Pressure sintering device and method for manufacturing an electronic component

Patent metadata

Field	Value
Publication number	US-12046576-B2
Application number	US-202017435752-A
Country	US
Kind code	B2
Filing date	Feb 27, 2020
Priority date	Mar 4, 2019
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die is disclosed. The upper the die and/or the lower die is provided with a first pressure pad, wherein the method includes the following steps: placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate; joining the sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the sintering device is simultaneously heated.

First claim

What is claimed is:

1. A method for manufacturing an electronic component by a pressure-assisted low-temperature sintering process, by using a pressure sintering device having an upper die and a lower die, wherein the upper die and/or the lower die is provided with a first pressure pad, wherein the method comprises the following steps:
placing a first sinterable component on a first sintering layer provided on a top layer of a first substrate to provide a first formable electronic component;
joining the first sinterable component and the top layer of the first substrate to form a first electronic component by pressing the upper die and the lower die towards each other, wherein the pressure sintering device is simultaneously heated;

wherein that the method applies the following steps before the upper die and the lower die are pressed towards each other:
placing, in a level above the first formable electronic component or below the first formable electronic component, a second formable electronic component comprising at least a second sinterable component on a second sintering layer provided on a top layer of a second substrate;
placing a second pressure pad between the first formable electronic component and the second formable electronic component.

2. The method according to claim 1 , wherein the method comprises the step of covering the first sinterable component with a first protective foil arranged to be brought into engagement with the first pressure pad.

3. The method according to claim 1 , wherein the method comprises the step of covering the second sinterable component with a protective foil.

4. The method according to claim 1 , wherein the method applies the step of attaching the first or second substrate to a base plate.

5. The method according to claim 1 , wherein one or more of the first and second pressure pads are deformable pressure pads.

6. The method according to claim 5 , wherein the deformable pressure pads comprise a fluid contained in an enclosure.

7. The method according to claim 5 , wherein the thickness of the deformable pressure pads is in the range 300 μm-3 mm.

8. The method according to claim 2 , wherein the method comprises the step of covering the second sinterable component with a second protective foil.

9. The method according to claim 1 , wherein a plate is arranged between adjacent electronic components.

10. The method according to claim 9 , wherein the plate is heated by induction means.

11. The method according to claim 1 , wherein the first electronic component or the second electronic component comprises a baseplate which functions as an additional pressure pad.

12. A pressure sintering device for manufacturing an electronic component via a pressure-assisted low-temperature sintering process, wherein the pressure sintering device comprises:
an upper die and a lower die arranged to be moved relative to each other, wherein upper die and/or the lower die is provided with a first pressure pad, wherein the pressure sintering device is configured to heat and pressurise an electronic component arranged between the upper die and a lower die, wherein the pressure sintering device comprises at least one additional pressure pad being arranged to separate a first electronic component from a second electronic component when the first electronic component and the second electronic component are arranged between the upper die and a lower die.

13. The pressure sintering device according to claim 12 , wherein the first pressure pad and/or the at least one additional pressure pad is a deformable pressure pad.

14. The pressure sintering device according to claim 13 , wherein the deformable pressure pads comprise a fluid contained in an enclosure.

15. The pressure sintering device according to claim 12 , wherein the pressure sintering device comprises a plate configured to be arranged between adjacent electronic components.

16. The pressure sintering device according to claim 15 , wherein one or more heating elements integrated in the plate.

17. The pressure sintering device according to claim 15 , wherein the plate is heated by induction means.

18. The pressure sintering device according to claim 12 , the first electronic component or the second electronic component comprises a baseplate which functions as the at least one additional pressure pad.

19. The method according to claim 8 , wherein the thickness of the protective foils is in the range 1-500 μm.

20. The method according to claim 6 , wherein the thickness of the deformable pressure pads is in the range 300 μm-3 mm.

21. The method according to claim 5 , wherein the thickness of the deformable pressure pads is in the range 1-2 mm.

22. The method according to claim 8 , wherein the thickness of the protective foils is in the range 50-500 μm.

23. The method according to claim 6 , wherein the thickness of the deformable pressure pads is in the range 1-2 mm.

Assignees

• Danfoss Silicon Power Gmbh

Inventors

• Becker Martin
• Dittmann Dirk

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/0711

  Apparatus therefor · CPC title