Mold compound dispensing system and method

Patent metadata

Field	Value
Publication number	US-12083715-B2
Application number	US-202117540371-A
Country	US
Kind code	B2
Filing date	Dec 2, 2021
Priority date	Dec 2, 2021
Publication date	Sep 10, 2024
Grant date	Sep 10, 2024

Abstract

A molding compound dispensing system identifies a semiconductor device strip having a substrate with a plurality of segments allocated for die stacks. The system obtains topological data of the identified semiconductor device strip for each of the segments, including data indicative of any semiconductor components in each respective segment. The system determines an amount of molding compound to be applied to each of the segments based on the topological data for each respective segment, and causes a molding compound dispenser to dispense the determined amounts of molding compound at each of the segments.

First claim

What is claimed is:

1. A method of controlling a molding compound dispenser, comprising:
at a controller having one or more processors and memory storing instructions for execution by the one or more processors:
identifying, using an electronic input device communicatively coupled to the controller, a semiconductor device strip comprising a substrate having a plurality of segments allocated for die stacks;
obtaining topological data of the identified semiconductor device strip for each of the plurality of segments, wherein the topological data includes data indicative of any semiconductor components in each respective segment;
determining a mold cap of the identified semiconductor device strip;
determining an amount of molding compound to be applied to each of the plurality of segments based on the topological data for each respective segment and the mold cap; and
causing a molding compound dispenser to dispense the determined amounts of molding compound at each of the respective segments.

2. The method of claim 1 , further comprising:
obtaining layout data of the identified semiconductor device strip, wherein the layout data indicates whether each of the plurality of segments includes an edge of the substrate or does not include an edge of the substrate;
wherein determining the amount of molding compound to be applied to each of the plurality of segments is further based on the layout data, wherein an amount of molding compound to be applied to a segment on an edge or corner of the substrate is greater than an amount of molding compound to be applied to a segment that is not on an edge or corner of the substrate.

3. The method of claim 1 , further comprising:
obtaining height data of the identified semiconductor device strip, wherein the height data indicates a stack height for each segment that is populated with a die stack;
wherein determining the amount of molding compound to be applied to each of the plurality of segments is further based on the height data, wherein an amount of molding compound to be applied to a segment having a first stack height is greater than an amount of molding compound to be applied to a segment having a second stack height greater than the first stack height.

4. The method of claim 1 , further comprising:
determining a two-dimensional surface area of the identified semiconductor device strip;
wherein determining the amount of molding compound to be applied to each of the plurality of segments is further based on the two-dimensional surface area.

5. The method of claim 1 , wherein:
causing the molding compound dispenser to dispense the determined amounts of molding compound at each of the respective segments includes causing the molding compound dispenser to dispense the determined amounts of molding compound on a plurality of segments of a release film, wherein each of the plurality of segments of the release film corresponds to one of the plurality of segments of the substrate; and
the method further comprises operating a compression molding device to apply the dispensed amounts of molding compound to corresponding segments of the plurality of segments of the substrate.

6. The method of claim 5 , wherein operating the compression molding device comprises:
transferring the release film including the dispensed amounts of molding compound to a bottom chase of a compression molding device; and
mounting the semiconductor device strip including the plurality of segments of the substrate to a top chase of the compression molding device;
wherein applying the dispensed amounts of molding compound to the corresponding segments of the plurality of segments of the substrate includes compressing the bottom chase and the top chase of the compression molding device.

7. The method of claim 1 , wherein causing the molding compound dispenser to dispense the determined amounts of molding compound at each of the respective segments comprises:
determining a dispensing duration for each of the plurality of segments, wherein dispensing durations are positively correlated to amounts of molding compound to be dispensed; and
instructing the molding compound dispenser to dispense molding compound at each of the plurality of segments in accordance with corresponding dispensing durations.

8. The method of claim 1 , wherein causing the molding compound dispenser to dispense the determined amounts of molding compound at each of the plurality of segments comprises:
determining a dispensing speed for each of the plurality of segments, wherein dispensing speeds are negatively correlated to amounts of molding compound to be dispensed; and
instructing the molding compound dispenser to dispense molding compound at each of the plurality of segments in accordance with corresponding dispensing speeds.

9. The method of claim 1 , wherein:
the topological data indicates whether each of the plurality of segments is populated with a die stack or is not populated with a die stack; and
an amount of molding compound to be applied to a segment that is not populated with a die stack is greater than an amount of molding compound to be applied to a segment that is populated with a die stack.

10. The method of claim 1 , wherein obtaining the topological data includes searching a database storing topological data of a plurality of semiconductor device strips.

11. A stacked die semiconductor device assembled according to the method of claim 1 .

12. A molding compound dispensing system including one or more processors and memory storing one or more programs to be executed by the one or more processors, the one or more programs including instructions for:
identifying, using an electronic input device communicatively coupled to the controller, a semiconductor device strip comprising a substrate having a plurality of segments allocated for die stacks;
obtaining topological data of the identified semiconductor device strip for each of the plurality of segments, wherein the topological data includes data indicative of any semiconductor components in each respective segment;
determining a mold cap of the identified semiconductor device strip;
determining an amount of molding compound to be applied to each of the plurality of segments based on the topological data for each respective segment and the mold cap; and
causing a molding compound dispenser to dispense the determined amounts of molding compound at each of the respective segments.

13. The molding compound dispensing system of claim 12 , wherein the one or more programs further include instructions for:
obtaining layout data of the identified semiconductor device strip, wherein the layout data indicates whether each of the plurality of segments includes an edge of the substrate or does not include an edge of the substrate;
wherein determining the amount of molding compound to be applied to each of the plurality of segments is further based on the layout data, wherein an amount of molding compound to be applied to a segment on an edge or corner of the substrate is greater than an amount of molding compound to be applied to a segment that is not on an edge or corner of the substrate.

14. The molding compound dispensing system of claim 12 , wherein the one or more programs further include instructions for:
obtaining height data of the identified semiconductor device strip, wherein the height data indicates a stack height for each segment that is populated with a die stack;
wherein determining the amount of molding compound to be applied to each of the plurality of segments is further based on the height data, wherein an amount of molding compound to be applied to a segm

Assignees

• Western Digital Tech Inc
• Morgan Lewis & Bockius Llp

Inventors

• Cui Xianlu
• Yan Junrong
• Chin C K
• Shi Tao

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/752

  between stacked chips · CPC title

• H10W90/291

  characterised by containers, encapsulations, or other housings for the stacked chips · CPC title

• H10W90/24

  at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape · CPC title

• H10W90/00

  Package configurations · CPC title