Solder alloy, solder composition, solder paste, and electronic circuit board
US-9931716-B2 · Apr 3, 2018 · US
Electrical connector
US12036628B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12036628-B2 |
| Application number | US-202318140662-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 28, 2023 |
| Priority date | Sep 21, 2020 |
| Publication date | Jul 16, 2024 |
| Grant date | Jul 16, 2024 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.
First claim
Opening claim text (preview).
We claim: 1. An electrical connector, comprising: a first layer formed of a copper based material; a second layer formed of an iron-nickel alloy, wherein the second layer has a thickness 8% to 30% of the thickness of the electrical connector; and a solder layer formed of a solder alloy consisting essentially of: 17% to 28% indium by weight; 12% to 20% zinc by weight; 1% to 6% silver by weight; 1% to 3% copper by weight; and a remaining weight of the solder alloy being tin. 2. The electrical connector according to claim 1 , wherein the solder alloy includes 23% to 26% indium by weight. 3. The electrical connector according to claim 1 , wherein the solder alloy includes 24% to 26% indium by weight. 4. The electrical connector according to claim 1 , wherein the solder alloy includes 25% to 26% indium by weight. 5. The electrical connector according to claim 1 , wherein the solder alloy includes 5.5% to 6% silver by weight. 6. The electrical connector according to claim 1 , wherein the solder alloy includes 5.75% to 6% silver by weight. 7. The electrical connector according to claim 1 , wherein the solder layer is in direct and intimate contact with the second layer.
Assignees
Inventors
Classifications
Iron or ferrous alloys · CPC title
Glass · CPC title
Copper or alloys thereof · CPC title
Next to Group VIII metal-base component · CPC title
Next to Group IB metal-base component · CPC title
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Frequently asked questions
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- What does patent US12036628B2 cover?
- An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1…
- Who is the assignee on this patent?
- Aptiv Technologies AG
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jul 16 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).