solder paste inspection data to a location of the electronic component of the component inspection data, and then map the location of the electronic component of the component inspection data to the pin location of the electronic component in the circuit inspection data and the maintenance data, so as to associate and integrate into a location data stream;
a data acquisition module, wherein when the solder paste inspection data, the component inspection data or the circuit inspection data indicate defect, the data acquisition module intercepts the operating data, the equipment data, the raw material data, the process data and the environment data in correspondence to the manufacturing time of the pin location of the electronic component, from the time data stream;
a data feature portrait module configured to perform data projection on the intercepted operating data, the intercepted equipment data, the intercepted raw material data, the intercepted process data and the intercepted environment data, to generate a data feature portrait;
a reliability setting module configured to set a reliability value based on a location association between the solder paste inspection data, the component inspection data, the circuit inspection data and the maintenance data in the location data stream;
a calculation module configured to perform similarity calculation on the data feature portrait and the comparison data feature portrait to calculate a similarity value, and calculate a relative reliability value equal to a reliability value of the comparison data feature portrait times the similarity value plus a reliability value of the data feature portrait; and
a generation module configured to compare the relative reliability value and a reliability threshold value, so as to generate a maintenance suggestion information based on a comparison result.

2. The printing solder point quality identification and maintenance suggestion system according to claim 1 , wherein when the solder paste inspection data indicates presence of defect, the reliability setting module sets the reliability value as a first reliability value;
wherein when the solder paste inspection data indicates presence of defect and the location of the electronic component mapping to the component inspection data also indicates presence of defect, the reliability setting module sets the reliability value as a second reliability value;
wherein when the solder paste inspection data indicates presence of defect and the pin location of the electronic component mapping to the circuit inspection data also indicates presence of defect, the reliability setting module sets the reliability value as a third reliability value;
wherein when the solder paste inspection data indicates presence of defect and the location of the electronic component mapping to the component inspection data also indicates presence of defect and the pin location of the electronic component mapping to the circuit inspection data also indicates presence of defect, the reliability setting module sets the reliability value as a fourth reliability value;
wherein when the solder paste inspection data indicates presence of defect and the location of the electronic component mapping to the component inspection data indicates presence of defect and the pin location of the electronic component mapping to the circuit inspection data indicates presence of defect and the pin location of the electronic component mapping to the maintenance data presence of defect, the reliability setting module sets the reliability value as a fifth reliability value.

3. The printing solder point quality identification and maintenance suggestion system according to claim 1 , wherein the calculation module performs the similarity calculation on the data feature portrait and the comparison data feature portrait to calculate the similarity value by calculating differences between data points in the data feature portrait and corresponding data points in the comparison data feature portrait, respectively, and multiplying the differences by weight values to obtain weighted differences, and then calculating an average of the weighted differences to obtain the similarity value.

Assignees

• Inventec Pudong Tech Corp
• Inventec Corp

Inventors

• Sun Meng

Classifications

• B23K31/12

  relating to investigating the properties, e.g. the weldability, of materials · CPC title

• G06T2207/30152

  Solder · CPC title

• G01N21/95607

  using a comparative method · CPC title

• G01N2021/95646

  Soldering · CPC title

• H05K13/083

  Quality monitoring using results from monitoring devices, e.g. feedback loops (H05K13/084 takes precedence) · CPC title