Lithium titanate sintered plate
US-2020075933-A1 · Mar 5, 2020 · US
Circuit board assembly
US12074295B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12074295-B2 |
| Application number | US-202117188212-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 1, 2021 |
| Priority date | Oct 30, 2018 |
| Publication date | Aug 27, 2024 |
| Grant date | Aug 27, 2024 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A circuit board assembly includes a wiring board, a coin-type secondary cell that is a lithium secondary cell electrically connected to the wiring board by reflow soldering, and a wireless communication device electrically connected to the wiring board. The coin-type secondary cell includes a positive electrode including a sintered body, a negative electrode including a sintered body, an electrolyte layer provided between the positive electrode and the negative electrode, and a cell case having an enclosed space in which the positive electrode, the negative electrode, and the electrolyte layer are housed. When C is given as the capacity of the positive electrode and A is given as the capacity of the negative electrode, 1.03<C/A<1.60 is satisfied.
First claim
Opening claim text (preview).
The invention claimed is: 1. A circuit board assembly comprising: a wiring board; a coin-type secondary cell that is a lithium secondary cell electrically connected to said wiring board by reflow soldering; and a wireless communication device electrically connected to said wiring board, wherein said coin-type secondary cell includes: a positive electrode including a sintered body, said positive electrode containing neither binders nor conductive assistants; a negative electrode including a sintered body, said negative electrode containing neither binders nor conductive assistants; an electrolyte layer provided between said positive electrode and said negative electrode; and a cell case having an enclosed space in which said positive electrode, said negative electrode, and said electrolyte layer are housed, and 1.03<C/A<1.60 is satisfied, where C is a capacity of said positive electrode and A is a capacity of said negative electrode. 2. The circuit board assembly according to claim 1 , wherein said wiring board has no electronic components that are placed after the reflow soldering. 3. The circuit board assembly according to claim 1 , wherein electrical connection between wiring on said wiring board and all electronic components that are connected to said wiring is established by reflow soldering on said wiring board. 4. The circuit board assembly according to claim 1 , wherein said coin-type secondary cell has a thickness of 0.7 to 1.6 mm and a diameter of 10 to 20 mm. 5. The circuit board assembly according to claim 1 , wherein said positive electrode includes a lithium composite oxide sintered body, and said negative electrode includes a titanium-containing sintered body.
Assignees
Inventors
Classifications
- H01M50/528Primary
Fixed electrical connections, i.e. not intended for disconnection · CPC title
Current conducting connections for cells or batteries · CPC title
Printed or non-printed battery · CPC title
associated with surface mounted components · CPC title
of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators · CPC title
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Frequently asked questions
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- What does patent US12074295B2 cover?
- A circuit board assembly includes a wiring board, a coin-type secondary cell that is a lithium secondary cell electrically connected to the wiring board by reflow soldering, and a wireless communication device electrically connected to the wiring board. The coin-type secondary cell includes a positive electrode including a sintered body, a negative electrode including a sintered body, an electr…
- Who is the assignee on this patent?
- Ngk Insulators Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01M50/528. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 27 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).