Copper-ceramic joint body, brazing member and method of manufacturing copper-ceramic joint body

Patent metadata

Field	Value
Publication number	US-12090564-B2
Application number	US-202318188517-A
Country	US
Kind code	B2
Filing date	Mar 23, 2023
Priority date	Mar 24, 2022
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

A copper-ceramic joint body having high joint strength is provided. The copper-ceramic joint body includes: a copper member made of Cu or Cu alloy; a ceramic member joined to the copper member and made of nitride of Si or Al; and a joint layer formed on joint surfaces of the copper member and the ceramic member, and containing Cu and Mg and further containing at least one type of active metal elements selected from a group of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Ca, Y, Ce, La, Sm, Yb, Nd, Gd and Er, and shear strength of the joint layer is equal to or higher than 10 MPa.

First claim

What is claimed is:

1. A copper-ceramic joint body comprising:
a copper member made of Cu or Cu alloy;
a ceramic member joined to the copper member and made of nitride of Si or Al; and
a joint layer formed on joint surfaces of the copper member and the ceramic member, and containing Cu and Mg and further containing at least one type of active metal elements selected from a group of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Ca, Y, Ce, La, Sm, Yb, Nd, Gd and Er,
wherein shear strength of the joint layer is equal to or higher than 10 MPa.

2. The copper-ceramic joint body according to claim 1 ,
wherein tensile strength of the joint layer is equal to or higher than 17.3 MPa.

3. The copper-ceramic joint body according to claim 1 ,
wherein the joint layer includes:
a first layer configuring a boundary with the copper member and including a solid solution phase resulted from solid solution of Mg into Cu; and
a second layer configuring a boundary with the ceramic member and containing nitride of the active metal element,

the first layer further includes a compound phase containing an intermetallic compound of Cu and Mg,
in observation of the first layer at a cross-sectional surface vertical to the joint surfaces, a total cross-sectional area SA of the solid solution phase and a total cross-sectional area SB of the compound phase satisfy a relational expression “SA/(SA+SB)>0.6” in a near-boundary region adjacent to a boundary with the second layer.

4. The copper-ceramic joint body according to claim 3 ,
wherein the first layer has a path made of the solid solution phase connecting the second layer and the copper member.

5. The copper-ceramic joint body according to claim 3 ,
wherein, in observation of the first layer at the cross-sectional surface vertical to the joint surfaces, no void having a circular equivalent diameter that is equal to or larger than 8 μm is observed within any field of view of 10000 μm 2 .

6. The copper-ceramic joint body according to claim 5 ,
wherein, in observation of the first layer at the cross-sectional surface vertical to the joint surfaces, within any field of view of 10000 μm 2 , the number of voids each having a circular equivalent diameter that is larger than 2 μm and smaller than 8 μm is equal to or smaller than 10.

7. The copper-ceramic joint body according to claim 3 ,
wherein the second layer contains a nitride crystal X expressed by a composition formula MgSiN 2 .

8. The copper-ceramic joint body according to claim 7 ,
wherein the nitride crystal X is unevenly distributed to the vicinity of the boundary of the second layer with the ceramic member.

9. The copper-ceramic joint body according to claim 3 ,
wherein the second layer does not substantially contain a nitride crystal Y expressed by a composition formula Mg 3 N 2 .

Assignees

• Proterial Ltd

Inventors

• Nogawa Takashi
• Takano shun
• Okishiro Kenji
• Okamoto Atsushi

Classifications

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

• B23K1/19

  taking account of the properties of the materials to be soldered · CPC title

• B23K2103/52

  Ceramics · CPC title

• B23K2103/12

  Copper or alloys thereof · CPC title

• C04B2237/124

  based on copper · CPC title