Adhesion force confirmation method and adhesion force confirmation device

Patent metadata

Field	Value
Publication number	US-12076889-B2
Application number	US-202017614042-A
Country	US
Kind code	B2
Filing date	Apr 13, 2020
Priority date	May 31, 2019
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

The present invention enables confirmation that a mold magnetically adhered by a magnetic clamping device has been magnetically adhered by a sufficient adhesion force so as not to be pulled off from the magnetic clamping device by a mold opening force of a mold handling device. A controller 7 carries out magnetization of a magnetic clamping device 10 such that a magnetic adhesion force weaker than that in normal magnetization is generated in a state where molds M1, M2 are bound together, and carries out a test to determine whether separation of the molds M1, M2 would occur when platens 2, 3 are separated. The controller issues a warning regarding lack of guaranteed adhesion force to an operator when separation is detected, and carries out normal magnetization of the magnetic clamping device 10 when separation is not detected.

First claim

The invention claimed is:

1. An adhesion force confirmation method for a mold handling device provided with a magnetic clamping device having a magnetizing coil, a reversible magnet whose magnetic poles are reversed according to a direction of electric current flowing in the magnetizing coil, and a non-reversible magnet on each of opposing plates proximate to or separated from each other, in which a mold is adhered and fixed to the opposing plates by a magnetic force of the reversible magnet and a magnetic force of the non-reversible magnet, comprising:
operating the mold handling device by applying an electric current of the magnetizing coil so that the magnetic clamping device exerts a magnetic adhesion force weaker than a normal magnetization, next separating the opposing plates, then conducting a test whether the mold peels from the opposing plates; and
when detecting peeling, issuing a warning to an operator that the adhesion force cannot be guaranteed, and otherwise, applying the electric current of the magnetizing coil so that the magnetic clamping device exerts the magnetic adhesion force by the normal magnetization.

2. The adhesion force confirmation method of claim 1 , the magnetic adhesion force weaker than the normal magnetization is achieved by controlling the electric current of the magnetizing coil to the electric current weaker than the normal magnetization.

3. The adhesion force confirmation method according to claim 1 , comprising:
determining whether the mold is a mold for which the test has already been conducted;
as a result of the above determination, in a case of the mold that has not been subjected to the test, conducting the test and measuring and storing a magnetic adhesion force during the test,
as a result of the above determination, in a case of the mold is a mold for which the test has already been conducted, conducting the normal magnetization, measuring a magnetic adhesion force at that time and comparing with the magnetic adhesion force during the test, then in a case that the measured magnetic adhesion force is less than the magnetic adhesion force during the test, issuing a warning to the operator that the adhesion force cannot be guaranteed.

4. An adhesion force confirmation device for a mold handling device provided with a magnetic clamping device having a magnetizing coil, a reversible magnet whose magnetic poles are reversed according to a direction of electric current flowing in the magnetizing coil, and a non-reversible magnet on each of opposing plates proximate to or separated from each other, in which a mold is adhered and fixed to the opposing plates by a magnetic force of the reversible magnet and a magnetic force of the non-reversible magnet, comprising:
an ignition circuit for controlling an amount of electric current of the magnetizing coil; and
a controller for controlling the magnetic clamping device or the mold handling device, and
wherein the controller controls the electric current of the magnetizing coil with the ignition circuit so that the magnetic clamping device exerts a magnetic adhesion force weaker than a normal magnetization, and
the controller is configured to conduct a test to determine whether the mold peels from the opposing plates by separating the opposing plates after operating the mold handling device, and
the controller is further configured such that when detecting peeling, a warning is issued to an operator that the adhesion force cannot be guaranteed, and otherwise, the controller controls the electric current of the magnetizing coil with the ignition circuit so that the magnetic clamping device exerts the magnetic adhesion force by the normal magnetization.

5. The adhesion force confirmation device of claim 4 , further comprising:
a sensor coil for measuring adhesion force of the magnetizing coil, and
wherein the controller determines whether the mold is a mold for which the test has already been conducted,
as a result of the determination, in a case of the mold that has not been subjected to the test, the controller is configured to conduct the test and measure and store a magnetic adhesion force with the sensor coil during the test, and
as a result of the determination, in a case of the mold is a mold for which the test has already been conducted, the controller is configured to conduct the normal magnetization, measuring a magnetic adhesion force with the sensor coil at that time and comparing with the magnetic adhesion force during the test, then in a case that the measured magnetic adhesion force is less than the magnetic adhesion force during the test, issuing a warning to the operator that the adhesion force cannot be guaranteed.

Assignees

• Kosmek Ltd

Inventors

• Akamatsu Hiroshi

Classifications

• B22D17/22

  Dies (manufacture, see the appropriate class, e.g. B23P15/24); Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies · CPC title

• B22D33/00

  Equipment for handling moulds · CPC title

• B22D17/32

  Controlling equipment · CPC title

• B22D17/26 Primary

  Mechanisms or devices for locking or opening dies · CPC title

• H01F7/16

  Rectilinearly-movable armatures (H01F7/17 takes precedence) · CPC title