Flexible electronic circuits with embedded integrated circuit die

Patent metadata

Field	Value
Publication number	US-9899330-B2
Application number	US-201514870719-A
Country	US
Kind code	B2
Filing date	Sep 30, 2015
Priority date	Oct 3, 2014
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic-based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer.

First claim

What is claimed:

1. A flexible integrated circuit (IC) module comprising:
a flexible substrate;
a semiconductor die attached to the flexible substrate; and
an encapsulating layer attached to the flexible substrate, the semiconductor die being encased between the flexible substrate and the encapsulating layer, the encapsulating layer including a polyimide adhesive, wherein the polyimide adhesive comprises an acrylic-based thermally conductive and electrically isolating polyimide adhesive.

2. The flexible integrated circuit module of claim 1 , wherein the encapsulating layer further includes a thermoplastic resin.

3. The flexible integrated circuit module of claim 2 , wherein the thermoplastic resin comprises a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend.

4. The flexible integrated circuit module of claim 1 , wherein the flexible substrate comprises a layer of flexible polymer and two layers of conductive material, each of the layers of conductive material being disposed on a respective side of the layer of flexible polymer.

5. The flexible integrated circuit module of claim 4 , further comprising a second flexible substrate attached to the encapsulating layer on the opposite side of the flexible substrate, the second flexible substrate including one or more vias extending therethrough to the semiconductor die.

6. A flexible integrated circuit (IC) module comprising:
a flexible substrate;
a semiconductor die attached to the flexible substrate; and
an encapsulating layer attached to the flexible substrate, the encapsulating layer including a thermoplastic resin or a polyimide adhesive, or both, the semiconductor die being encased between the flexible substrate and the encapsulating layer,
wherein the thermoplastic resin comprises a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend.

7. The flexible integrated circuit module of claim 6 , wherein the polyimide adhesive comprises an acrylic-based thermally conductive and electrically isolating polyimide adhesive.

8. The flexible integrated circuit module of claim 6 , wherein the semiconductor die comprises a wafer of electronic-grade silicon with an integrated circuit formed thereon.

9. The flexible integrated circuit module of claim 6 , wherein the flexible substrate comprises a layer of flexible polymer and two layers of conductive material, each of the layers of conductive material being disposed on a respective side of the layer of flexible polymer.

10. The flexible integrated circuit module of claim 9 , further comprising a second flexible substrate attached to the encapsulating layer on the opposite side of the flexible substrate, the second flexible substrate including one or more vias extending therethrough to the semiconductor die.

11. A flexible integrated circuit (IC) module comprising:
a flexible substrate;
a semiconductor die attached to the flexible substrate, the semiconductor die comprising a wafer of electronic-grade silicon with an integrated circuit formed thereon, and
an encapsulating layer attached to the flexible substrate, the semiconductor die being encased between the flexible substrate and the encapsulating layer, the encapsulating layer including a polyimide adhesive.

12. A flexible integrated circuit (IC) module comprising:
a flexible substrate including a layer of flexible polymer and two layers of conductive material, each of the layers of conductive material being disposed on a respective side of the layer of flexible polymer;
a semiconductor die attached to the flexible substrate; and
an encapsulating layer attached to the flexible substrate, the encapsulating layer including a thermoplastic resin or a polyimide adhesive, or both, the semiconductor die being encased between the flexible substrate and the encapsulating layer.

13. The flexible integrated circuit module of claim 12 , wherein the layer of flexible polymer comprises a sheet of thermoset polyimide polymer, and the layers of conductive material each comprises a copper coating.

14. The flexible integrated circuit module of claim 13 , wherein the layers of copper coating are each patterned on a respective side of the sheet of thermoset polyimide polymer.

15. The flexible integrated circuit module of claim 12 , further comprising a second flexible substrate attached to the encapsulating layer on the opposite side of the flexible substrate.

16. The flexible integrated circuit module of claim 15 , wherein the second flexible substrate comprises a second layer of flexible polymer and two second layers of conductive material, each of the second layers of conductive material being disposed on a respective side of the second layer of flexible polymer.

17. The flexible integrated circuit module of claim 16 , wherein the second layer of flexible polymer comprises a sheet of thermoset polyimide polymer, and the second layers of conductive material each comprises a copper coating.

18. The flexible integrated circuit module of claim 15 , wherein the second flexible substrate further comprises one or more vias extending therethrough to the semiconductor die.

19. The flexible integrated circuit module of claim 12 , wherein the thermoplastic resin comprises a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend and wherein the polyimide adhesive comprises an acrylic-based thermally conductive and electrically isolating polyimide adhesive.

20. The flexible integrated circuit module of claim 12 , wherein the semiconductor die comprises a wafer of electronic-grade silicon with an integrated circuit formed thereon.

21. A flexible integrated circuit (IC) package for an extremely flexible electronic device, the flexible IC package comprising:
a first flexible substrate including a first layer of flexible polymer and a first pair of layers of conductive material, each of the first layers of conductive material being disposed on a respective side of the first layer of flexible polymer;
a silicon die attached to the first flexible substrate, the silicon die including a wafer of electronic-grade silicon with an integrated circuit formed thereon;
a second flexible substrate including a second layer of flexible polymer and a second pair of layers of conductive material, each of the second layers of conductive material being disposed on a respective side of the second layer of flexible polymer; and
an encapsulating layer disposed between and laminated to the first and second flexible substrates, the encapsulating layer including a thermoplastic resin or a polyimide adhesive, or both, encasing the silicon die.

22. The flexible integrated circuit package of claim 21 , wherein the polyimide adhesive comprises an acrylic-based thermally conductive and electrically isolating polyimide adhesive.

23. The flexible integrated circuit package of claim 21 , wherein the thermoplastic resin comprises a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend.

24. The flexible integrated circuit package of claim 21 , wherein the second flexible substrate further comprises one or more vias extending therethrough to the silicon die.

Assignees

• Mc10 Inc

Inventors

• Dalal Mitul
• Gupta Sanjay

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title