Lithography thermal control

Patent metadata

Field	Value
Publication number	US-12096544-B2
Application number	US-202318298927-A
Country	US
Kind code	B2
Filing date	Apr 11, 2023
Priority date	Aug 31, 2021
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

A light source is provided capable of maintaining the temperature of a collector surface at or below a predetermined temperature. The light source in accordance with various embodiments of the present disclosure includes a processor, a droplet generator for generating a droplet to create extreme ultraviolet light, a collector for reflecting the extreme ultraviolet light into an intermediate focus point, a light generator for generating pre-pulse light and main pulse light, and a thermal image capture device for capturing a thermal image from a reflective surface of the collector.

First claim

The invention claimed is:

1. A light source for a photolithography fabrication process, comprising:
a collector for reflecting extreme ultraviolet light into an intermediate focus point; and
a thermal image capture device for capturing a thermal image from a reflective surface of the collector.

2. The light source of claim 1 , further comprising:
a processor;
a light generator for generating pre-pulse light and main pulse light; and
a droplet generator for generating a droplet, wherein the droplet generates the extreme ultraviolet light in response to the droplet being illuminated with the pre-pulse light and the main pulse light.

3. The light source of claim 2 , wherein the thermal image capture device creates a thermal image based on infrared radiation emitted from the reflective surface of the collector.

4. The light source of claim 3 , wherein the processor analyzes temperature distribution of the reflective surface of the collector based on the thermal image.

5. The light source of claim 2 , wherein the processor is configured to adjust an illuminating timing of the main pulse light, the adjustment to the illuminating timing affecting an impinging direction of a plasma, generated from the droplet, to the reflective surface of the collector.

6. The light source of claim 2 , wherein the processor is configured to adjust an illuminating angle of the main pulse light, the adjustment to the illuminating angle affecting an impinging direction of a plasma, generated from the droplet, to the reflective surface of the collector.

7. The light source of claim 1 , further comprising a processor, and wherein the processor is configured to utilize the thermal image to determine a coldest location on the reflective surface of the collector or determine a location on the reflective surface of the collector that is predicted to maintain its temperature below a predetermined temperature after exposure to a plasma generated from a droplet.

8. The light source of claim 7 , further comprising a droplet generator for generating the droplet.

9. The light source of claim 7 , wherein the processor is configured to adjust a velocity of the droplet, the adjustment in the velocity of the droplet causing the plasma to impinge on the determined location of the reflective surface of the collector.

10. The light source of claim 7 , wherein the processor is configured to adjust a traveling path of the droplet, the adjustment in the traveling path of the droplet causing the plasma to impinge on the determined location of the reflective surface of the collector.

11. The light source of claim 7 , wherein the processor is configured to adjust a velocity and a traveling path of the droplet, the adjustment in the velocity of the droplet and the adjustment in the traveling path of the droplet causing the plasma to impinge on the determined location of the reflective surface of the collector.

12. The light source of claim 7 , wherein the processor is configured to adjust an illuminating timing of the main pulse light, the adjustment in the illuminating timing causing the plasma to impinge on the determined location of the reflective surface of the collector.

13. The light source of claim 7 , wherein the processor is configured to adjust an illuminating angle of the main pulse light, the adjustment in the illuminating angle of the main pulse of light causing the plasma to impinge on the determined location of the reflective surface of the collector.

14. The light source of claim 7 , wherein the processor is configured to adjust an illuminating angle of the main pulse light and adjust an illuminating timing of the main pulse, the adjustment in the illuminating angle of the main pulse light and the adjustment in the illuminating timing of the main pulse light causing the plasma to impinge on the determined location of the reflective surface of the collector.

15. The light source of claim 7 , wherein the predetermined temperature is <50° C.

16. A light source for a photolithography fabrication process, comprising:
a collector including a reflective surface that reflects extreme ultraviolet light into an intermediate focus point;
a plurality of thermoelectric cooling modules at a plurality of locations on the collector.

17. The light source of claim 16 , wherein each of the plurality of thermoelectric cooling modules transmits temperature measurements at the plurality of locations.

18. The light source of claim 16 , further comprising:
a processor;
a droplet generator for generating a droplet;
a light generator for generating pre-pulse light and main pulse light; and
a plurality of thermoelectric cooling modules at a plurality of locations on the collector,
wherein the droplet generates the extreme ultraviolet light in response to the droplet being illuminated with the pre-pulse light and the main pulse light.

19. A method of generating extreme ultraviolet light for a semiconductor fabrication process, the method comprising:
measuring, at a plurality of locations, a temperature of a collector; and
determining, by a processor, an impinging direction of a plasma to the collector surface based on the measuring the temperature of the collector at the plurality of locations.

20. The method of claim 19 , further comprising:
adjusting, by the processor, at least one of a velocity of a droplet, a traveling path of the droplet, an illuminating angle of a main pulse light, or an illuminating timing of the main pulse light.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Tai-Yu
• Lin Cho-Ying
• Khivsara Sagar Deepak
• Chen Hsiang
• Hsieh Chieh
• Yu Sheng-Kang
• Chien Shang-Chieh
• Lam Kai Tak
• Chen Li-Jui
• Liu Heng-Hsin
• Wu Zhiqiang

Classifications

• H05G2/0084

  Control of the laser beam · CPC title

• H05G2/0094 Primary

  Reduction, prevention or protection from contamination; Cleaning · CPC title

• H05G2/0027

  Arrangements for controlling the supply; Arrangements for measurements · CPC title

• H05G2/0023

  Constructional details of the ejection system · CPC title

• G03F7/70033 Primary

  by plasma extreme ultraviolet [EUV] sources · CPC title