Measurement machine and method for detecting a defect in solder joints

Patent metadata

Field	Value
Publication number	US-2023059410-A1
Application number	US-202117404097-A
Country	US
Kind code	A1
Filing date	Aug 17, 2021
Priority date	Aug 17, 2021
Publication date	Feb 23, 2023
Grant date	—

Abstract

Example implementations relate to an inspection method for training a measurement machine to accurately measure side joint lengths and detecting a defect among a plurality of solder joints. The method includes receiving a first data representing the side joint lengths of the plurality of solder joints measured by a first measurement machine and a second data representing the side joint lengths measured by a second measurement machine. Further, the method includes determining a correlation value based on a statistical analysis of a relationship between the first data and the second data. The method further includes updating an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first data and the second data. Later, the updated algorithm is used as a dimensional metrology in the first measurement machine for detecting the defect in the solder joints.

First claim

What is claimed is:

1 . A method comprising:
i) receiving, by a processing resource of a computing device, a first data representing side joint lengths of a plurality of solder joints measured by a first measurement machine, wherein the plurality of solder joints is formed between a solder lead in an electronic component and an electronic board; ii) receiving, by the processing resource, a second data representing the side joint lengths of the plurality of solder joints measured by a second measurement machine; iii) determining, by the processing resource, a correlation value based on a statistical analysis of a relationship between the first and second data; and iv) updating, by the processing resource, an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first and second data, wherein the algorithm is used as a dimensional metrology in the first measurement machine to detect a defect among the plurality of solder joints.

2 . The method of claim 1 , wherein updating the algorithm comprises:
determining, by the processing resource, whether the correlation value is outside a pre-defined correlation coefficient range; and updating the algorithm, by the processing resource, in response to determining that the correlation value is outside the pre-defined correlation coefficient range, based on the second data, wherein the correlation value is a correlation coefficient value.

3 . The method of claim 1 , wherein updating the algorithm comprises:
determining, by the processing resource, whether the correlation value is outside a pre-defined coefficient of determination percentage; and updating the algorithm, by the processing resource, in response to determining that the correlation value is outside the pre-defined coefficient of determination percentage, based on the second data, wherein the correlation value is a coefficient of determination value.

4 . The method of claim 1 , wherein updating the algorithm comprises training the algorithm for measuring the side joint lengths based on the second data generated by the second measurement machine.

5 . The method of claim 1 , wherein updating the algorithm comprises:
determining, by the processing resource, whether the correlation value is inside a pre-defined value, wherein the correlation value comprises a correlation coefficient value and a coefficient of determination value, and wherein the pre-defined value comprises a pre-defined correlation coefficient range and a pre-defined coefficient of determination percentage; and repeating, by the processing resource, steps i) to iii) based on another set of the first and second data in response to determining that the correlation value is inside the pre-defined value.

6 . The method of claim 5 , further comprising:
determining, by the processing resource, whether the correlation value for other set of the first and second data, is outside the pre-defined value; and updating the algorithm, by the processing resource, in response to determining that the correlation value is outside the pre-defined value, based on the second data in other set of the first and second data.

7 . The method of claim 5 , further comprising:
determining, by the processing resource, whether the correlation value for other set of the first and second data, is inside the pre-defined value; and in response to determining that the correlation value is inside the pre-defined value, updating, by the processing resource, the algorithm with a pre-defined threshold side joint length, wherein the pre-defined threshold side joint length is determined based on raw material measurements of a foot length and a lead width of solder lead.

8 . The method of claim 7 , further comprising:
processing, by a processor of the first measurement machine, the algorithm to measure the side joint lengths of the solder joints; and determining, by the processor, whether to generate an alert signal indicative of the defect detected in the solder joints based on comparison of a measured side joint length of the solder joint with the pre-defined threshold side joint length.

9 . The method of claim 1 , wherein the first measurement machine is an X-ray machine, and wherein the second measurement machine is an optical machine.

10 . A method comprising:
detecting, by a processing resource of a measurement machine, at least one quality feature of a solder joint among a plurality of solder joints formed between a solder lead in an electronic component and an electronic board; analyzing, by the processing resource, the at least one quality feature to measure a side joint length of the solder joint; and determining, by the processing resource, whether to generate an alert signal indicative of a defect detected in the solder joint based on comparison of a measured side joint length of the solder joint with a pre-defined threshold side joint length, wherein the pre-defined threshold side joint length is determined based on raw material measurements of a foot length and a lead width of the solder lead.

11 . The method of claim 10 , wherein the pre-defined threshold side joint length is greater than or equal to a three times the lead width of the solder lead in the electronic component.

12 . The method of claim 10 , wherein the pre-defined threshold side joint length is greater than or equal to seventy five percentage of the foot length of the solder lead in the electronic component.

13 . The method of claim 10 , further comprising, in response to detecting the defect in the solder joint, defining, by the processing resource, a severity of the defect depending on a deviation range of the measured side joint length from the pre-defined threshold side joint length.

14 . The method of claim 13 , wherein the severity comprises an indicator for a process improvement in a manufacture of the plurality of solder joints or a stopover of a production environment of the plurality of solder joints.

15 . The method of claim 10 , wherein the measurement machine is an X-ray machine.

16 . A measurement machine comprising:
a machine readable medium that stores program instructions; and a processing resource operably coupled to the machine readable medium, wherein the processing resource executes the program instructions to:
detect at least one quality feature of a solder joint among a plurality of solder joints formed between a solder lead in an electronic component and an electronic board;
analyze the at least one quality feature to measure a side joint length of the solder joint; and
determine whether to generate an alert signal indicative of a defect detected in the solder joint based on comparison of measured side joint length of the solder joint with a pre-defined threshold side joint length, wherein the pre-defined threshold side joint length is determined based on raw material measurements of a foot length and a lead width of the solder lead.

17 . The measurement machine of claim 16 , wherein each solder joint of the plurality of solder joints has a flat gull wing solder lead.

18 . The measurement machine of claim 16 , is an X-ray machine.

19 . The measurement machine of claim 16 , wherein the pre-defined threshold side joint length is greater than or equal to a three times the lead width of the solder lead in the electronic component.

20 . The measurement machine of claim 16 , wherein the pre-defined threshold side joint length is greater than

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Llinas Jaime E
• Rathakrishnan Saravanan
• Xia Yanyan
• Wu Zelin
• Li Yanli
• Li Junhui
• Miremadi Jian

Classifications

• G01N2021/95669

  for solder coating, coverage · CPC title

• G01N21/956

  Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} · CPC title

• G01N2021/95638

  for PCB's · CPC title

• G01B21/042

  Calibration or calibration artifacts (G01B3/30, G01B9/02072 take precedence) · CPC title

• G01B9/04

  Measuring microscopes · CPC title