Optical module

Patent metadata

Field	Value
Publication number	US-12085753-B2
Application number	US-202117481798-A
Country	US
Kind code	B2
Filing date	Sep 22, 2021
Priority date	May 21, 2020
Publication date	Sep 10, 2024
Grant date	Sep 10, 2024

Abstract

An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. A connecting line of two or more of bonding positions of the plurality of bonding wires on the circuit board bonding pads is inclined with respect to a connecting line of centers of the circuit board bonding pads.

First claim

What is claimed is:

1. An optical module, comprising:
a circuit board including a plurality of circuit board bonding pads;
a silicon optical chip including a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads, wherein
the plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board;
a chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires; and
a connecting line of two or more of bonding positions of the plurality of bonding wires on the circuit board bonding pads is inclined with respect to a connecting line of centers of the circuit board bonding pads.

2. The optical module according to claim 1 , wherein a connecting line of bonding positions of the plurality of bonding wires on the chip bonding pads is parallel to a connecting line of centers of the chip bonding pads.

3. The optical module according to claim 1 , wherein a connecting line of two or more of bonding positions of the plurality of bonding wires on the chip bonding pads is inclined with respect to a connecting line of centers of the chip bonding pads.

4. The optical module according to claim 1 , wherein
the plurality of chip bonding pads include at least one signal transmission chip bonding pad and at least one grounding chip bonding pad;
the plurality of circuit board bonding pads include at least one signal transmission circuit board bonding pad corresponding to the at least one signal transmission chip bonding pad and at least one grounding circuit board bonding pad corresponding to the at least one grounding chip bonding pad; and
a signal transmission chip bonding pad is electrically connected to at least one corresponding signal transmission circuit board bonding pad through the plurality of bonding wires, or a signal transmission circuit board bonding pad is electrically connected to at least one corresponding signal transmission chip bonding pad through the plurality of bonding wires.

5. The optical module according to claim 4 , wherein a signal transmission chip bonding pad is electrically connected to a corresponding signal transmission circuit board bonding pad through two bonding wires;
a connecting line of bonding positions of the two bonding wires on the signal transmission circuit board bonding pad is inclined with respect to the connecting line of the centers of the circuit board bonding pads, so that a height of a bonding wire located on a front side of the signal transmission circuit board bonding pad is different from a height of a bonding wire located on a rear side of the signal transmission circuit board bonding pad; and
the front side of the signal transmission circuit board bonding pad is a side thereof that is closer to the silicon optical chip than the connecting line of the centers of the circuit board bonding pads, and the rear side of the signal transmission circuit board bonding pad is a side thereof that is farther away from the silicon optical chip than the connecting line of the centers of the circuit board bonding pads.

6. The optical module according to claim 5 , wherein heights of the plurality of bonding wires whose bonding positions are located on the front side of each signal transmission circuit board bonding pad are same; and
heights of the plurality of bonding wires whose bonding positions are located on the rear side of each signal transmission circuit board bonding pad are same.

7. The optical module according to claim 5 , wherein a connecting line of bonding positions of the two bonding wires on the signal transmission chip bonding pad is parallel to a connecting line of centers of the chip bonding pads.

8. The optical module according to claim 5 , wherein a bonding position of one of the two bonding wires on the signal transmission chip bonding pad is located on a front side of the signal transmission chip bonding pad, and a bonding position of another of the two bonding wires on the signal transmission chip bonding pad is located on a rear side of the signal transmission chip bonding pad; and
the front side of the signal transmission chip bonding pad is a side thereof that is closer to the circuit board than a connecting line of centers of the chip bonding pads, and the rear side of the signal transmission chip bonding pad is a side thereof that is farther away from the circuit board than the connecting line of the centers of the chip bonding pads.

9. The optical module according to claim 5 , wherein a grounding circuit board bonding pad is electrically connected to a corresponding grounding chip bonding pad through four bonding wires, and bonding positions of two middle bonding wires on the grounding circuit board bonding pad and bonding positions of two bonding wires on both sides on the grounding circuit board bonding pad are distributed in two rows; and
a height of bonding wires located on a front side of the grounding circuit board bonding pad is different from a height of bonding wires located on a rear side of the grounding circuit board bonding pad.

10. The optical module according to claim 9 , wherein heights of the plurality of bonding wires whose bonding positions are located on the front side of each grounding circuit board bonding pad are same; and
heights of the plurality of bonding wires whose bonding positions are located on the rear side of each grounding circuit board bonding pad are same.

11. The optical module according to claim 9 , wherein a connecting line of bonding positions of the four bonding wires on the grounding chip bonding pad is parallel to a connecting line of centers of the chip bonding pads.

12. The optical module according to claim 9 , wherein bonding positions of the two middle bonding wires on the grounding chip bonding pad and bonding positions of the two bonding wires on the both sides on the grounding chip bonding pad are distributed in two rows.

13. The optical module according to claim 4 , wherein at least one signal transmission chip bonding pad is arranged alternatively with at least one grounding chip bonding pad, and at least one signal transmission circuit board bonding pad is arranged alternatively with at least one grounding circuit board bonding pad.

14. The optical module of claim 13 , wherein every two signal transmission chip bonding pads are arranged alternatively with the at least one grounding chip bonding pad, and every two signal transmission circuit board bonding pads are arranged alternatively with the at least one grounding circuit board bonding pad.

15. The optical module according to claim 14 , wherein bonding wires connecting every two adjacent signal transmission chip bonding pads and corresponding signal transmission circuit board bonding pads form a differential pair, and there are a grounding chip bonding pad and a grounding circuit board bonding pad between every two differential pairs;
a number of differential pairs is M, and a number of grounding chip bonding pads or a number of grounding circuit board bonding pads each is M minus 1 (M−1); and
M is an integer greater than 1.

16. The optical module according to claim 15 , wherein
in a structure including all differential pairs, there are two outermost differential pairs located on an outermost side of the structure, and there are a grounding chip bonding pad and a grounding c

Assignees

• Hisense Broadband Multimedia Technology Co Ltd

Inventors

• Zheng Long
• Yang Sigeng

Classifications

• H05K1/182

  associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] · CPC title

• H05K2201/10287

  Metal wires as connectors or conductors · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title