Heatsink structures for heat-assisted magnetic recording heads

Patent metadata

Field	Value
Publication number	US-12094491-B2
Application number	US-202218081527-A
Country	US
Kind code	B2
Filing date	Dec 14, 2022
Priority date	Jul 24, 2019
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

A recording head comprises a write pole extending to an air-bearing surface. A near-field transducer is positioned proximate a first side of the write pole in a down-track direction. A heatsink structure is proximate the near-field transducer and positioned between the near-field transducer and the write pole. The heatsink structure extends beyond the near-field transducer in a cross-track direction and extends in a direction normal to the air-bearing surface.

First claim

What is claimed is:

1. A recording head, comprising:
a write pole extending to an air-bearing surface and having a sloped first side in a down-track direction;
a near-field transducer positioned proximate the sloped first side of the write pole in the down-track direction, the near-field transducer comprising a peg coupled with a bottom portion; and
a heatsink structure adjacent to and in contact with the bottom portion and positioned between the near-field transducer and the write pole, the heatsink structure comprising:
a first surface;
an opposing surface that is sloped toward the first surface, a slope of the opposing surface conforming to a slope of the sloped first side of the write pole;
a first edge extending between the first surface and the opposing surface, the first edge proximate to the air-bearing surface; and
an opposing edge opposite the first edge extending between the first surface and the opposing surface, the opposing edge distal the air-bearing surface;
wherein the heatsink structure comprises a sloped extension that extends beyond the near-field transducer in a cross-track direction to define a wing shape, the sloped extension in contact with the bottom portion of the near-field transducer and conforming to the slope of the sloped first side of the write pole.

2. The recording head of claim 1 , wherein the bottom portion comprises gold.

3. The recording head of claim 1 , further comprising a mini solid immersion mirror (miniSIM) connected to the first edge of the heatsink structure.

4. The recording head of claim 3 , wherein the miniSIM comprises rhodium.

5. The recording head of claim 3 , wherein the miniSIM comprises a liner, the liner comprising gold.

6. The recording head of claim 1 , further comprising a diffuser coupled to the opposing edge of the heatsink structure.

7. The recording head of claim 1 , wherein the opposing edge of the heatsink structure is aligned with an edge of the bottom portion.

8. The recording head of claim 1 , wherein the first surface of the heatsink structure extends beyond an edge of the bottom portion such that the opposing edge is farther from the air-bearing surface than the edge of the bottom portion.

9. The recording head of claim 1 , wherein the bottom portion extends beyond the opposing edge of the heatsink structure such that an edge of the bottom portion is farther from the air-bearing surface than the opposing edge of the heatsink structure.

10. A recording head, comprising:
a write pole extending to an air-bearing surface and having a sloped first side in a down-track direction;
a near-field transducer positioned proximate the sloped first side of the write pole in the down-track direction, the near-field transducer comprising a peg coupled with a bottom portion; and
a heatsink structure adjacent to and in contact with the bottom portion and positioned between the near-field transducer and the write pole, the heatsink structure comprising:
a first surface;
a second surface forming a wedge shape with the first surface, the second surface sloped toward the first surface in a direction toward the air-bearing surface, a slope of the second surface conforming to that of the sloped first side of the write pole;
a first edge extending between the first surface and the second surface, the first edge proximate to the air-bearing surface; and
an opposing edge opposite the first edge extending between the first surface and the second surface;
wherein the heatsink structure comprises a sloped extension that extends beyond the near-field transducer in a cross-track direction to define a wing shape, the sloped extension in contact with the bottom portion of the near-field transducer and conforming to the slope of the sloped first side of the write pole.

11. The recording head of claim 10 , wherein the bottom portion comprises gold.

12. The recording head of claim 10 , further comprising a mini solid immersion mirror (miniSIM) connected to the first edge of the heatsink structure.

13. The recording head of claim 12 , wherein the miniSIM comprises rhodium.

14. The recording head of claim 12 , wherein the miniSIM comprises a liner, the liner comprising gold.

15. The recording head of claim 10 , further comprising a diffuser coupled to the opposing edge of the heatsink structure.

16. The recording head of claim 10 , wherein the opposing edge of the heatsink structure is aligned with an edge of the bottom portion.

17. The recording head of claim 10 , wherein the first surface of the heatsink structure extends beyond an edge of the bottom portion such that the opposing edge is farther from the air-bearing surface than the edge of the bottom portion.

18. The recording head of claim 10 , wherein the bottom portion extends beyond the opposing edge of the heatsink structure such that an edge of the bottom portion is farther from the air-bearing surface than the opposing edge of the heatsink structure.

Assignees

• Seagate Technology Llc

Inventors

• Habibi Helene Parwana
• Bance Simon
• Mcgarry Martin Liam
• Andruet Raul Horacio
• Blaber Martin Giles
• Chen Weibin
• Duda John Charles
• Gubbins Mark Anthony
• Hutchinson Erik Jon
• Krishnamurthy Vivek
• Seigler Michael Allen
• Wang Chen

Classifications

• G11B5/314

  where the layers are extra layers normally not provided in the transducing structure, e.g. optical layers (G11B5/3196 takes precedence) · CPC title

• G11B5/3133

  including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure (G11B5/3106 takes precedence) · CPC title

• G11B5/3116

  Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks (G11B5/3113, G11B5/245 take precedence) · CPC title

• G11B5/3106

  where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination (G11B5/3133 takes precedence) · CPC title

• G11B13/08

  using near-field interactions or transducing means and at least one other method or means for recording or reproducing · CPC title