Two-component solvent-less adhesive composition

US12054652B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12054652-B2
Application numberUS-202017436434-A
CountryUS
Kind codeB2
Filing dateMar 4, 2020
Priority dateMar 5, 2019
Publication dateAug 6, 2024
Grant dateAug 6, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component and (B) a polyol component containing a poly-ester-amide polycarbonate polyol. The present disclosure also provides a method of forming a two-component solvent-less adhesive composition.

First claim

Opening claim text (preview).

We claim: 1. A two-component solvent-less adhesive composition comprising the reaction product of: (A) an isocyanate component; and (B) a polyol component comprising a polyester-amide polycarbonate polyol. 2. The two-component solvent-less adhesive composition of claim 1 , wherein the polyol component further comprises a phosphate-terminated polyol. 3. The two-component solvent-less adhesive composition of claim 1 , wherein the polyester-amide polycarbonate polyol has a number average molecular weight (Mn) from 500 g/mol to 8,000 g/mol. 4. The two-component solvent-less adhesive composition of claim 1 , wherein the polyester-amide polycarbonate polyol comprises less than 55 wt % species having a weight average molecular weight (Mw) less than 500 g/mol. 5. The two-component solvent-less adhesive composition of claim 2 , wherein the polyol component comprises from 0.5 wt % to 35 wt % phosphate-terminated polyol, based on the total weight of the polyol component. 6. The two-component solvent-less adhesive composition of claim 1 , wherein the isocyanate component is an aliphatic isocyanate prepolymer. 7. The two-component solvent-less adhesive composition of claim 2 , wherein the phosphate-terminated polyol has the Structure (C) wherein R 4 is selected from the group consisting of an ether group and a substituted ether group. 8. A laminate comprising a first substrate; a second substrate; and an adhesive layer between the first substrate and the second substrate, the adhesive layer formed from the two-component solvent-less adhesive composition of claim 1 . 9. The laminate of claim 8 , wherein the first substrate is a metal foil film and the second substrate is a polypropylene film; and the laminate has a bond strength after chemical aging from 0.50 N/2.54 cm to 5.0 N/2.54 cm. 10. The laminate of claim 8 , wherein the first substrate is a polyethylene terephthalate film; and the laminate has a bond strength after the boil-in-bag test from 3.5 N/2.54 cm to 10.0 N/2.54 cm. 11. A method of forming a two-component solvent-less adhesive composition comprising: (A) providing a polyol component comprising a polyester-amide polycarbonate polyol; (B) providing an isocyanate component; and (C) reacting the polyol component with the isocyanate component to form the two-component solvent-less adhesive composition. 12. The method of claim 11 comprising providing the polyol component comprising (i) the polyester-amide polycarbonate polyol; and (ii) a phosphate-terminated polyol.

Assignees

Inventors

Classifications

  • containing nitrogen · CPC title

  • Phosphate compounds · CPC title

  • using two or more compounds having active hydrogen in the first polymerisation step · CPC title

  • comprising polyesters · CPC title

  • comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)} · CPC title

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What does patent US12054652B2 cover?
The present disclosure provides a two-component solvent-less adhesive composition. The two-component solvent-less adhesive composition contains the reaction product of (A) an isocyanate component and (B) a polyol component containing a poly-ester-amide polycarbonate polyol. The present disclosure also provides a method of forming a two-component solvent-less adhesive composition.
Who is the assignee on this patent?
Dow Global Technologies Llc, Rohm & Haas
What technology area does this patent fall under?
Primary CPC classification C09J175/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 06 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).