Enhanced thermal management in electrical boxes

Patent metadata

Field	Value
Publication number	US-12016153-B2
Application number	US-202217868941-A
Country	US
Kind code	B2
Filing date	Jul 20, 2022
Priority date	Jul 20, 2022
Publication date	Jun 18, 2024
Grant date	Jun 18, 2024

Abstract

An apparatus cools electronic circuitry. A housing has surfaces configured to enclose the electronic circuitry and are mountable inside a cavity in a back box. At least one of the surfaces has a vent holes therein facing an exhaust opening in the back box when the housing is mounted inside the cavity. Another surface has a fan hole that faces an intake opening in the back box when the housing is mounted inside the cavity. A cooling fan is mounted onto the another surface and disposed over the fan hole. The cooling fan is configured to draw cooling air through the intake opening in the back box and the fan hole into the housing and over the electronic circuitry. The cooling air then exits the housing through the vent holes and thereafter exits the back box through the exhaust opening.

First claim

What is claimed is:

1. An apparatus for cooling electronic circuitry, the apparatus comprising:
(a) a housing having a plurality of surfaces configured to enclose the electronic circuitry and being mountable inside a back box,
(1) at least one of the plurality of surfaces having a plurality of vent holes formed therein, the plurality of vent holes facing an exhaust opening in the back box when the housing is mounted inside the back box, and
(2) another of the plurality of surfaces having a fan hole formed therein that faces an intake opening in the back box when the housing is mounted inside the back box;

(b) a cooling fan mounted onto the another of the plurality of surfaces and disposed over the fan hole, the cooling fan being configured to draw cooling air through the intake opening in the back box and through the fan hole into the housing and over the electronic circuitry, the cooling air then exiting the housing through the plurality of vent holes of the housing and thereafter exiting the back box through the exhaust opening, the cooling air thereby removing heat generated by the electronic circuitry; and
(c) a front surface disposed opposite to a rear surface of the housing and facing away from the back box when the housing is mounted inside the back box;
(d) wherein
(1) the front surface is in thermal contact with the housing and provides a further path for radiating at least some of the heat generated by the electronic circuitry, and
(2) the front surface includes
(A) a mounting plate, and
(B) a touch plate disposed atop the mounting plate, and

(3) the mounting plate and the touch plate providing the further path for radiating at least some of the heat generated by the electronic circuitry.

2. The apparatus of claim 1 , wherein
(a) the mounting plate is made of at least one of a plastic or a metal.

3. An apparatus for cooling electronic circuitry, the apparatus comprising:
(a) a housing having a plurality of surfaces configured to enclose the electronic circuitry and being mountable inside a back box,
(1) at least one of the plurality of surfaces having a plurality of vent holes formed therein, the plurality of vent holes facing an exhaust opening in the back box when the housing is mounted inside the back box, and
(2) another of the plurality of surfaces having a fan hole formed therein that faces an intake opening in the back box when the housing is mounted inside the back box;

(b) a cooling fan mounted onto the another of the plurality of surfaces and disposed over the fan hole, the cooling fan being configured to draw cooling air through the intake opening in the back box and through the fan hole into the housing and over the electronic circuitry, the cooling air then exiting the housing through the plurality of vent holes of the housing and thereafter exiting the back box through the exhaust opening, the cooling air thereby removing heat generated by the electronic circuitry;
(c) a front surface disposed opposite to a rear surface of the housing and facing away from the back box when the housing is mounted inside the back box,
(1) wherein the front surface is in thermal contact with the housing and provides a further path for radiating at least some of the heat generated by the electronic circuitry; and

(d) a thermal interface material disposed between the housing and the front surface to facilitate removal of at least some of the heat generated by the electronic circuitry.

4. An apparatus for cooling electronic circuitry, the apparatus comprising:
(a) a housing having a plurality of surfaces configured to enclose the electronic circuitry and being mountable inside a back box,
(1) at least one of the plurality of surfaces having a plurality of vent holes formed therein, the plurality of vent holes facing an exhaust opening in the back box when the housing is mounted inside the back box, and
(2) another of the plurality of surfaces having a fan hole formed therein that faces an intake opening in the back box when the housing is mounted inside the back box; and

(b) a cooling fan mounted onto the another of the plurality of surfaces and disposed over the fan hole, the cooling fan being configured to draw cooling air through the intake opening in the back box and through the fan hole into the housing and over the electronic circuitry, the cooling air then exiting the housing through the plurality of vent holes of the housing and thereafter exiting the back box through the exhaust opening, the cooling air thereby removing heat generated by the electronic circuitry;
(c) wherein in response to the back box being mounted in an opening in a first wall such that the back box is disposed in a cavity located between the first wall and a second wall,
(1) the cooling fan draws the cooling air from the cavity through the intake hole into the back box,
(2) the air exiting the back box through the exhaust opening then rises within the cavity until the air contacts at least one of the first and second walls and is re-cooled by the contact with the at least one of the first and second walls, and
(3) the re-cooled air then descends, and
(4) the cooling fan additionally draws the re-cooled air from the cavity through the intake hole into the back box, thereby cycling use of the cooling air.

5. Method of cooling electronic circuitry, the method comprising:
(a) providing a housing having a plurality of surfaces configured to enclose the electronic circuitry, wherein
(1) at least one of the plurality of surfaces has a plurality of vent holes formed therein,
(2) another of the plurality of surfaces has a fan hole formed therein, and
(3) a cooling fan is mounted onto the another of the plurality of surfaces and disposed over the fan hole;

(b) mounting the housing inside a back box such that
(1) the plurality of vent holes face an exhaust opening in the back box, and
(2) the fan hole faces an intake opening in the back box;

(c) mounting the back box inside an opening in a first wall such that the back box is disposed in a cavity located between the first wall and a second wall; and
(d) operating the cooling fan to draw cooling air from the cavity through the intake opening in the back box and through the fan hole into the housing and over the electronic circuitry, the cooling air then exiting the housing through the plurality of vent holes of the housing and thereafter exiting the back box through the exhaust opening back into the cavity.

6. The method of claim 5 , wherein
(a) during the step of operating the cooling fan
(1) the air exiting the back box through the exhaust opening then rises within the cavity until the air contacts at least one of the first and second walls and is re-cooled by the contact with the at least one of the first and second walls,
(2) the re-cooled air then descends, and
(3) the cooling fan additionally draws the re-cooled air from the cavity through the intake hole into the back box, thereby removing heat generated by the electronic circuitry and cycling use of the cooling air.

7. N apparatus for cooling electronic circuitry, the apparatus comprising:
(a) a housing having a plurality of surfaces configured to enclose the electronic circuitry and being mountable inside a back box, the plurality of surfaces including
(1) a top surface,
(2) a bottom surface disposed opposite to the top surface,
(3) a rear surface extending between the top surface and the bottom surface, and
(4) opposing first and second side surfaces each extending between the top surface and the bottom surface,
(5) at least the top surface having a plurality of vent holes formed therein, the plurality of vent holes facing an exhaust opening in the back box when the housing is mounted inside the back box,
(6) the rear surface hav

Assignees

• Crestron Electronics Inc

Inventors

• Joy Edward
• Pedoeem Albert
• Replogle Kriss
• Magrino Charles

Classifications

• H05K7/20209

  Thermal management, e.g. fan control · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H02G3/081

  Bases, casings or covers · CPC title

• H05K7/20172 Primary

  Fan mounting or fan specifications · CPC title

• H02G3/03 Primary

  Cooling · CPC title