Stretchable electronic assembly
US-10477688-B2 · Nov 12, 2019 · US
Integrated electronic device with flexible and stretchable substrate
US12096553B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12096553-B2 |
| Application number | US-201916572652-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 17, 2019 |
| Priority date | Mar 10, 2016 |
| Publication date | Sep 17, 2024 |
| Grant date | Sep 17, 2024 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A flexible and stretchable integrated electronic device includes a substrate having a stiffness gradient, wherein a rigid electronic device is embedded within the substrate. The stiffness gradient within the substrate prevents delamination at the interface between the substrate and the embedded device. The stiffness gradient is accomplished by providing at least two distinct zones in the substrate with uniform stiffness, with each zone decreasing in stiffness as in a distance from the embedded device increases, or the gradient is accomplished by having a zone with a varying stiffness.
First claim
Opening claim text (preview).
What is claimed is: 1. An integrated electronic device comprising: a substrate consisting of a polymer base and a curing agent, wherein the substrate has a first section and a second section, a rigid electronic device is embedded in the substrate, wherein the first section of the substrate is adjacent to the rigid electronic device and has a uniform stiffness and a higher concentration of curing agent than the second section, wherein the second section of the substrate is peripheral to the first section and has a stiffness gradient with a maximum stiffness at an interface with the first section, wherein an average of the Young's modulus of the second section is less than the Young's modulus of the first section, and wherein the stiffness gradient of the second section is continuous. 2. The integrated electronic device of claim 1 , wherein the polymer base comprises an elastic polymer selected from the group consisting of polydimethylsiloxane, two-part silicone elastomer, room-temperature-vulcanizing silicone rubber, tin-catalyzed silicone, and platinum-catalyzed silicone. 3. The integrated electronic device of claim 1 , further comprising: a passive electronic device embedded in the substrate and connected to the rigid electronic device. 4. The integrated electronic device of claim 3 , wherein the passive electronic device is at least one selected from the group consisting of an antenna, a coil, a wire, and a sensor.
Assignees
Inventors
Classifications
by a substrate and the encapsulations · CPC title
- H10W99/00Primary
Subject matter not provided for in other groups of this subclass · CPC title
Non-printed inductor · CPC title
by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title
Improvement of the adhesion between the insulating substrate and the metal · CPC title
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- What does patent US12096553B2 cover?
- A flexible and stretchable integrated electronic device includes a substrate having a stiffness gradient, wherein a rigid electronic device is embedded within the substrate. The stiffness gradient within the substrate prevents delamination at the interface between the substrate and the embedded device. The stiffness gradient is accomplished by providing at least two distinct zones in the substr…
- Who is the assignee on this patent?
- Univ Carnegie Mellon
- What technology area does this patent fall under?
- Primary CPC classification H10W99/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 17 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).