Manufacturing apparatus and method of manufacturing display apparatus using the same

US12010902B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12010902-B2
Application numberUS-202016792948-A
CountryUS
Kind codeB2
Filing dateFeb 18, 2020
Priority dateMay 8, 2019
Publication dateJun 11, 2024
Grant dateJun 11, 2024

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus for manufacturing a display apparatus includes: a polisher at which a polishing material is supplied to a base member of the display apparatus and the base member is polished with the polishing material to provide a polished base member having a polished surface; a conveyer to which the polished base member is provided from the polisher and from which the polished base member is transferred to outside the apparatus; and a suction unit corresponding to the conveyer and by which a pressure around the conveyer is provided to be lower than a pressure at remaining portions of the apparatus.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for manufacturing a display apparatus, the apparatus comprising: a polisher at which a polishing material comprising a liquid is supplied to a base member of the display apparatus and the base member is polished with the polishing material to provide a polished base member having a polished surface; a conveyer to which the polished base member is provided from the polisher and from which the polished base member is transferred to outside the apparatus; and a suction unit which faces the conveyer, wherein the polished base member provided to the conveyer comprises: the polished surface facing the suction unit, and a portion of the polishing material which remains on the polished surface of the polished base member to define a remaining polishing material on the polished base member, and operation of the suction unit relative to the polished surface facing the suction unit provides a pressure between the polished surface and the suction unit, the pressure maintaining a level of the liquid in the remaining polishing material of the polished base member relative to a total weight of the remaining polishing material on the polished base member. 2. The apparatus of claim 1 , further comprising a feeder with which the base member is transferred to the polisher, wherein at least one of the feeder and the conveyer comprises a roller with which the base member is movable along the apparatus. 3. The apparatus of claim 1 , wherein the operation of the suction unit further provides the pressure between the suction unit and a portion of the polisher which directly precedes the conveyor. 4. The apparatus of claim 1 , wherein the pressure between the polished surface and the suction unit maintains the level of the liquid in the remaining polishing material which is equal to or greater than about 90% of the total weight of the remaining polishing material on the polished base member. 5. The apparatus of claim 1 , further comprising a polishing head corresponding to the polisher and with which the base member is polished at the polisher to provide the polished base member having the polished surface; wherein the polisher comprises a belt with which the base member is movable along the apparatus to be disposed corresponding to the polishing head, and the operation of the suction unit further provides the pressure between the suction unit and a portion of the belt which directly precedes the conveyor. 6. The apparatus of claim 1 , wherein the suction unit comprises: a suction pipe spaced apart from and facing the conveyer and into which a gas at the conveyer is drawn, the suction pipe comprising an inlet portion through which the gas at the conveyer is drawn into to the suction pipe, the inlet portion spaced apart from and facing the conveyer to define a space which is between the polished surface and the suction unit and extends along the conveyor from the polished base member in a direction towards the polisher; and a guide pipe connected to the suction pipe. 7. The apparatus of claim 6 , wherein a cross-sectional area defined by the inlet portion of the suction pipe is greater than a cross-sectional area of the guide pipe. 8. The apparatus of claim 6 , wherein the inlet portion of the suction pipe corresponds to the conveyer and a portion of the polisher which directly precedes the conveyor, and the operation of the suction unit provides the pressure between the inlet portion of the suction unit and the polished surface and between the inlet portion of the suction unit and the portion of the polisher which directly precedes the conveyor. 9. The apparatus of claim 6 , wherein a wall of the suction pipe at the inlet portion thereof is inclined.

Assignees

Inventors

Classifications

  • Apparatus for mechanical treatment or grinding or cutting · CPC title

  • Active-matrix OLED [AMOLED] displays · CPC title

  • H10K71/00Primary

    Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

  • B24B37/04Primary

    designed for working plane surfaces · CPC title

  • for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

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Frequently asked questions

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What does patent US12010902B2 cover?
An apparatus for manufacturing a display apparatus includes: a polisher at which a polishing material is supplied to a base member of the display apparatus and the base member is polished with the polishing material to provide a polished base member having a polished surface; a conveyer to which the polished base member is provided from the polisher and from which the polished base member is tr…
Who is the assignee on this patent?
Samsung Display Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10K71/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 11 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).