Solid state lithium ion rechargeable battery

Patent metadata

Field	Value
Publication number	US-12068477-B2
Application number	US-201916679369-A
Country	US
Kind code	B2
Filing date	Nov 11, 2019
Priority date	Nov 11, 2019
Publication date	Aug 20, 2024
Grant date	Aug 20, 2024

Abstract

A method of forming a solid-state lithium ion rechargeable battery may include depositing a metal layer onto a top surface of a substrate, depositing a handle layer onto a top surface of the metal layer, wherein a portion of the handle layer overlaps the metal layer and the substrate, spalling a portion of the substrate thereby forming a spalled substrate layer, porosifying the spalled substrate layer thereby forming a porous substrate layer, depositing an electrolyte layer onto a top surface of the porous substrate layer, wherein the electrolyte layer is in direct contact with the porous substrate layer, and depositing a cathode onto a top surface of the electrolyte layer. The method may include depositing a cathode contact layer onto a top surface of the cathode, wherein the cathode contact layer is in direct contact with the cathode. The porous substrate layer may be made of silicon.

First claim

What is claimed is:

1. A structure comprising:
a porous substrate layer positioned along a metal layer having a given stress value and a first thickness corresponding to controlled spalling, wherein the porous substrate layer is made of p-type doped silicon, wherein the first thickness of the metal layer is less than a second thickness associated with spontaneous spalling of the porous substrate layer, wherein at least a portion of the porous substrate layer is spalled and at least a portion of the porous substrate layer is non-spalled, and wherein the non-spalled portion of the porous substrate layer contains fewer lithium ions than the spalled portion of the porous substrate layer;
a handle layer positioned below the metal layer, wherein the handle layer is configured to initiate a spalling mode fracture in the porous substrate layer based on applying a force on the handle layer;
an electrolyte layer positioned along the porous substrate layer; and
a cathode positioned on top of the electrolyte layer, wherein the electrolyte layer has a third thickness configured to provide ion conductivity between the cathode and the porous substrate layer without holes in the electrolyte layer, and wherein the electrolyte layer separates the cathode from the porous substrate layer.

2. The structure of claim 1 , wherein the handle layer is composed of a metal tape and extends past an edge of the metal layer, and wherein the metal layer separates the handle layer from the porous substrate layer.

3. The structure of claim 1 , wherein the metal layer is made of non-reactive metal having high tensile strength.

4. The structure of claim 1 , wherein the porous substrate layer is an anode.

5. The structure of claim 1 , further comprising:
an anode contact layer on top of the porous substrate layer.

6. The structure of claim 1 , wherein the cathode and the metal layer are porous.

7. The structure of claim 1 , further comprising a cathode contact layer positioned on top of the cathode.

Assignees

• IBM

Inventors

• Sadana Devendra K
• Bedell Stephen W
• De Souza Joel P
• Collins John

Classifications

• H01M4/0402

  Methods of deposition of the material · CPC title

• H01M4/1395

  of electrodes based on metals, Si or alloys · CPC title

• H01M4/366

  as layered products · CPC title

• H01M4/80

  Porous plates, e.g. sintered carriers · CPC title

• H01M4/661

  Metal or alloys, e.g. alloy coatings (H01M4/669 take precedence) · CPC title