Method to electrically connect chip with top connectors using 3D printing

Patent metadata

Field	Value
Publication number	US-12046575-B2
Application number	US-202015929281-A
Country	US
Kind code	B2
Filing date	Apr 22, 2020
Priority date	May 1, 2019
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and/or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.

First claim

What is claimed is:

1. A method for fabricating a three-dimensional (3D) electronic device, the method comprising:
iteratively applying layers of a liquid support material by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having a first contact pad and an electronic component thereon, the PCB being disposed on a stage in a work area, and the electronic component having a mounting package and a second contact pad protruding from a top surface of the mounting package, wherein each respective layer of the liquid support material is applied in a gap between the first contact pad and the second contact pad and, after application, the respective layer of the liquid support material is cured to form a solid support structure by cooling and/or exposure to ultraviolet (UV) radiation, such that after application and curing of a number of successive layers of the liquid support material, a solid support structure is formed between the first contact pad and the second contact pad, a cross section of the solid support structure having a staircase side profile with multiple steps, with a height of each of the steps being less than a thickness of the electronic component, and a top most one of the steps contacting (i) a portion of the top surface of the mounting package and (ii) a side surface of the second contact pad protruding from the top surface of the mounting package;
printing a layer of conductive material on the staircase side profile of the solid support structure by the LIFT process;
drying the layer of conductive material by heat so as to form a dried layer of conductive material;
sintering metal particles in the dried layer of conductive material using a laser beam to form a conductive layer that electrically connects the second contact pad of the electronic component to the first contact pad of the PCB; and
encapsulating the first and second contact pads, the conductive layer, and the electronic component in an encapsulant by the LIFT process.

2. The method of claim 1 , wherein the liquid support material is an epoxy acrylate, a urethane acrylate, or an acrylated monomer or oligomer.

3. The method of claim 2 , wherein the liquid support material includes a photoinitiator.

4. The method of claim 3 , wherein the photoinitiator is in a concentration of 0.1 to 10% by weight of the liquid support material.

5. The method of claim 3 , wherein the photoinitiator is a cationic photoinitiator.

6. The method of claim 5 , wherein the cationic photoinitiator is in a concentration of 0.05 to 3% by weight of the liquid support material.

7. The method of claim 3 , wherein the conductive material is a pure metal, a metal alloy, or a refractory metal.

8. The method of claim 7 , wherein printing the layer of conductive material on the solid support structure by the LIFT process comprises printing metal particles from a film onto the solid support structure.

9. The method of claim 7 , wherein printing the layer of conductive material on the solid support structure by the LIFT process comprises printing metal paste from a film onto the solid support structure.

10. The method of claim 1 , wherein prior to the sintering, curing the printed layer of conductive material using UV radiation.

11. The method of claim 1 , wherein each respective layer of the liquid support material forms a single step of the solid support structure.

Assignees

• Io Tech Group Ltd

Inventors

• Zenou Michael
• Gilan Ziv
• Nesher Guy

Classifications

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H05K3/1283 Primary

  After-treatment of the printed patterns, e.g. sintering or curing methods · CPC title

• H05K3/32 Primary

  electrically connecting electric components or wires to printed circuits · CPC title

• H05K2203/1469

  Circuit made after mounting or encapsulation of the components · CPC title

• H05K2203/1131

  Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity · CPC title