Electronic circuit production method using 3D layer shaping

Patent metadata

Field	Value
Publication number	US-12048102-B2
Application number	US-201917630860-A
Country	US
Kind code	B2
Filing date	Jul 30, 2019
Priority date	Jul 30, 2019
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

To provide an electronic circuit production method using 3D layer shaping capable of producing an electronic circuit having improved electrical properties and mechanical properties by utilizing characteristics of a fluid containing a metal particle by selectively using the fluid containing the metal particle. The electronic circuit production method using 3D layer shaping, the method including a wiring forming step of forming a wiring by applying a fluid containing a nano-sized metal nanoparticle on an insulating member and curing the applied fluid containing the metal nanoparticle; and a connection terminal forming step of forming a connection terminal electrically connected to the wiring by applying a fluid containing a micro-sized metal microparticle and curing the applied fluid containing the metal microparticle.

First claim

The invention claimed is:

1. An electronic circuit production method using 3D layer shaping, the method comprising:
an insulating layer forming step of forming an insulating layer by repeatedly discharging an ultraviolet curable resin, flattening the ultraviolet curable resin, and curing the ultraviolet curable resin, the insulating layer including an accommodation section in which an electronic component may be disposed, the accommodation section being a recess defined by a bottom surface and side walls;
a wiring forming step of forming a wiring by applying a first fluid containing a nano-sized metal nanoparticle on the insulating layer and curing the applied first fluid containing the metal nanoparticle; and
a connection terminal forming step of forming a connection terminal electrically connected to the wiring by applying a second fluid containing a micro-sized metal microparticle and curing the applied second fluid containing the metal microparticle, wherein
the first fluid and the second fluid are different from each other, a viscosity of the first fluid being lower than a viscosity of the second fluid,
the first fluid is applied using an ink jet head, and the second fluid is applied using a dispenser or a printing device,
the second fluid containing the metal microparticle is a viscous fluid in which the metal microparticle is contained in an adhesive made of a resin,
in the connection terminal forming step, multiple metal microparticles are brought into contact with each other to be cured by curing the adhesive,
in the wiring forming step, multiple metal nanoparticles are fused to each other to cure by heating the first fluid containing the metal nanoparticle, and
in the connection terminal forming step, the connection terminal includes a first connection terminal provided on the bottom surface of the accommodation section to be connected to the electronic component disposed in the accommodation section, a second connection terminal that connects an electronic circuit of the insulating layer and an external device, and a third connection terminal that connects a probe pin connecting electronic circuits of multiple insulating layers to each other to the electronic circuit of the insulating layer.

2. The electronic circuit production method using 3D layer shaping according to claim 1 , wherein
after the wiring forming step is executed to form the wiring, the second fluid containing the metal microparticle is applied to the formed wiring, and the applied second fluid containing the metal microparticle is cured to form the connection terminal.

3. The electronic circuit production method using 3D layer shaping according to claim 1 , wherein
in the wiring forming step, the wiring drawn out from a position covered with the first connection terminal and is away from directly below the first component terminal as a starting point is formed.

4. The electronic circuit production method using 3D layer shaping according to claim 1 , wherein
in the wiring forming step, the wiring drawn out from a position covered with the first connection terminal and directly below the first component terminal is formed.

5. The electronic circuit production method using 3D layer shaping according to claim 1 , wherein
each of the first connection terminal and the second connection terminal is formed so as to cover a part of the wiring from above, and
a ratio of a portion of the wiring covered with the first connection terminal to the entire first connection terminal is smaller than a ratio of a portion of the wiring covered with the second connection terminal to the entire second connection terminal.

Assignees

• Fuji Corp

Inventors

• Tominaga Ryojiro
• Tsukada Kenji
• Sakakibara Ryo
• Takeuchi Tasuku

Classifications

• H05K2203/0776

  Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773 · CPC title

• H05K3/40

  Forming printed elements for providing electric connections to or between printed circuits · CPC title

• H05K2201/0391

  Using different types of conductors · CPC title

• H05K1/186

  manufactured by mounting on or connecting to patterned circuits before or during embedding · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title