Method for manufacturing anisotropic conductive film, and anisotropic conductive film

Patent metadata

Field	Value
Publication number	US-12014840-B2
Application number	US-202117315862-A
Country	US
Kind code	B2
Filing date	May 10, 2021
Priority date	May 2, 2016
Publication date	Jun 18, 2024
Grant date	Jun 18, 2024

Abstract

Provided is an anisotropic conductive film manufacturing method capable of reducing manufacturing costs. Also provided is an anisotropic conductive film capable of suppressing the occurrence of conduction defects. The anisotropic conductive film manufacturing method includes: a holding step of supplying conductive particles having a plurality of particle diameters on a member having a plurality of opening parts, and holding the conductive particles in the opening parts; and a transfer step of transferring the conductive particles held in the opening parts to an adhesive film. In the particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the conductive particles held in the opening parts, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.

First claim

The invention claimed is:

1. A connection structure comprising:
a first component, a second component, and a filler disposition film to which the first component and the second component are adhered; wherein
the filler disposition film including: an insulating binder formed in a film shape; and a plurality of fillers disposed in a plan view on the insulating binder, wherein in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the filler, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter; and
in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers included in the filler disposition film, the shape of the graph is such that a difference in a cumulative distribution between a particle diameter D 10 of a quantity accumulation of 10% from a small side of a particle diameter and a particle diameter D 90 of a quantity accumulation of 90% thereof is greater than 25% of an average particle diameter.

2. The connection structure according to claim 1 , wherein the filler is a conductive particle, and the first electronic component and the second electronic component are anisotropically connected.

3. The connection structure according to claim 2 , wherein the filler disposition film is cured.

4. The connection structure according to claim 2 , wherein the conductive particle is covered by an insulator.

5. The connection structure according to claim 4 , wherein the filler disposition film is cured.

6. The connection structure according to claim 1 , wherein the filler disposition film is cured.

7. A method for manufacturing a connection structure, the method comprising:
a disposing step of disposing a first electronic component and a second electronic component with a filler disposition film interposed the first electronic component and the second electronic component, the filler disposition film including: an insulating binder formed in a film shape, and a plurality of fillers disposed in a plan view on the insulating binder, wherein in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter; in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers included in the filler disposition film, the shape of the graph is such that a difference in a cumulative distribution between a particle diameter D 10 of a quantity accumulation of 10% from a small side of a particle diameter and a particle diameter D 90 of a quantity accumulation of 90% thereof is greater than 25% of an average particle diameter; and
a compression bonding step of compression bonding the second electronic component to the first electronic component through a compression bonding tool.

8. The method for manufacturing a connection structure according to claim 7 , wherein the filler is a conductive particle, and the first electronic component and the second electronic component are anisotropically connected.

9. The method for manufacturing a connection structure according to claim 8 , wherein the insulating binder has curability.

10. The method for manufacturing a connection structure according to claim 8 , wherein the conductive particle is covered by an insulator.

11. A filler disposition film comprising:
an insulating binder formed in a film shape; and
a plurality of fillers disposed in a plan view on the insulating binder, wherein
in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the filler, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter; and
in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers included in the filler disposition film, the shape of the graph is such that a difference in a cumulative distribution between a particle diameter D 10 of a quantity accumulation of 10% from a small side of a particle diameter and a particle diameter D 90 of a quantity accumulation of 90% thereof is greater than 25% of an average particle diameter.

12. The filler disposition film according to claim 11 , wherein the filler is a conductive particle.

13. The filler disposition film according to claim 12 , wherein the conductive particle is covered by an insulator.

14. The filler disposition film according to claim 12 , wherein the insulating binder has curability.

15. The filler disposition film according to claim 11 , wherein the insulating binder has curability.

16. A method for manufacturing the filler disposition film according to claim 11 , the method comprising:
a holding step of supplying fillers having a plurality of particle diameters onto a member having a plurality of opening parts, and
holding the fillers in the opening parts; and
a transfer step of transferring the fillers held in the opening parts to an adhesive film, wherein
in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers held in the opening parts, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter, and
in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the fillers included in the adhesive film, the shape of the graph is such that a difference in a cumulative distribution between a particle diameter D 10 of a quantity accumulation of 10% from a small side of a particle diameter and a particle diameter D 90 of a quantity accumulation of 90% thereof is greater than 25% of an average particle diameter.

17. The method for manufacturing a filler disposition film according to claim 16 , wherein the adhesive film has curability.

Assignees

• Dexerials Corp

Inventors

• Nishimura Junichi

Classifications

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/074

  of anisotropic conductive adhesives · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/353

  not comprising solid metals or solid metalloids, e.g. ceramics · CPC title