Ground termination with dampened resonance
US-9210812-B2 · Dec 8, 2015 · US
US2016181671A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016181671-A1 |
| Application number | US-201414574913-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 18, 2014 |
| Priority date | Dec 18, 2014 |
| Publication date | Jun 23, 2016 |
| Grant date | — |
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Systems and methods are provided for battery cells including solid electrolytes. Solid electrolyte cells may be integrated with electronic devices. For example, a solid electrolyte cell may be integrated with a metal surface of a circuit board or an electrically conductive surface of a chassis. Surface-mountable solid electrolyte cells may be electrically coupled to circuit traces using, for example, a reflow soldering process.
Opening claim text (preview).
1 . A device comprising: a double sided circuit board including a first metal layer and a second metal layer separated by a non-conductive substrate; and a battery cell integrated with the double sided circuit board, the battery cell including: a first electrode comprising the second metal layer of the double sided circuit board; a first solid electrolyte layer adjacent to the second metal layer; a separator layer adjacent to the first solid electrolyte layer; a second solid electrolyte layer adjacent to the separator layer; and a second electrode adjacent to the second solid electrolyte layer. 2 . The device of claim 1 , wherein at least one of the first solid electrolyte layer and the second solid electrolyte layer comprises a solid polymer or ceramic material. 3 . The device of claim 1 , wherein the separator comprises a solid polymer or ceramic material configured to prevent electrical short circuits between the first solid electrolyte layer and the second solid electrolyte layer, and to allow for transport of electronic charge carriers between the first solid electrolyte layer and the second solid electrolyte layer during passage of current from the first electrode to the second electrode in the battery cell. 4 . The device of claim 1 , wherein first electrode comprises a negative electrode and the second electrode comprises a positive electrode of the battery cell, and wherein the first solid electrolyte layer comprises a solid anode electrolyte material and the second solid electrolyte layer comprises a solid cathode electrolyte material. 5 . The device of claim 1 , wherein first electrode comprises a positive electrode and the second electrode comprises a negative electrode of the battery cell, and wherein the first solid electrolyte layer comprises a solid cathode electrolyte material and the second solid electrolyte layer comprises a solid anode electrolyte material. 6 . The device of claim 1 , wherein the first metal layer and the second metal layer comprise copper. 7 . The device of claim 1 , wherein the first metal layer comprises circuit traces. 8 . The device of claim 7 , further comprising a plurality of circuit components electrically coupled to the circuit traces. 9 . The device of claim 7 , further comprising: a first electrical connection coupling a first trace of the first metal layer to the first electrode; and a second electrical connection coupling a second trace of the first metal layer to the second electrode. 10 . The device of claim 9 , wherein at least one of the first electrical connection and the second electrical connection comprises an electrically conductive via through the non-conductive substrate of the double sided circuit board. 11 . The device of claim 9 , wherein at least one of the first electrical connection and the second electrical connection pass around an outside edge of the non-conductive substrate of the double sided circuit board. 12 . The device of claim 1 , further comprising an encapsulation layer at least partially enclosing the battery cell. 13 . A mobile electronic device, comprising: a chassis comprising an electrically conductive surface; one or more electrical components on or within the chassis; and a solid electrolyte battery integrated with the chassis and configured to provide electrical current to the one or more electrical components, the solid electrolyte battery comprising: a first electrode comprising the electrically conductive surface of the chassis; a first solid electrolyte layer overlying the electrically conductive surface of the chassis; a separator layer overlying the first solid electrolyte layer; a second solid electrolyte layer overlying the separator layer; and a second electrode overlying the second solid electrolyte layer. 14 . The mobile electronic device of claim 13 , wherein at least one of the first solid electrolyte layer and the second solid electrolyte layer comprises a solid polymer or ceramic material. 15 . The mobile electronic device of claim 13 , wherein the separator comprises a solid polymer or ceramic material configured to prevent electrical short circuits between the first solid electrolyte layer and the second solid electrolyte layer, and to allow for transport of electronic charge carriers between the first solid electrolyte layer and the second solid electrolyte layer during passage of current from the first electrode to the second electrode in the solid electrolyte battery. 16 . The mobile electronic device of claim 13 , further comprising an encapsulation layer at least partially enclosing the solid electrolyte battery. 17 . A method for manufacturing a circuit board, comprising: providing a battery cell comprising at least one solid electrolyte, a positive electrode, and a negative electrode, wherein the positive electrode and negative electrode are configured for surface mounting; placing the battery cell on a surface of the circuit board; and electrically coupling, using a reflow soldering process, the positive electrode to a first electrically conductive trace and the negative electrode to a second electrically conductive trace on the surface of the circuit board. 18 . The method of claim 17 , wherein the at least one solid electrolyte comprises a solid anode electrolyte material and a solid cathode electrolyte material. 19 . A method for manufacturing a circuit board including a first metal layer and a second metal layer separated by a non-conductive substrate, the method comprising: depositing a first solid electrolyte layer on the second metal layer; depositing a separator layer over the first solid electrolyte layer; depositing a second solid electrolyte layer over the separator layer; and depositing an electrode over the second solid electrolyte layer. 20 . The method of claim 19 , further comprising: creating a first electrical connection between a first portion of the first metal layer and the second metal layer; and creating a second electrical connection between a second portion of the first metal layer and the electrode. 21 . The method of claim 19 , further comprising depositing an encapsulation layer over the electrode. 22 . The method of claim 19 , further comprising: forming circuit traces in the first metal layer; and electrically coupling a plurality of electrical components to the circuit traces using a reflow soldering process.
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