Thermal conductive member and heat dissipation structure including the same
US-2020031723-A1 · Jan 30, 2020 · US
US12083784B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12083784-B2 |
| Application number | US-201916970822-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 6, 2019 |
| Priority date | Mar 7, 2018 |
| Publication date | Sep 10, 2024 |
| Grant date | Sep 10, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A ceramic-metal temporary bonding body to inhibit breakage and degradation of a ceramic resin composite having low strength includes: a ceramic resin composite in which a non-oxide ceramic sintered body is impregnated with a thermosetting resin composition having cyanate groups in such a manner that a degree of cure calculated by differential scanning calorimetry is 5.0% or more and 70% or less; and a metal plate temporarily bonded to at least one surface of the ceramic resin composite. A shear bond strength between the ceramic resin composite and the metal plate is 0.1 MPa or more and 1.0 MPa or less.
Opening claim text (preview).
The invention claimed is: 1. A ceramic-metal temporary bonding body, comprising: a ceramic resin composite in which a non-oxide ceramic sintered body is impregnated with a thermosetting resin composition having cyanate groups in such a manner that a degree of cure calculated by differential scanning calorimetry is 5.0% or more and 70% or less; and a metal adherend temporarily bonded to only one surface of the ceramic resin composite, wherein a shear bond strength between the ceramic resin composite and the metal adherend is 0.1 MPa or more and 1.0 MPa or less. 2. An object to be transported, in which the ceramic-metal temporary bonding body described in claim 1 is wrapped with a packaging material. 3. A method for transporting a ceramic-metal temporary bonding body, the method comprising the steps of: placing in a transportation box the object described in claim 2 ; and transporting the transportation box. 4. The method according to claim 3 , wherein the object is placed in the transportation box together with a cushioning material to substantially prevent the ceramic-metal temporary bonding body from moving in the transportation box. 5. A method for producing a ceramic-metal temporary bonding body, the method comprising the steps of: preparing a ceramic resin composite by impregnating a non-oxide ceramic sintered body with a thermosetting resin composition having cyanate groups in such a manner that a degree of cure calculated by differential scanning calorimetry is 5.0% or more and 70% or less; applying a liquid compound with active hydrogen to at least one surface of the ceramic resin composite or a metal adherend having a ten-point average roughness of 20 μm or less; and bringing only one surface of the ceramic resin composite and the metal plate adherend in close contact with each other, and then applying a compressive load of 250 MPa or less at a temperature of 0° ° C. to 40° ° C. to temporarily bond the only one surface of the ceramic resin composite and the metal plate-adherend to each other in such a manner that a shear bond strength between the ceramic resin composite and the metal plate-adherend is 0.1 MPa or more and 1.0 MPa or less.
characterised by their materials · CPC title
Ceramics · CPC title
Shear strength · CPC title
Resistant to heat · CPC title
Ceramic · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.