PCB production by laser systems

Patent metadata

Field	Value
Publication number	US-12089328-B2
Application number	US-202318499009-A
Country	US
Kind code	B2
Filing date	Oct 31, 2023
Priority date	Feb 11, 2021
Publication date	Sep 10, 2024
Grant date	Sep 10, 2024

Abstract

Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.

First claim

What is claimed is:

1. A system for fabricating a printed circuit board (PCB) assembly, the system comprising:
a substrate holder configured to hold a PCB substrate and translatable between a plurality of processing stations, said processing stations including a printing station;
the printing station configured for laser-assisted deposition (LAD) of one or more materials by jetting respective ones of said materials individually from respective donor substrates on which said respective ones of said materials are coated or otherwise disposed;
a curing station configured to cure by heating, infrared (IR) irradiation, or ultraviolet (UV) irradiation, deposited ones of said materials on said PCB substrate; and
a drilling station configured to drill or engrave through holes and/or vias in said PCB substrate and/or layers of ones of said materials disposed thereon,
wherein the donor substrate includes a first donor substrate and a second donor substrate, and
wherein the printing station is configured to jet metal droplets from the first donor substrate onto the PCB substrate and/or into one or more holes therein to form a layer of metal on the PCB substrate using a laser of the printing station and to jet an epoxy from the second donor substrate onto the layer of metal to form a layer of the epoxy on the layer of metal using the laser of the printing station.

2. The system for fabricating a PCB assembly as in claim 1 , wherein said printing station is further configured for laser sintering and/or laser ablation of said respective ones of said materials printed on said PCB substrate and/or additional layers of said PCB assembly.

3. The system for fabricating a PCB assembly as in claim 1 , wherein said materials include copper and gold pastes, the epoxy, and solder mask material.

4. The system for fabricating a PCB assembly as in claim 3 , further comprising a unit configured to flip the PCB substrate to allow access to both sides of the PCB substrate by the printing station, curing station, and/or drilling station.

Assignees

• Io Tech Group Ltd

Inventors

• Zenou Michael
• Nesher Guy

Classifications

• B22F10/12

  by photopolymerisation, e.g. stereolithography [SLA] or digital light processing [DLP] · CPC title

• B22F12/63

  Rollers · CPC title

• B22F12/53

  Nozzles · CPC title

• B22F12/10

  Auxiliary heating means · CPC title

• B22F7/08

  with one or more parts not made from powder {(B22F7/062 takes precedence)} · CPC title