Electron source, method for manufacturing same, and device provided with electron source

US12014894B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12014894-B2
Application numberUS-202118258461-A
CountryUS
Kind codeB2
Filing dateDec 20, 2021
Priority dateDec 25, 2020
Publication dateJun 18, 2024
Grant dateJun 18, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for manufacturing an electron source includes steps of sandwiching a welding object in which a tip of an electron emission material and a tungsten filament overlap in direct contact between a pair of welding electrodes, and welding the tip and the tungsten filament by causing a current to flow while pressing forces are applied to the welding object by the pair of welding electrodes. A thickness of the welding object is within a range of 50 to 500 μm.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for manufacturing an electron source, the method comprising steps of: sandwiching a welding object in which a tip of an electron emission material and a tungsten filament overlap in direct contact between a pair of welding electrodes; and welding the tip and the tungsten filament by causing a current to flow while pressing forces are applied to the welding object by the pair of welding electrodes, wherein a thickness of the welding object is within a range of 50 to 500 μm. 2. The method according to claim 1 , wherein a cross-sectional shape of a part welded to the tungsten filament in the tip is a square shape or a rectangular shape in which a length of one side is 10 to 300 μm. 3. The method according to claim 1 , wherein the electron emission material is selected from the group consisting of LaB 6 , HfC, and an IrCe compound. 4. The method according to claim 1 , wherein the tungsten filament contains rhenium. 5. An electron source comprising: a tip of an electron emission material; a tungsten filament; and a welding portion in which the tip and the tungsten filament are directly bonded, wherein a thickness of the welding portion is 50 to 500 μm, and wherein the electron emission material is selected from the group consisting of LaB 6 , HfC, and an IrCe compound. 6. An electron source comprising: a tip of an electron emission material; a tungsten filament; and a welding portion in which the tip and the tungsten filament are directly bonded, wherein a thickness of the welding portion is 50 to 500 μm, wherein the tungsten filament contains rhenium. 7. A device comprising the electron source according to claim 5 . 8. A device comprising the electron source according to claim 6 .

Assignees

Inventors

Classifications

  • Thermionic sources · CPC title

  • H01J37/065Primary

    Construction of guns or parts thereof (H01J37/067 - H01J37/077 take precedence) · CPC title

  • characterised by the shape · CPC title

  • Emission assisted by other physical processes, e.g. field- or photo emission · CPC title

  • of thermionic cathodes · CPC title

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What does patent US12014894B2 cover?
A method for manufacturing an electron source includes steps of sandwiching a welding object in which a tip of an electron emission material and a tungsten filament overlap in direct contact between a pair of welding electrodes, and welding the tip and the tungsten filament by causing a current to flow while pressing forces are applied to the welding object by the pair of welding electrodes. A …
Who is the assignee on this patent?
Denka Company Ltd
What technology area does this patent fall under?
Primary CPC classification H01J37/065. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 18 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).