Space-saving high-density modular data systems and energy-efficient cooling systems

US12048128B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12048128-B2
Application numberUS-201715701093-A
CountryUS
Kind codeB2
Filing dateSep 11, 2017
Priority dateJun 23, 2010
Publication dateJul 23, 2024
Grant dateJul 23, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

First claim

Opening claim text (preview).

What is claimed is: 1. A modular data pod system, comprising: computer racks arranged to form a first volume between an inner surface of wall members of an enclosure and first sides of the computer racks and a second volume formed of second sides of the computer racks; a computer rack covering member configured to enclose the second volume; a data pod covering member forming a third volume coupling the first volume to the second volume; an air circulator configured to continuously circulate air through the first, second, and third volumes; a heat exchange member in air communication with the air circulator and with the first, second, and third volumes; and a cooling system in fluid communication with the heat exchange member, the cooling system including: a free cooling system configured to cool a first refrigerant flowing through the heat exchange member using cooling water and atmospheric air; and a mechanical cooling system separate from and coupled to the free cooling system, the mechanical cooling system configured to cool the first refrigerant flowing through the heat exchange member using a second refrigerant. 2. The modular data pod system according to claim 1 , further comprising a variable fan drive, wherein the variable fan drive varies the speed of the air circulator depending on environmental conditions associated with the modular data pod system. 3. The modular data pod according to claim 1 , wherein the heat exchange member is disposed adjacent to the third volume. 4. The modular data pod system according to claim 1 , wherein the heat exchange member is disposed adjacent to the air circulator. 5. The modular data pod system according to claim 1 , further comprising a dedicated electrical power supply electrically coupled to the computer racks. 6. The modular data pod system according to claim 1 , wherein the cooling system is disposed external to the enclosure. 7. The modular data pod system according to claim 1 , wherein the mechanical cooling system is configured to cool the first refrigerant flowing through the heat exchange member as a function of an amount by which the free cooling system has exceeded its maximum cooling-capacity.

Assignees

Inventors

Classifications

  • within cabinets for removing heat from server blades · CPC title

  • Air circulating in closed loop within cabinets · CPC title

  • Cooling means · CPC title

  • within cabinets for removing heat from server blades · CPC title

  • Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces · CPC title

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What does patent US12048128B2 cover?
A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modula…
Who is the assignee on this patent?
Inertech Ip Llc
What technology area does this patent fall under?
Primary CPC classification H05K7/20827. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 23 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).