Electronic device having connector

Patent metadata

Field	Value
Publication number	US-12051850-B2
Application number	US-201917594500-A
Country	US
Kind code	B2
Filing date	Apr 25, 2019
Priority date	Apr 25, 2019
Publication date	Jul 30, 2024
Grant date	Jul 30, 2024

Abstract

An electronic device according to the present invention can comprise: a first multilayered printed circuit board (PCB) including a transmitting/receiving unit circuit; a second multilayered PCB including an antenna; and a connector for connecting the first multilayered PCB and the second multilayered PCB to each other, and thus the present invention provides a connector and an electronic device that are capable of reducing an insertion loss when an antenna and a transmitting/receiving circuit are vertically connected in a millimeter-wave band.

First claim

The invention claimed is:

1. An electronic device, comprising:
a first multilayered printed circuit board (PCB) including a transceiver circuit;
a second multilayered PCB including antennas; and
a connector to connect the first multilayered PCB and the second multilayered PCB, wherein an uppermost layer of the first multilayered PCB is configured to include a first connector contact points and a second connector contact points,
the connector is configured to include a ground port connected with ground patterns of the uppermost layer of the first multilayered PCB by the first connector contact points, and
the second connector contact points connected with the connector is implemented in a floating metal pattern which is disconnected with the ground pattern.

2. The electronic device of claim 1 , wherein each of the first and second multilayered PCBs includes ground patterns constituting a ground vertical-connection between different layers,
wherein the floating metal pattern is not connected with the ground patterns of the uppermost layer of the first multilayered PCB, and
wherein the floating metal pattern is connected to a plurality of floating metal patterns of the connector.

3. The electronic device of claim 2 , wherein the ground patterns each comprises:
ground pads on which ground vias for the ground vertical-connection are disposed; and
a ground line connecting the ground pads.

4. The electronic device of claim 3 , wherein the ground patterns are formed on the same position of different layers of the first and second multilayered PCBs, and
wherein a window region from which a metal pattern is removed is formed between adjacent ground patterns on the same position of the different layers of the first and second multilayered PCBs.

5. The electronic device of claim 4 , wherein the ground pattern is formed in plurality to correspond to a plurality of ground terminals of the connector,
wherein a signal transmission line is disposed between the plurality of ground patterns, and
wherein a length of a signal line of the signal transmission line is the same as a length of a ground pad of the ground pattern.

6. The electronic device of claim 5 , wherein the ground pad includes first and second circular ground pads each having the same circular shape as that of the ground via, and
wherein each of the first and second circular ground pads is connected to the ground line having a width narrower than a diameter of the ground pad.

7. The electronic device of claim 1 , wherein the first and second multilayered PCBs include a signal transmission line constituting a vertical connection for a signal transmission between different layers.

8. The electronic device of claim 7 , wherein the signal transmission line comprises:
a signal pad on which signal vias for the vertical connection for the signal transmission are disposed; and
a signal line connected to the signal pad, having a width narrower than a diameter of the signal pad, and extending by a predetermined length.

9. The electronic device of claim 1 , further comprising a transceiver circuit configured to receive signals from the antennas through different signal terminals of the connector or transmit signals to the antennas through the different signal terminals of the connector.

10. The electronic device of claim 9 , further comprising a baseband processor to control a first reception signal and a second reception signal received from the antennas to the transceiver circuit through the different signal terminals of the connector.

11. The electronic device of claim 10 , wherein the baseband processor controls the transceiver circuit to perform Multi Input Multi Output (MIMO) by simultaneously receiving the first reception signal and the second reception signal for a specific time interval using horizontal/vertical (HN) polarization of the antennas.

12. The electronic device of claim 10 , wherein each of a first connecting portion connected to the first multilayered PCB and a second connecting portion connected to the second multilayered PCB comprises eight terminals, and
wherein the baseband processor controls the transceiver circuit to perform MIMO through a first array antenna including four antennas connected four of the eight terminals of the second connecting portion and a second array antenna including four antennas connected to remaining four terminals of the second connecting portion.

13. A connector device comprising:
a first connecting portion having a plurality of terminals to be connected to a first multilayered printed circuit board (PCB); and
a second connecting portion having a plurality of terminals to be connected to a second multilayered PCB,
wherein signal transmission lines of the first multilayered PCB and the second multilayered PCB are vertically connected to each other by the first connecting portion and the second connecting portion, to transmit Radio Frequency (RF) signals,
wherein an uppermost layer of the first multilayered PCB is configured to include a first connector contact points and a second connector contact points,
the connector is configured to include a ground port connected with ground patterns of the uppermost layer of the first multilayered PCB by the first connector contact points, and
the second connector contact points connected with the connector is implemented in a floating metal pattern which is disconnected with the ground pattern.

14. The connector device of claim 13 , wherein a transceiver circuit is disposed on the first multilayered PCB, and antennas are disposed on the second multilayered PCB, and
wherein the first and second multilayered PCBs comprise ground patterns constituting a ground vertical-connection between different layers.

15. The connector device of claim 14 , wherein the ground patterns each comprises:
ground pads on which ground vias for the ground vertical-connection are disposed; and
a ground line connecting the ground pads.

16. The connector of claim 15 , wherein the ground patterns are formed on the same position of different layers of the first and second multilayered PCBs, and
wherein a window region from which a metal pattern is removed is formed between adjacent ground patterns on the same position of the different layers of the first and second multilayered PCBs.

17. The connector device of claim 16 , wherein the ground pattern is formed in plurality to correspond to a plurality of ground terminals of the connector,
wherein a signal transmission line is disposed between the plurality of ground patterns, and
wherein a length of a signal line of the signal transmission line is the same as a length of the ground pad of the ground pattern.

18. The connector device of claim 17 , wherein the ground pad includes first and second circular ground pads each having the same circular shape as that of the ground via, and
wherein each of the first and second circular ground pads is connected to the ground line having a width narrower than a diameter of the ground pad.

19. The connector device of claim 14 , wherein the first and second multilayered PCBs each includes a signal transmission line constituting a vertical connection for a signal transmission between different layers.

20. The connector device of claim 19 , wherein the signal transmission line comprises:
a signal pad on which signal vias for the vertical connection for the signal transmission are disposed; and
a signal line connected to the signal pad, having a width narrower than a diameter of the signal pad

Assignees

• Lg Electronics Inc

Inventors

• Lee Joohee
• Ryu Seungwoo
• Jung Junyoung

Classifications

• H04B7/0469

  taking special antenna structures, e.g. cross polarized antennas into account · CPC title

• H01Q1/48

  Earthing means; Earth screens; Counterpoises · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q21/061 Primary

  Two dimensional planar arrays · CPC title

• H01Q21/0006

  Particular feeding systems · CPC title