Advanced-packaging high-volume-mode digital-lithography-tool

Patent metadata

Field	Value
Publication number	US-12032284-B2
Application number	US-202217872546-A
Country	US
Kind code	B2
Filing date	Jul 25, 2022
Priority date	Jul 25, 2022
Publication date	Jul 9, 2024
Grant date	Jul 9, 2024

Abstract

Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.

First claim

What is claimed is:

1. A method of packaging a substrate, comprising:
rotationally aligning a substrate to a predetermined angular position;
transferring the substrate to a metrology station;
measuring a topology of the substrate at the metrology station;
applying a first chucking force to the substrate to flatten the substrate;
generating a mapping of a die pattern on an exposed surface of the substrate;
transferring the substrate to a printing station;
applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station;
adjusting a printing pattern based on the mapping of the die pattern; and
printing the printing pattern on the exposed surface of the substrate.

2. The method of packaging a substrate of claim 1 , further comprising:
varying a magnitude of the first chucking force across an area of the substrate based on the topology of the substrate.

3. The method of packaging a substrate of claim 1 , wherein:
the first chucking force is applied using one or both of a vacuum chuck and an electrostatic chuck.

4. The method of packaging a substrate of claim 1 , further comprising:
re-measuring the topology of the substrate after applying the first chucking force.

5. The method of packaging a substrate of claim 1 , wherein:
measuring a topology of the substrate comprises gathering data from one or both of a capacitive sensor and an optical sensor.

6. The method of packaging a substrate of claim 1 , wherein:
adjusting a printing pattern based on the mapping of the die pattern comprises adjusting at least a portion of the printing pattern based on one or both of a lateral position and rotational position of at least one die on the substrate.

7. The method of packaging a substrate of claim 1 , wherein:
the substrate comprises a first substrate; and
the method comprises:
while printing the printing pattern on the exposed surface of the first substrate:
rotationally aligning a second substrate to the predetermined angular position;
transferring the second substrate to the metrology station;
measuring a second topology of the second substrate at the metrology station;
applying a third chucking force to the second substrate to flatten the second substrate; and
generating a second mapping of a die pattern on an exposed surface of the second substrate.

8. The method of packaging a substrate of claim 7 , further comprising:
transferring the second substrate to a buffer station.

9. The method of packaging a substrate of claim 8 , further comprising:
transferring the second substrate to the printing station;
applying a fourth chucking force to the substrate to flatten the second substrate against the surface of the printing station;
adjusting a second printing pattern of the second substrate based on the second mapping of the die pattern; and
printing the second printing pattern on the exposed surface of the substrate.

10. A method of packaging a substrate, comprising:
rotationally aligning a plurality of substrates to a predetermined angular position;
measuring a topology of each substrate;
applying a first chucking force to each substrate to flatten the respective substrate;
generating a mapping of a die pattern for an exposed surface of substrate;
transferring each substrate to a printing station;
applying a second chucking force to each substrate to flatten the respective substrate against a surface of the printing station;
adjusting a respective printing pattern for each substrate based on the mapping of the die pattern for each respective substrate; and
printing the respective printing pattern on the exposed surface of each respective substrate.

11. The method of packaging a substrate of claim 10 , further comprising:
determining a magnitude of the first chucking force at a number of locations across an area of each substrate needed to flatten the respective substrate; and
varying the magnitude of the first chucking force across the area of the respective substrate based on the determination.

12. The method of packaging a substrate of claim 10 , wherein:
rotationally aligning each substrate to the predetermined angular position comprises:
identifying an alignment mark on the respective substrate; and
rotating the respective substrate to align the alignment mark to the predetermined angular position.

13. The method of packaging a substrate of claim 10 , further comprising:
flipping each substrate to expose an unprinted surface of the respective substrate;
rotationally aligning each substrate to the predetermined angular position;
measuring the topology of each substrate;
applying a third chucking force to each substrate to flatten each respective substrate;
generating a mapping of an additional die pattern on the unprinted surface of each substrate;
transferring each substrate to the printing station;
applying a fourth chucking force to each substrate to flatten the respective substrate against the surface of the printing station;
adjusting an additional printing pattern based on the mapping of the additional die pattern; and
printing the additional printing pattern on the unprinted surface of each substrate.

14. The method of packaging a substrate of claim 10 , wherein:
the first chucking force is different for at least one of the plurality of substrates.

15. The method of packaging a substrate of claim 10 , wherein:
the first chucking force of a respective substrate and the second chucking force of the respective subtrate are equal.

16. The method of packaging a substrate of claim 10 , further comprising:
transferring at least some of the plurality of substrates to a buffer station, wherein each of the at least some of the plurality of substrates is transferred to the printing station from the buffer station.

17. The method of packaging a substrate of claim 10 , further comprising:
measuring a bevel angle on an edge of packaging for each substrate.

18. The method of packaging a substrate of claim 10 , wherein:
adjusting the printing pattern based on the mapping of the die pattern comprises calculating one or more differences between the printing pattern and the mapping of the die pattern and adjusting a position of at least a portion of the printing pattern based on the one or more differences.

Assignees

• Applied Materials Inc

Inventors

• Kuo Shih-Hao
• Wang Hsiu-Jen
• Mueller Ulrich
• Chen Jang Fung

Classifications

• H10P72/3412

  Batch transfer of wafers · CPC title

• H10P72/3411

  involving loading and unloading of wafers · CPC title

• H10P72/0474

  comprising at least one lithography chamber · CPC title

• G03F7/70608

  Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist · CPC title

• G03F7/70783

  Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight · CPC title