Solder joint life predictor and solder joint life prediction method

Patent metadata

Field	Value
Publication number	US-12032039-B2
Application number	US-201917422329-A
Country	US
Kind code	B2
Filing date	Jan 18, 2019
Priority date	Jan 18, 2019
Publication date	Jul 9, 2024
Grant date	Jul 9, 2024

Abstract

A control device including a solder joint life predictor includes: a temperature sensor that measures temperature of a solder joint on an electronic circuit board that drives a heater and a motor; a storage that stores a reference acceleration factor that is an acceleration factor based on a test condition of a thermal shock test and a reference condition in an environment in which the electrical appliance is used; a calculator that calculates an actual acceleration factor from a temperature variation range and a maximum reached temperature of the solder joint during one cycle from start to end of driving of the heater or the motor; and a determiner that predicts the life of the solder joint by comparing the integrated value of the acceleration factor ratios with a threshold.

First claim

The invention claimed is:

1. A solder joint life predictor comprising:
a temperature sensor to measure temperature of a solder joint on an electronic circuit board that drives a load;
a storage to store a reference acceleration factor, the reference acceleration factor being an acceleration factor based on a test condition of a thermal shock test of an electrical appliance including the electronic circuit board and a reference condition in an environment in which the electrical appliance is used;
a calculator to calculate an actual acceleration factor on the basis of a temperature variation range and a maximum reached temperature of the solder joint during one cycle from start to end of driving of the load, and to integrate acceleration factor ratios each obtained by dividing the actual acceleration factor by the reference acceleration factor for each one cycle from start to end of driving of the load to obtain an integrated value of the acceleration factor ratios; and
a determiner to predict life of the solder joint by comparing the integrated value of the acceleration factor ratios with a threshold.

2. The solder joint life predictor according to claim 1 , wherein the threshold is a limit number of cycles in the thermal shock test.

3. The solder joint life predictor according to claim 2 , wherein the determiner stops driving of the load when the integrated value of the acceleration factor ratios is equal to or larger than the threshold.

4. The solder joint life predictor according to claim 3 , further comprising:
a display to indicate information, wherein
the determiner causes the display to provide an error display when the integrated value of the acceleration factor ratios is equal to or larger than the threshold.

5. The solder joint life predictor according to claim 2 , further comprising:
a display to indicate information, wherein
the determiner causes the display to provide an error display when the integrated value of the acceleration factor ratios is equal to or larger than the threshold.

6. The solder joint life predictor according to claim 1 , wherein the threshold is a constant multiple of a limit number of cycles in the thermal shock test.

7. The solder joint life predictor according to claim 6 , wherein the determiner stops driving of the load when the integrated value of the acceleration factor ratios is equal to or larger than the threshold.

8. The solder joint life predictor according to claim 7 , further comprising:
a display to indicate information, wherein
the determiner causes the display to provide an error display when the integrated value of the acceleration factor ratios is equal to or larger than the threshold.

9. The solder joint life predictor according to claim 6 , further comprising:
a display to indicate information, wherein
the determiner causes the display to provide an error display when the integrated value of the acceleration factor ratios is equal to or larger than the threshold.

10. The solder joint life predictor according to claim 1 , wherein the determiner stops driving of the load when the integrated value of the acceleration factor ratios is equal to or larger than the threshold.

11. The solder joint life predictor according to claim 10 , further comprising:
a display to indicate information, wherein
the determiner causes the display to provide an error display when the integrated value of the acceleration factor ratios is equal to or larger than the threshold.

12. The solder joint life predictor according to claim 1 , further comprising:
a display to indicate information, wherein
the determiner causes the display to provide an error display when the integrated value of the acceleration factor ratios is equal to or larger than the threshold.

13. A solder joint life prediction method comprising:
measuring temperatures of a solder joint on an electronic circuit board that drives a load from start to end of driving of the load, and calculating an actual acceleration factor from a temperature variation range and a maximum reached temperature of the solder joint;
obtaining an acceleration factor ratio by dividing the actual acceleration factor by a reference acceleration factor, the reference acceleration factor being an acceleration factor based on a test condition in a thermal shock test of an actual appliance and a reference condition in an environment in which an electrical appliance including the electronic circuit board is used;
integrating the acceleration factor ratios to calculate an integrated value of the acceleration factor ratios; and
predicting life of the solder joint by comparing the integrated value of the acceleration factor ratios with a threshold.

Assignees

• Mitsubishi Electric Corp

Inventors

• Saeki Takuya

Classifications

• G06F2119/04

  Ageing analysis or optimisation against ageing · CPC title

• G01N2203/0224

  Thermal cycling · CPC title

• H05K1/0268

  for electrical inspection or testing · CPC title

• G01N3/60

  Investigating resistance of materials, e.g. refractory materials, to rapid heat changes {(thermal testing of structures or apparatus G01M99/002)} · CPC title

• B23K3/08

  Auxiliary devices therefor · CPC title