Systems for surface mounting electronic components on a printed circuit board

Patent metadata

Field	Value
Publication number	US-12010800-B2
Application number	US-202117305108-A
Country	US
Kind code	B2
Filing date	Jun 30, 2021
Priority date	Aug 31, 2020
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

In a first approach, a vacuum cell comprises a porous plate and a vacuum force generated by gas being drawn thorough the porous plate is used to pick electronic components from a donor substrate. After transport of the vacuum cell to a placing area, dots of liquid material may be deposited on a top surface of the porous plate adjacent to one or more picked components in order to disrupt the vacuum force and release the picked components onto a receiving substrate. In a refinement of the first approach, the porous plate contains a plurality of picking holes for selectively picking components. Certain picking holes can be fluidly coupled to the vacuum, allowing components to be attached within those picking holes, while other picking holes can be closed or rendered inactive with dots of liquid material deposited on a top surface of the porous plate.

First claim

What is claimed is:

1. A system for surface mounting electronic components on a printed circuit board, the system comprising:
a vacuum cell configured for picking the electronic components; and
an inkjet print head configured to cause a first one of the electronic components to detach from the vacuum cell by emitting one or more droplets of a solvent towards a surface of the vacuum cell at which the first electronic component is held to break a holding vacuum of the vacuum cell exerted on the first electronic component at a desired release point.

2. The system of claim 1 , wherein the vacuum cell is closed by a porous substrate or a micro hole array plate on at least one side or part thereof.

3. The system of claim 1 , further comprising a controller configured to control a temperature and humidity of the vacuum cell.

4. The system of claim 1 , wherein the inkjet print head is translatable inside the vacuum cell by a piezo element.

5. The system of claim 1 , wherein the electronic components include one or more of a resistor, a light emitting diode (LED) or an integrated circuit (IC).

6. The system of claim 1 , further comprising an inspection station configured to inspect the electronic components as held by the vacuum cell before placement of the electronic components on a receiving substrate or after placement of the electronic components on the receiving substrate.

7. The system of claim 1 , wherein the solvent is selected according to a vacuum level and temperature and is one of: water, ethanol, glycol or an organic solvent.

8. The system of claim 1 , wherein the inkjet print head is configured to cause the electronic components to detach from the vacuum cell and includes multiple nozzles to pick and place multiple ones of the electronic components at the same time.

9. The system of claim 1 , wherein the vacuum cell includes a substrate structured so as to reduce solvent penetration, to reduce electrostatic forces on one of the electronic components when attached thereto, and to align the one of the electronic components to a target area in X, Y, and Z directions.

10. A system for surface mounting electronic components on a printed circuit board, the system comprising:
a vacuum cell configured for picking the electronic components; and
a laser-based element configured to cause a first one of the electronic components to detach from the vacuum cell by heating a solvent at a detachment point inside the vacuum cell, wherein a vapor pressure of the solvent and a pressure inside the vacuum cell are selected with respect to one another so that the solvent vaporizes upon the heating of the solvent.

11. The system of claim 10 , wherein the vacuum cell is closed by a porous substrate or a micro hole array plate on at least one side or part thereof.

12. The system of claim 10 , further comprising a controller configured to control a temperature and humidity of the vacuum cell.

13. The system of claim 10 , wherein the electronic components include one or more of a resistor, a light emitting diode (LED) or an integrated circuit (IC).

14. The system of claim 10 , further comprising an inspection station configured to inspect the electronic components as held by the vacuum cell before placement of the electronic components on a receiving substrate or after placement of the electronic components on the receiving substrate.

15. The system of claim 10 , wherein the solvent is selected according to a vacuum level and temperature and is one of: water, ethanol, glycol or an organic solvent.

16. The system of claim 10 , wherein the vacuum cell includes a substrate structured so as to reduce solvent penetration, to reduce electrostatic forces on one of the electronic components when attached thereto, and to align the one of the electronic components to a target area in X, Y, and Z directions.

Assignees

• Io Tech Group Ltd

Inventors

• Zenou Michael
• Gilan Ziv
• Nesher Guy

Classifications

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10H29/02

  using pick-and-place processes · CPC title

• Y10T29/53174

  Means to fasten electrical component to wiring board, base, or substrate · CPC title

• H05K3/301

  by means of a mounting structure (H05K3/325 takes precedence) · CPC title

• B65G47/91

  incorporating pneumatic, e.g. suction, grippers · CPC title