Trench gate trench field plate vertical MOSFET

Patent metadata

Field	Value
Publication number	US-12034074-B2
Application number	US-202117516017-A
Country	US
Kind code	B2
Filing date	Nov 1, 2021
Priority date	Oct 3, 2013
Publication date	Jul 9, 2024
Grant date	Jul 9, 2024

Abstract

A semiconductor device having a vertical drain extended MOS transistor may be formed by forming deep trench structures to define vertical drift regions of the transistor, so that each vertical drift region is bounded on at least two opposite sides by the deep trench structures. The deep trench structures are spaced so as to form RESURF regions for the drift region. Trench gates are formed in trenches in the substrate over the vertical drift regions. The body regions are located in the substrate over the vertical drift regions.

First claim

What is claimed is:

1. An integrated circuit having a vertical drain extended transistor formed in a semiconductor substrate comprising:
first and second linear trench portions in the semiconductor substrate and extending into the semiconductor substrate a first depth;
inner trenches extending between the first linear trench portion and the second linear trench portion, the inner trenches extending into the semiconductor substrate a different second depth;
a source region of a first conductivity type formed at a top surface of the semiconductor substrate, the source region extending between the first linear trench portion and the second linear trench portion and on opposite sides of each of the inner trenches;
a body region of a second conductivity type formed below the source region; and

a vertically oriented drift region of the first conductivity type formed below the body region,
wherein:
the first linear trench portion, the second linear trench portion, and the inner trenches have a dielectric material layer formed on a sidewall and a bottom part;
the first linear trench portion and the second linear trench portion have a first conductive material formed on the dielectric material layer; and
the inner trenches have a second conductive material located in the dielectric material layer.

2. The integrated circuit of claim 1 , wherein the semiconductor substrate includes an epitaxial layer, and the first linear trench portion, the second linear trench portion, and the inner trenches are formed in the epitaxial layer.

3. The integrated circuit of claim 1 , wherein the first linear trench portion and the second linear trench portion are repeated at least three times within the vertical drain extended transistor.

4. The integrated circuit of claim 1 , wherein three instances of the inner trenches are located between the first linear trench portion and the second linear trench portion.

5. The integrated circuit of claim 1 , wherein each of the inner trenches forms a gate of the vertical drain extended transistor.

6. The integrated circuit of claim 1 , wherein the first conductive material formed in the first linear trench portion and the second linear trench portion is electrically coupled to the source region.

7. The integrated circuit of claim 1 , wherein the first linear trench portion and the second linear trench portion are 0.5 to 1.5 microns wide.

8. The integrated circuit of claim 1 , wherein the dielectric material layer in the first linear trench portion and the second linear trench portion is comprised of silicon dioxide and aluminum oxy-nitride.

9. The integrated circuit of claim 1 , wherein the first linear trench portion and the second linear trench portion form part of a single continuous trench.

10. A vertical drain extended transistor formed in a semiconductor substrate comprising:
first and second linear trench portions extending into the semiconductor substrate by a first depth;
inner trenches extending into the semiconductor substrate by a second depth less than the first depth and extending between the first linear trench portion and the second linear trench portion;
a source region of a first conductivity type formed at a top surface of the semiconductor substrate, the source region extending between the first linear trench portion and the second linear trench portion and on opposite sides of each of the inner trenches;
a body region of a second conductivity type formed below the source region; and

a vertically oriented drift region of the first conductivity type formed below the body region,
wherein:
the first linear trench portion, the second linear trench portion, and the inner trenches have a dielectric material layer formed on a sidewall and a bottom part;
the first linear trench portion and the second linear trench portion have a first conductive material formed on the dielectric material layer; and
the inner trenches have a second conductive material located in the dielectric material layer.

11. The vertical drain extended transistor of claim 10 , wherein the semiconductor substrate includes an epitaxial layer, and the first linear trench portion, the second linear trench portion, and the inner trenches are formed in the epitaxial layer.

12. The vertical drain extended transistor of claim 11 , wherein the first linear trench portion and the second linear trench portion are repeated at least three times within the vertical drain extended transistor.

13. The vertical drain extended transistor of claim 12 , wherein three instances of the inner trenches are located between the first linear trench portion and the second linear trench portion.

14. The vertical drain extended transistor of claim 13 , wherein each of the inner trenches forms a gate of the vertical drain extended transistor.

15. The vertical drain extended transistor of claim 14 , wherein the first conductive material formed in the first linear trench portion and the second linear trench portion is electrically coupled to the source region.

16. The vertical drain extended transistor of claim 15 , wherein the first linear trench portion and the second linear trench portion are 0.5 to 1.5 microns wide.

17. The vertical drain extended transistor of claim 10 , wherein the dielectric material layer in the first linear trench portion and the second linear trench portion is comprised of silicon dioxide and aluminum oxy-nitride.

18. The vertical drain extended transistor of claim 16 , wherein the first linear trench portion and the second linear trench portion form part of a single continuous trench.

19. The integrated circuit of claim 1 , wherein the second depth is less than the first depth.

20. The vertical drain extended transistor of claim 10 , wherein the dielectric material layer in the first linear trench portion and the second linear trench portion is comprised of silicon dioxide and silicon oxy-nitride.

Assignees

• Texas Instruments Inc

Inventors

• Denison Marie
• Pendharkar Sameer
• Mathur Guru

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P32/14

  within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase · CPC title

• H10P14/40

  of conductive or resistive materials · CPC title

• H10D64/519

  characterised by their top-view geometrical layouts · CPC title

• H10D64/516

  the thicknesses being non-uniform · CPC title