Rotating lid for module cooler

Patent metadata

Field	Value
Publication number	US-12028997-B2
Application number	US-202117304855-A
Country	US
Kind code	B2
Filing date	Jun 28, 2021
Priority date	Jun 28, 2021
Publication date	Jul 2, 2024
Grant date	Jul 2, 2024

Abstract

An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.

First claim

What is claimed is:

1. An electronic assembly comprising:
an electronic module mounted to a laminate;
a rotating cover rotatably attached directly to a top frame secured to the laminate, wherein the rotating cover comprises an open position and a closed position, wherein the rotating cover comprises a solid surface extending over an entirety of a topmost surface of a substantial portion of the electronic module in the closed position; and
a cooling apparatus demountably secured to the rotating cover and disposed below the rotating cover and directly above the module.

2. The electronic assembly according to claim 1 , wherein the rotating cover is held in the closed position only by a load hardware such that pivot features of the rotating cover are disengaged and do not influence a vertical position of the rotating cover.

3. The electronic assembly according to claim 1 , wherein pivot features of the rotating cover are disengaged and do not influence a vertical position of the rotating cover in the closed position.

4. The electronic assembly according to claim 1 , wherein the cooling apparatus is a liquid cold plate comprising an inlet port and an outlet port, wherein the inlet port and the outlet port protrude through openings in a top surface of the rotating cover.

5. The electronic assembly according to claim 1 , wherein the cooling apparatus is demountable from the rotating cover only in the open position, wherein the rotating cover is at an angle relative to a topmost surface of the electronic module in the open position, and wherein the rotating cover is substantially parallel with a topmost surface of the electronic module in the close position.

6. The electronic assembly according to claim 1 , further comprising:
a pressure plate entirely above and contacting the rotating cover; and
load hardware above and directly contacting the pressure plate.

7. The electronic assembly according to claim 6 , further comprising:
an elastomer sandwiched between the rotating cover and the pressure plate.

8. An electronic assembly comprising:
an electronic module mounted to a laminate;
a rotating cover rotatably attached directly to a top frame secured to the laminate, wherein the rotating cover comprises an open position and a closed position, wherein the rotating cover comprises a solid surface extending over an entirety of a topmost surface of a substantial portion of the electronic module in the closed position;
a mechanical stop preventing the rotating cover from rotating beyond 60 degrees relative to a top surface of the electronic module in the open position; and
a cooling apparatus demountably secured to the rotating cover and disposed below the rotating cover and directly above the module.

9. The electronic assembly according to claim 8 , wherein the rotating cover is held in the closed position only by a load hardware such that pivot features of the rotating cover are disengaged and do not influence a vertical position of the rotating cover.

10. The electronic assembly according to claim 8 , wherein pivot features of the rotating cover are disengaged and do not influence a vertical position of the rotating cover in the closed position.

11. The electronic assembly according to claim 8 , wherein the cooling apparatus is a liquid cold plate comprising an inlet port and an outlet port, wherein the inlet port and the outlet port protrude through openings in a top surface of the rotating cover.

12. The electronic assembly according to claim 8 , wherein the cooling apparatus is demountable from the rotating cover only in the open position, wherein the rotating cover is at an angle relative to a topmost surface of the electronic module in the open position, and wherein the rotating cover is substantially parallel with a topmost surface of the electronic module in the close position.

13. The electronic assembly according to claim 8 , further comprising:
a pressure plate entirely above and contacting the rotating cover; and
load hardware above and directly contacting the pressure plate.

14. The electronic assembly according to claim 13 , further comprising:
an elastomer sandwiched between the rotating cover and the pressure plate.

15. An electronic assembly comprising:
an electronic module mounted to a laminate;
a rotating cover rotatably attached directly to the laminate with pivot features, wherein the rotating cover comprises alignment channels extending from a pivot axis and disposed along opposite edges of the rotating cover; and
a cooling apparatus is disposed below the rotating cover and directly above the module, and wherein the cooling apparatus is demountably secured to the rotating cover by the alignment channels, wherein opposite edges of the cooling apparatus are captured on at least three surfaces by the alignment channels, and wherein the rotating cover comprises a solid surface extending over an entirety of a topmost surface of the electronic module in a closed position.

16. The electronic assembly according to claim 15 , wherein the rotating cover is held in the closed position only by a load hardware such that pivot features of the rotating cover are disengaged and do not influence a vertical position of the rotating cover.

17. The electronic assembly according to claim 15 , wherein pivot features of the rotating cover are disengaged and do not influence a vertical position of the rotating cover in the closed position.

18. The electronic assembly according to claim 15 , wherein the cooling apparatus is a liquid cold plate comprising an inlet port and an outlet port, wherein the inlet port and the outlet port protrude through openings in a top surface of the rotating cover.

19. The electronic assembly according to claim 15 , wherein the cooling apparatus is demountable from the rotating cover only in an open position, wherein the rotating cover is at an angle relative to a topmost surface of the electronic module in the open position, and wherein the rotating cover is substantially parallel with a topmost surface of the electronic module in the close position.

20. The electronic assembly according to claim 15 , further comprising:
a pressure plate entirely above and contacting the rotating cover; and
load hardware above and directly contacting the pressure plate.

Assignees

• IBM

Inventors

• Singer Noah
• Zitz Jeffrey Allen
• Schultz Mark D
• Torok John
• Brodsky William L
• Yu Yuet-Ying
• Canfield Shawn

Classifications

• H05K7/20254 Primary

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K5/03 Primary

  Covers · CPC title