Semiconductor module including semiconductor package and semiconductor package

Patent metadata

Field	Value
Publication number	US-12025656-B2
Application number	US-202017107244-A
Country	US
Kind code	B2
Filing date	Nov 30, 2020
Priority date	Sep 28, 2016
Publication date	Jul 2, 2024
Grant date	Jul 2, 2024

Abstract

A semiconductor module includes a substrate; a plurality of semiconductor packages provided on the substrate; and an environment information indicator configured to display information related to an environment surrounding the plurality of semiconductor packages.

First claim

What is claimed is:

1. A semiconductor module comprising:
a plurality of semiconductor packages provided on a substrate; and
an environment information indicator provided on the substrate and configured to collect and display information related to surroundings of the plurality of semiconductor packages,
wherein the environment information indicator includes a temperature indicator including a plurality of indicators,
wherein the plurality of indicators have different critical values,
wherein the temperature indicator is configured to indicate a highest temperature affecting the semiconductor module after the temperature indicator being provided on the substrate by irreversibly changing respective color of each the plurality of indicators having the different critical values when an ambient temperature exceed respective critical values of each of the plurality of indicators, and
wherein the environment information indicator further includes an X-ray indicator that comprises:
an X-ray film; and
a first cap attached to a first surface of the X-ray film, the first cap exposing a portion of the first surface of the X-ray film through a first pattern.

2. The semiconductor module of claim 1 , wherein the information related to the surroundings of the plurality of semiconductor packages comprises:
information related to humidity of the surroundings of the plurality of semiconductor packages;
information related to an X-ray of the surroundings being irradiated to the plurality of semiconductor packages; and
information related to electrical overstress (EOS) of the surroundings being applied to the plurality of semiconductor packages.

3. The semiconductor module of claim 1 , wherein the environment information indicator comprises a plurality of first type indicators configured to display a first type of information related to the surroundings of the plurality of semiconductor packages based on information collected by the plurality of first type indicators.

4. The semiconductor module of claim 3 , wherein the plurality of first type indicators comprise a first indicator and a second indicator,
wherein the first indicator has a first critical value, the first indicator changing a display color of the first indicator based on a first comparison between the first critical value and the first type of information,
wherein the second indicator has a second critical value, the second indicator changing a display color of the second indicator based on a second comparison between the first critical value and the first type of information, and
wherein the first critical value and the second critical value are different from each other.

5. The semiconductor module of claim 4 , wherein the first and second indicators irreversibly change the display color of the first indicator and the display color of the second indicator.

6. The semiconductor module of claim 4 , wherein the first and second indicators reversibly change the display color of the first indicator and the display color of the second indicator.

7. The semiconductor module of claim 1 , wherein the environment information indicator further comprises a plurality of information indicators collecting and displaying different information of the surroundings, and
wherein at least one of the plurality of information indicators in configured to change the displayed information of the at least one of the plurality of information indicators irreversibly, and at least another one of the plurality of indicators is configured to change the displayed information of the at least another one of the plurality of information indicators reversibly.

8. A semiconductor module comprising:
a plurality of semiconductor packages provided on a substrate; and
an environment information indicator provided on the substrate and configured to collect and display information related to surroundings of the plurality of semiconductor packages,
wherein the environment information indicator includes an electrical overstress (EOS) indicator,
wherein the EOS indicator comprises:
a plurality of fuses having different critical values of currents to be disconnected; and
a plurality of temperature indicators coupled to the plurality of fuses respectively,
wherein the EOS indicator is configured to visibly indicate a highest EOS affecting the semiconductor module after the EOS indicator being provided on the substrate by irreversibly changing respective color of each the plurality of temperature indicators based on a heat generated when each of the plurality of fuses having the different critical values of currents to be disconnected is disconnected,
wherein the environment information indicator further includes an X-ray indicator, and
wherein the X-ray indicator comprises:
an X-ray film; and
a first cap attached to a first surface of the X-ray film, the first cap exposing a portion of the first surface of the X-ray film through a first pattern.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Won Seyoung
• Kang Dan-Kyu
• Lee Sang-Yeol

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title

• H10W42/80

  protecting against overcurrent or overload, e.g. fuses or shunts (integrated devices comprising arrangements for electrical protection H10D89/60) · CPC title