Substrate cleaning composition, method for cleaning substrate using the same, and method for fabricating semiconductor device using the same

Patent metadata

Field	Value
Publication number	US-12046464-B2
Application number	US-202217719561-A
Country	US
Kind code	B2
Filing date	Apr 13, 2022
Priority date	Apr 15, 2021
Publication date	Jul 23, 2024
Grant date	Jul 23, 2024

Abstract

A substrate cleaning composition, a method of cleaning a substrate using the same, and a method of fabricating a semiconductor device using the same, the substrate cleaning composition including a styrene copolymer including a first repeating unit represented by Formula 1-1a and a second repeating unit represented by Formula 1-1b; an additive represented by Formula 2-1; and an alcoholic solvent having a solubility of 500 g/L or less in deionized water,

First claim

What is claimed is:

1. A substrate cleaning composition, comprising:
a styrene copolymer including a first repeating unit represented by Formula 1-1a and a second repeating unit represented by Formula 1-1b;
an additive represented by Formula 2-1; and
an alcoholic solvent having a solubility of 500 g/L or less in deionized water,

wherein, in Formula 1-1a, R 1 is a hydrogen atom, or a substituted or unsubstituted C1 to C20 hydrocarbon group,

wherein, in Formula 1-1b, X is a hydrophilic functional group,
R 2 Y p   [Formula 2-1]

wherein, in Formula 2-1,
R 2 is a substituted or unsubstituted C3 to C25 hydrocarbon group,
Y is a hydrophilic functional group, and
p is a natural number.

2. The composition as claimed in claim 1 , wherein, in Formula 1-1b, X is a carboxyl group.

3. The composition as claimed in claim 1 , wherein, in Formula 2-1, Y is a carboxyl group.

4. The composition as claimed in claim 1 , wherein the solubility of the alcoholic solvent in deionized water is 250 g/L or less.

5. The composition as claimed in claim 1 , wherein the alcoholic solvent includes n-butanol or 4-methyl-2-pentanol.

6. The composition as claimed in claim 1 , wherein the composition includes 5 to 20 wt % of the styrene copolymer, based on a total weight of the composition.

7. The composition as claimed in claim 1 , wherein the composition includes 0.001 to 20 wt % of the additive, based on a total weight of the composition.

8. The composition as claimed in claim 1 , wherein the styrene copolymer has a weight-average molecular weight of 500 to 100,000.

9. The composition as claimed in claim 1 , further comprising a surfactant.

10. The composition as claimed in claim 9 , wherein a concentration of the surfactant is 10 to 50,000 ppm.

11. A substrate cleaning composition, comprising:
a styrene copolymer including a first repeating unit represented by Formula 1-2a and a second repeating unit represented by Formula 1-2b;
an additive represented by Formula 2-2; and
an alcoholic solvent having a solubility of 500 g/L or less in deionized water,

wherein, in Formula 1-2a, R 1 is a hydrogen atom, or substituted or unsubstituted C1 to C20 hydrocarbon group,

wherein, in Formula 2-2,
R 2 is a substituted or unsubstituted C3 to C25 hydrocarbon group,
q is a natural number of 2 or more.

12. The composition as claimed in claim 11 , wherein the solubility of the alcoholic solvent in deionized water is 250 g/L or less.

13. The composition as claimed in claim 11 , wherein the alcoholic solvent includes n-butanol or 4-methyl-2-pentanol.

14. The composition as claimed in claim 11 , wherein the styrene copolymer has a weight-average molecular weight of 500 to 100,000.

15. The composition as claimed in claim 11 , wherein the composition includes:
1 to 50 wt % of the styrene copolymer, and
0.001 to 20 wt % of the additive, all wt % being based on a total weight of the composition.

16. A method of cleaning a substrate, the method comprising:
providing a substrate,
providing a substrate cleaning composition on the substrate to form a coating film, and
rinsing the substrate to remove the coating film,
wherein:
the substrate cleaning composition includes a styrene copolymer including a first repeating unit represented by Formula 1-1a and a second repeating unit represented by Formula 1-1b, an additive represented by Formula 2-1, and an alcoholic solvent having a solubility of 500 g/L or less in deionized water,

in Formula 1-1a, R 1 is a hydrogen atom, or a substituted or unsubstituted C1 to C20 hydrocarbon group,

wherein, in Formula 1-1b, X is a hydrophilic functional group,
R 2 Y p   [Formula 2-1]

wherein, in Formula 2-1,
R 2 is a substituted or unsubstituted C3 to C25 hydrocarbon group,
Y is a hydrophilic functional group, and
p is a natural number.

17. The method as claimed in claim 16 , further comprising drying the substrate, after rinsing the substrate.

18. The method as claimed in claim 16 , further comprising drying the substrate cleaning composition on the substrate, after providing the substrate cleaning composition, to form a solid coating film.

19. The method as claimed in claim 16 , wherein a thickness of the coating film is 90 nm to 5,000 nm.

20. The method as claimed in claim 16 , wherein:
the coating film includes a lower part, a middle part, and an upper part, which are sequentially on the substrate, and
a content of the additive in the lower part of the coating film is larger than a content of the additive in the middle part of the coating film and a content of the additive in the upper part of the coating film is larger than the content of the additive in the middle part of the coating film.

Assignees

• Samsung Electronics Co Ltd
• Dongjin Semichem Co Ltd

Inventors

• Song Ga Young
• Park Mi Hyun
• Park Jong Kyoung
• Lee Jung Youl
• Kim Hyun Jin
• Lee Hyo San
• Lim Han Sol
• Han Hoon

Classifications

• H10P70/00 Primary

  Cleaning of wafers, substrates or parts of devices · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• C11D3/3749

  Polyolefins; Halogenated polyolefins; Natural or synthetic rubber; Polyarylolefins or halogenated polyarylolefins · CPC title

• C11D3/2003

  Alcohols; Phenols · CPC title

• C11D3/2079

  Monocarboxylic acids-salts thereof · CPC title