Flexible interconnect circuits and methods of fabrication thereof

Patent metadata

Field	Value
Publication number	US-12010792-B2
Application number	US-202318351437-A
Country	US
Kind code	B2
Filing date	Jul 12, 2023
Priority date	Feb 22, 2022
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.

First claim

The invention claimed is:

1. A flexible interconnect circuit comprising:
a first insulator layer;
a second insulator layer;
conductive traces partially protruding between the first insulator layer and the second insulator layer and comprising contact portions, extending past the first insulator layer and the second insulator layer; and
a support end comprising temporary support links, to which the contact portions of the conductive traces extend and connect, wherein:
each of the temporary support links is monolithic with a corresponding one of the conductive traces, and
each of the temporary support links is configured to fracture and separate from the corresponding one of the conductive traces when removing the support end from a remaining part of the flexible interconnect circuit.

2. The flexible interconnect circuit of claim 1 , wherein all of the conductive traces and all of the temporary support links are formed from same metal sheet.

3. The flexible interconnect circuit of claim 1 , wherein the temporary support links have a weaker mechanical structure than the conductive traces such that the temporary support links fracture before the conductive traces when a force is applied to the temporary support links or the conductive traces.

4. The flexible interconnect circuit of claim 3 , wherein a tensile strength of the temporary support links is less than 50% of a tensile strength of the conductive traces.

5. The flexible interconnect circuit of claim 3 , wherein a tensile strength of the temporary support links is less than 25% of a tensile strength of the conductive traces.

6. The flexible interconnect circuit of claim 3 , wherein a tensile strength of the temporary support links is less than 10% of a tensile strength of the conductive traces.

7. The flexible interconnect circuit of claim 3 , wherein the temporary support links have a smaller thickness than the conductive traces.

8. The flexible interconnect circuit of claim 7 , wherein a thickness of the temporary support links is less than 50% of a thickness of the conductive traces.

9. The flexible interconnect circuit of claim 7 , wherein a thickness of the temporary support links is less than 25% of a thickness of the conductive traces.

10. The flexible interconnect circuit of claim 7 , wherein a thickness of the temporary support links is less than 10% of a thickness of the conductive traces.

11. The flexible interconnect circuit of claim 7 , wherein the smaller thickness of the temporary support links is achieved by ablation.

12. The flexible interconnect circuit of claim 3 , wherein the temporary support links have a smaller width than the conductive traces.

13. The flexible interconnect circuit of claim 3 , wherein a width of the temporary support links is less than 50% of a width of the conductive traces.

14. The flexible interconnect circuit of claim 3 , wherein the temporary support links comprises one or both cuts and perforations forming the weaker mechanical structure of the temporary support links relative to the conductive traces.

15. The flexible interconnect circuit of claim 1 , wherein the support end is formed by a portion of the first insulator layer, a portion of the second insulator layer, and portions of the support end, extending between the portion of the first insulator layer and the portion of the second insulator layer.

16. The flexible interconnect circuit of claim 1 , wherein the conductive traces, the contact portions, and the temporary support links are patterned from a same conductive sheet.

17. A method of attaching a connector to a flexible interconnect circuit, the method comprising: providing the flexible interconnect circuit comprising a first insulator layer, a second insulator layer, conductive traces, and a support end, wherein: the conductive traces partially protrude between the first insulator layer and the second insulator layer and comprise contact portions, extending past the first insulator layer and the second insulator layer, the support end comprising temporary support links, to which the contact portions of the conductive traces extend and connect, each of the temporary support links is monolithic with a corresponding one of the conductive traces, and each of the temporary support links is configured to fracture and separate from the corresponding one of the conductive traces when removing the support end from a remaining part of the flexible interconnect circuit; providing the connector comprising a first connector portion and second connector portion, wherein the first connector portion comprises connector conductive traces; positioning the flexible interconnect circuit over the first connector portion of the connector such that the contact portions of the flexible interconnect circuit extend over and align relative to the connector conductive traces, while supported by the temporary support links; and advancing the second connector portion to the flexible interconnect circuit while the second connector portion pushes on the contact portions or the temporary support links and fractures the temporary support links thereby freeing the contact portions from the support end such that the contact portions move toward, interface, and form electrical connections with the connector conductive traces.

18. The method of claim 17 , further comprising engaging the first connector portion with the second connector portion thereby forming a connector body.

19. The method of claim 17 , wherein positioning the flexible interconnect circuit over the first connector portion is performed using an assembly fixture comprising an alignment cavity and alignment pins.

20. The method of claim 19 , wherein positioning the flexible interconnect circuit over the first connector portion comprises: protruding the alignment pins through aligning features of the flexible interconnect circuit, and positioning the first connector portion into the alignment cavity.

Assignees

• Cellink Corp

Inventors

• Ortiz Jean-Paul
• Brown Malcom Parker
• Terlaak Mark
• Findlay Will
• Coakley Kevin Michael
• Anderson Casey

Classifications

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H05K3/02

  in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding · CPC title

• H05K2201/055

  Folded back on itself · CPC title

• H05K2201/09027

  Non-rectangular flat PCB, e.g. circular · CPC title

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title