Light-emitting window element and motor vehicle comprising a light-emitting window element

Patent metadata

Field	Value
Publication number	US-12087743-B2
Application number	US-202017621060-A
Country	US
Kind code	B2
Filing date	Jul 30, 2020
Priority date	Aug 7, 2019
Publication date	Sep 10, 2024
Grant date	Sep 10, 2024

Abstract

A light-emitting window element includes a transparent first carrier layer, a transparent second carrier layer, a substrate with a plurality of light-emitting semiconductor chips arranged thereon, and an optical layer having an adjustable transparency. The substrate with the plurality of light-emitting semiconductor chips and the optical layer are arranged between the first and second carrier layers, and the first and second carrier layers, the substrate with the plurality of light-emitting semiconductor chips and the optical layer form a laminate composite.

First claim

The invention claimed is:

1. A light-emitting window element, comprising
a transparent first carrier layer and a transparent second carrier layer,
a substrate with a plurality of light-emitting semiconductor chips arranged thereon, and
an optical layer having an adjustable transparency,

wherein
the substrate with the plurality of light-emitting semiconductor chips and the optical layer are arranged between the first and second carrier layer,
the first and second carrier layer, the substrate with the plurality of light-emitting semiconductor chips and the optical layer form a laminate composite,
each of the light-emitting semiconductor chips has an area of less than or equal to 1 mm 2 , and
directly adjacent light-emitting semiconductor chips have a spacing of greater than or equal to 0.5 mm and less than or equal to 5 mm,
a first connection layer is arranged between the first carrier layer and the substrate and directly adjacent to the first carrier layer and the substrate, and
the transparent first carrier layer comprises glass and/or plastic.

2. The light-emitting window element according to claim 1 , wherein a second connection layer is arranged between the second carrier layer and the optical layer and directly adjacent to the second carrier layer and the optical layer.

3. The light-emitting window element according to claim 1 , wherein conductor tracks for electrically contacting the light-emitting semiconductor chips are applied to a side of the substrate opposite the optical layer.

4. The light-emitting window element according to claim 1 , wherein the light-emitting semiconductor chips are part of a matrix display.

5. The light-emitting window element according to claim 1 , wherein the optical layer comprises a plurality of segments having separately adjustable transparency.

6. The light-emitting window element according to claim 5 , wherein at least one of the light-emitting semiconductor chips is arranged on each of the segments.

7. The light-emitting window element according to claim 1 , wherein the optical layer comprises an electrochromic element, a thermochromic element or a liquid crystal element.

8. The light-emitting window element according to claim 1 , wherein the optical layer is applied on the substrate.

9. The light-emitting window element according to claim 1 , wherein a third connection layer is arranged between the optical layer and the substrate.

10. The light-emitting window element according to claim 1 , wherein the optical layer forms at least part of the substrate.

11. A motor vehicle comprising a light-emitting window element according to claim 1 , wherein the light-emitting window element is formed as a side window or rear window and the optical layer is arranged on a side of the light-emitting semiconductor chips facing an interior of the motor vehicle.

12. The motor vehicle comprising a light-emitting window element according to claim 1 , wherein the light-emitting window element is formed as a roof window and the optical layer is arranged on a side of the light-emitting semiconductor chips facing away from an interior of the motor vehicle.

13. A light-emitting window element, comprising
a transparent first carrier layer and a transparent second carrier layer,
a substrate with a plurality of light-emitting semiconductor chips arranged thereon comprising an epitaxially grown semiconductor layer sequence, and
an optical layer having an adjustable transparency,

wherein
the substrate with the plurality of light-emitting semiconductor chips and the optical layer are arranged between the first and second carrier layer,
the first and second carrier layer, the substrate with the plurality of light-emitting semiconductor chips and the optical layer form a laminate composite,
the optical layer comprises a plurality of segments having separately adjustable transparency,
a third connection layer is arranged between the optical layer and the substrate, and
the third connection layer comprises a bonding material selected from the group consisting of polyvinyl butyral, ethylene vinyl acetate, polyacrylate, polymethyl methacrylate, polyurethane, and combinations thereof.

14. A light-emitting window element, comprising
a transparent first carrier layer and a transparent second carrier layer,
a substrate with a plurality of light-emitting semiconductor chips arranged thereon, and
an optical layer having an adjustable transparency,

wherein
the substrate with the plurality of light-emitting semiconductor chips and the optical layer are arranged between the first and second carrier layer,
the first and second carrier layer, the substrate with the plurality of light-emitting semiconductor chips and the optical layer form a laminate composite,
a first connection layer is arranged between the first carrier layer and the substrate and directly adjacent to the first carrier layer and the substrate, and
a second connection layer is arranged between the second carrier layer and the optical layer and directly adjacent to the second carrier layer and the optical layer, and
the first and second connection layer are portions of a single continuous connection layer.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Dobner Andreas
• Halbritter Hubert

Classifications

• H10W90/794

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/792

  between multiple chips · CPC title

• H10W72/953

  not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/90

  Bond pads, in general · CPC title