Resin composition for printed circuit board, prepreg, resin composite sheet and metal foil clad laminate
US-2017238418-A1 · Aug 17, 2017 · US
Ceramic resin composite body
US10487013B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10487013-B2 |
| Application number | US-201716083035-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 10, 2017 |
| Priority date | Mar 10, 2016 |
| Publication date | Nov 26, 2019 |
| Grant date | Nov 26, 2019 |
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Abstract
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Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 μm and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and 65 to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180° C. or more and a curing rate of from 5 to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition.
First claim
Opening claim text (preview).
What is claimed is: 1. A ceramic-resin composite body comprising: from 35% by volume to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 μm to 60 μm and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and from 65% by volume to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180° C. or more and a curing rate of from 5% to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition. 2. The ceramic-resin composite body according to claim 1 , wherein the non-oxide ceramic sintered body comprises one or a combination of two or more selected from the group consisting of boron nitride, aluminum nitride, and silicon nitride. 3. The ceramic-resin composite body according to claim 1 , wherein the thermosetting resin composition has a melting temperature of 70° C. or more. 4. The ceramic-resin composite body according to claim 1 , wherein the thermosetting resin composition comprises a combination of one or both of a substance having at least one epoxy group and a substance having at least one cyanate group with one or both of a substance having at least one hydroxyl group and a substance having at least one maleimide group. 5. A thermally conductive insulating adhesive sheet obtained by processing the ceramic-resin composite according to claim 1 . 6. A circuit board comprising a metal circuit laminated on a metal plate via an insulating layer, wherein the thermally conductive insulating adhesive sheet according to claim 5 is used for the insulating layer. 7. A multilayer circuit board comprising two or more layers of insulating layers and metal circuits alternately laminated on a metal plate, wherein the thermally conductive insulating adhesive sheet according to claim 5 is used for the insulating layers. 8. An in-car power module structure comprising two or more electronic members bonded via the thermally conductive insulating adhesive sheet according to claim 5 . 9. A light emitting device comprising: the circuit board according to claim 6 ; and at least one LED provided on a metal circuit. 10. A light emitting device comprising: the multilayer circuit board according to claim 7 ; and at least one LED provided on a metal circuit.
Assignees
Inventors
Classifications
Processes characterised by the flow of gas · CPC title
comprising epoxy resins · CPC title
Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title
Treatment time · CPC title
Micrometer sized grains, i.e. from 1 to 100 micron · CPC title
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Frequently asked questions
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- What does patent US10487013B2 cover?
- Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a m…
- Who is the assignee on this patent?
- Denka Company Ltd
- What technology area does this patent fall under?
- Primary CPC classification C08K7/24. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Nov 26 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).