Method of producing anisotropic conductive film and anisotropic conductive film

Patent metadata

Field	Value
Publication number	US-10272598-B2
Application number	US-201314422470-A
Country	US
Kind code	B2
Filing date	Aug 23, 2013
Priority date	Aug 24, 2012
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

Anisotropic conductive film produced that a light-transmitting transfer die having openings with conductive particles disposed therein is prepared, and photopolymerizable insulating resin squeezed into openings to transfer conductive particles onto the surface of the photopolymerizable insulating resin layer, first connection layer is formed which has a structure in which conductive particles are arranged in a single layer in a plane direction of photopolymerizable insulating resin layer and the thickness of photopolymerizable insulating resin layer in central regions between adjacent ones of the conductive particles is smaller than thickness of photopolymerizable insulating resin layer in regions in proximity to conductive particles; first connection layer is irradiated with ultraviolet rays through light-transmitting transfer die; release film is removed from first connection layer; second connection layer is formed on the surface of first connection layer opposite to light-transmitting transfer die; and third connection layer is formed on the surface of first connection layer.

First claim

The invention claimed is:

1. A method of producing an anisotropic conductive film having a three-layer structure in which a first connection layer is held between a second connection layer and a third connection layer, which are each formed mainly of an insulating resin, the method comprising the following steps (A) to (F):
Step (A)
disposing conductive particles within openings formed in a light-transmitting transfer die and placing, on the transfer die, a photopolymerizable insulating resin layer formed on a release film such that the photopolymerizable insulating resin layer faces a surface of the transfer die on which the openings are formed;
Step (B)
applying pressure to the photopolymerizable insulating resin layer through the release film to squeeze a photopolymerizable insulating resin into the openings to thereby transfer the conductive particles onto a surface of the photopolymerizable insulating resin layer, whereby the first connection layer is formed, the first connection layer having a structure in which the conductive particles are arranged in a single layer in a plane direction of the photopolymerizable insulating resin layer and in which the photopolymerizable insulating resin layer in central regions between directly adjacent conductive particles has a thickness smaller than that of the photopolymerizable insulating resin layer in regions in proximity to the conductive particles;
Step (C)
irradiating the first connection layer with ultraviolet rays through the light-transmitting transfer die;
Step (D)
removing the release film from the first connection layer;
Step (E)
forming the second connection layer, which is formed mainly of the insulating resin, on a surface of the first connection layer that is opposite to the light-transmitting transfer die; and
Step (F)
forming the third connection layer, which is formed mainly of the insulating resin, on a surface of the first connection layer that is opposite to the second connection layer,
wherein ratios of a minimum melt viscosity of the first connection layer to a minimum melt viscosity of the second connection layer and to a minimum melt viscosity of the third connection layer are each 1:4 to 400.

2. The production method according to claim 1 , wherein in the step (B), the thickness of the photopolymerizable insulating resin layer in the central regions between directly adjacent conductive particles relative to the thickness of the photopolymerizable insulating resin layer in the regions in proximity to the conductive particles is set to a ratio of 0.2 to 0.8.

3. The production method according to claim 1 , wherein in the step (D), a degree of cure of the first connection layer in a region positioned between the conductive particle and a surface of the first connection layer that faces the second connection layer is made lower than a degree of cure of the first connection layer in a region positioned between adjacent ones of the conductive particles.

4. A method of connecting a first electronic component to a second electronic component by anisotropic conductive connection using the anisotropic conductive film obtained by the production method according to claim 1 , the method comprising:
temporarily applying the anisotropic conductive film to the second electronic component through the third connection layer of the anisotropic conductive film; mounting the first electronic component on the temporarily applied anisotropic conductive film; and performing thermocompression bonding through the first electronic component.

5. The connection method according to claim 4 , wherein the second electronic component is a circuit board, and the first electronic component is an IC chip.

6. An anisotropic conductive film having a three-layer structure in which a first connection layer is held between a second connection layer and a third connection layer, which are each formed mainly of an insulating resin, wherein
a boundary between the first connection layer and the third connection layer is undulated,
the first connection layer has a structure in which conductive particles are arranged on a side facing the third connection layer in a single layer in a plane direction of an insulating resin layer,
a thickness of the insulating resin layer in central regions between directly adjacent conductive particles is smaller than a thickness of the insulating resin layer in regions in proximity to the conductive particles, prior to use with an electronic component, and
ratios of a minimum melt viscosity of the first connection layer to a minimum melt viscosity of the second connection layer and to a minimum melt viscosity of the third connection layer are each 1:4 to 400.

7. The anisotropic conductive film according to claim 6 , wherein the second connection layer is a layer disposed on a terminal side on which relatively high positional alignment accuracy is required, and the third connection layer is a layer disposed on a terminal side on which relatively low positional alignment accuracy is required.

8. The anisotropic conductive film according to claim 6 , wherein the first connection layer is a thermal- or photo-radical polymerizable resin layer containing an acrylate compound and a thermal- or photo-radical polymerization initiator or a layer obtained by subjecting the thermal- or photo-radical polymerizable resin layer to thermal- or photo-radical polymerization; or a thermal- or photo-cationic or anionic polymerizable resin layer containing an epoxy compound and a thermal- or photo-cationic or anionic polymerization initiator or a layer obtained by subjecting the thermal- or photo-cationic or anionic polymerizable resin layer to thermal- or photo-cationic or anionic polymerization.

9. The anisotropic conductive film according to claim 6 , wherein the conductive particles dig into the third connection layer.

10. The anisotropic conductive film according to claim 6 , wherein a degree of cure of the first connection layer in regions positioned between the conductive particles and a surface of the first connection layer that faces the second connection layer is lower than a degree of cure of the first connection layer in regions positioned between adjacent ones of the conductive particles.

11. The anisotropic conductive film according to claim 6 , wherein the thickness of the insulating resin layer in central regions between directly adjacent conductive particles is substantially zero.

12. The anisotropic conductive film according to claim 6 , wherein the conductive particles are present in the third connection layer.

13. An anisotropic conductive connection structure comprising a first electronic component and a second electronic component that are connected to each other by the anisotropic conductive film according to claim 8 .

14. The anisotropic conductive connection structure according to claim 13 , wherein the first electronic component is an IC chip and the second electronic component is a circuit board.

15. The anisotropic conductive film according to claim 6 , wherein
a ratio of the thickness of the insulating resin layer in central regions between directly adjacent conductive particles to the thickness of the insulating resin layer in regions in proximity to the conductive particles is 0.2 to 0.8.

16. An anisotropic conductive film having a three-layer structure in which a first connection layer is held between a second connection layer and a third connection layer, which are each formed mainly of an insulating resin, wherein
a boundary between the first connection layer and the third connection layer is undulated,
the first co

Assignees

• Dexerials Corp

Inventors

• Shinohara Seiichiro
• Akutsu Yasushi

Classifications

• H10W72/354

  comprising polymers · CPC title

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• H10W72/322

  Multilayered die-attach connectors, e.g. a coating on a top surface of a core · CPC title