Space-saving high-density modular data systems and energy-efficient cooling systems

Patent metadata

Field	Value
Publication number	US-9763366-B2
Application number	US-201113338939-A
Country	US
Kind code	B2
Filing date	Dec 28, 2011
Priority date	Jun 23, 2010
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

First claim

What is claimed is:

1. A modular data pod, comprising:
a first enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member;
a plurality of computer racks arranged within the first enclosure to form a first volume between the inner surface of the wall members and first sides of the computer racks and a second volume formed of second sides of the computer racks;
a computer rack covering member enclosing the second volume, the computer rack covering member and the data pod covering member forming a third volume coupling the first volume to the second volume;
an air circulator, wherein the air circulator continuously circulates air through the first, second, and third volumes; and
an auxiliary enclosure disposed adjacent an external surface of at least one wall member of the first enclosure, wherein the first enclosure is disposed external to the auxiliary enclosure and the auxiliary enclosure is separate and distinct from the first enclosure, the auxiliary enclosure including a cooling system disposed therein, the cooling system comprising:
a first fluid circuit in thermal communication with the first enclosure;
a second fluid circuit in thermal communication with the first fluid circuit;
a condenser in fluid communication with the first and second fluid circuits;
a third fluid circuit in thermal communication with the second fluid circuit and
a trim condenser in fluid communication with the second and third fluid circuits.

2. The modular data pod according to claim 1 , wherein in a plan view, the polygon is a hexagon or an octagon.

3. The modular data pod according to claim 2 , wherein at least two of the wall members have different lengths from remaining wall members.

4. The modular data pod according to claim 1 , wherein the plurality of computer racks are arranged in a U-shape, circular shape, or elliptical shape.

5. The modular data pod according to claim 1 , wherein the air circulator is coupled to the computer rack covering member.

6. The modular data pod according to claim 1 , further comprising a variable fan drive, wherein the variable fan drive varies the speed of the air circulator depending on environmental conditions associated with the modular data pod.

7. The modular data pod according to claim 1 , further comprising a heat exchange member disposed in the first volume adjacent to the plurality of computer racks.

8. The modular data pod according to claim 7 , further comprising a second heat exchange member disposed in the third volume.

9. The modular data pod according to claim 8 , wherein the second heat exchange member is disposed adjacent to the air circulator.

10. The modular data pod according to claim 1 , further comprising a dedicated electrical power supply electrically coupled to the plurality of computer racks.

11. A method of cooling a plurality of computer racks, comprising:
arranging a plurality of computer racks within a first enclosure having the shape of a polygon to form a first volume between wall members of the first enclosure and first sides of the plurality of computer racks and to form a second volume between second sides of the computer racks;
enclosing the second volume to form a third volume coupling the first volume to the second volume;
disposing an auxiliary enclosure adjacent an external surface of at least one wall member of the first enclosure, wherein the first enclosure is disposed external to the auxiliary enclosure and the auxiliary enclosure is separate and distinct from the first enclosure;
circulating air between the first volume and the second volume via the third volume and the computer racks; and
cooling the air via a cooling system disposed within the auxiliary enclosure, the cooling system comprising:
a first fluid circuit in thermal communication with the first enclosure;
a second fluid circuit in thermal communication with the first fluid circuit;
a condenser in fluid communication with the first and second fluid circuits;
a third fluid circuit in thermal communication with the second fluid circuit; and
a trim condenser in fluid communication with the second and third fluid circuits.

12. The method according to claim 11 , wherein circulating air through the first, second, and third volumes includes varying the speed of the air depending on environmental conditions.

13. The method according to claim 11 , further comprising disposing a heat exchange member in the first volume adjacent to the plurality of computer racks.

14. The method according to claim 13 , further comprising disposing a second heat exchange member in the third volume.

15. The modular data pod according to claim 1 , wherein the wall members of the first enclosure are side wall members, and
wherein the auxiliary enclosure is disposed adjacent to an external surface of at least one side wall member of the first enclosure.

Assignees

• Keisling Earl
• Costakis John
• Mcdonnell Gerald
• Inertech Ip Llc

Inventors

• Keisling Earl
• Costakis John
• Mcdonnell Gerald

Classifications

• H05K7/20763

  Liquid cooling without phase change · CPC title

• H05K7/20827 Primary

  within rooms for removing heat from cabinets, e.g. air conditioning devices · CPC title

• H05K7/20818

  within cabinets for removing heat from server blades · CPC title

• H05K7/20754

  Air circulating in closed loop within cabinets · CPC title

• F28D15/00

  Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls {; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies (F28D17/00, F28D19/00, F28D20/00 take precedence)} · CPC title