Camera module and photosensitive assembly thereof, electronic device, and manufacturing method

Patent metadata

Field	Value
Publication number	US-12010412-B2
Application number	US-202017607947-A
Country	US
Kind code	B2
Filing date	Feb 28, 2020
Priority date	Apr 30, 2019
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip. The molded base is integrally combined with the photosensitive chip, the at least one resistance-capacitance device, and the expanded wiring layer.

First claim

What is claimed is:

1. A photosensitive assembly, characterized by comprising:
a photosensitive chip, including a photosensitive area and an electric connection area located around the photosensitive area;
at least one resistance-capacitance device;
an expanded wiring assembly, wherein the photosensitive chip and the at least one resistance-capacitance device is electrically connected to the expanded wiring assembly, respectively, so that the at least one resistance-capacitance device and the photosensitive chip are conducted by means of the expanded wiring assembly, and the expanded wiring assembly includes an expanded wiring layer having a top surface and a bottom surface and a conducting element, and the at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer, and the conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element, and a light hole is formed in the expanded wiring layer and corresponds to at least the photosensitive area of the photosensitive chip; and
a molded base, in which the photosensitive chip and the resistance-capacitance device are received respectively and on which the expanded wiring layer is supported;
wherein the expanded wiring layer includes an expanded circuit having a first electric connection end and a second electric connection end, and the first electric connection end is electrically connected to the conducting element, and the second electric connection end extends laterally from the first electric connection end in a direction away from the conducting element and is electrically connected to the at least one resistance-capacitance device.

2. The photosensitive assembly of claim 1 , further including: a light-transmitting element stacked on the photosensitive chip to cover at least the photosensitive area of the photosensitive chip.

3. The photosensitive assembly of claim 1 , wherein the light-transmitting element is implemented as a filter element or a protective element.

4. The photosensitive assembly of claim 2 , wherein a height dimension of the light-transmitting element is equal to a height dimension of the conducting element.

5. The photosensitive assembly of claim 1 , wherein the at least one resistance-capacitance device is located on two sides of the photosensitive chip.

6. The photosensitive assembly of claim 5 , wherein the photosensitive chip and the at least one resistance-capacitance device are located on the same side of the expanded wiring assembly.

7. The photosensitive assembly of claim 1 , wherein the top surface of the expanded wiring layer forms a top surface of the photosensitive assembly, and the top surface of the expanded wiring layer is a plane.

8. The photosensitive assembly of claim 1 , wherein a size of the first electric connection end is smaller than that of the second electric connection end.

9. The photosensitive assembly of claim 4 , wherein a size of the first electric connection end is smaller than that of the second electric connection end.

10. The photosensitive assembly of claim 1 , wherein the molded base has a conducting element receiving hole extending between the electric connection area of the photosensitive chip and the bottom surface of the expanded wiring layer for receiving the conducting element.

11. The photosensitive assembly of claim 1 , wherein the expanded wiring assembly further includes a second expanded wiring layer which is electrically connected to the expanded wiring layer and located on a bottom side of the photosensitive assembly, and the photosensitive assembly further includes a circuit external connection layer electrically connected to a bottom surface of the second expanded wiring layer.

12. The photosensitive assembly of claim 1 , wherein the molded base is integrally combined with the photosensitive chip and the resistance-capacitance device.

13. The photosensitive assembly of claim 12 , wherein the molded base is integrally combined with the conducting element.

14. A camera module, characterized by comprising:
a photosensitive assembly of claim 1 ; and
an optical lens, held in a photosensitive path of the photosensitive assembly.

15. The camera module of claim 14 , further including: a lens carrying element mounted to the top surface of the first expanded wiring layer and corresponding to the photosensitive path of the photosensitive assembly, wherein the optical lens is mounted to the lens carrying element so that the optical lens is held in the photosensitive path of the photosensitive assembly.

16. The camera module of claim 15 , wherein the lens carrying element is a static support element.

17. The camera module of claim 15 , wherein the lens carrying element is a drive element.

18. A photosensitive assembly manufacturing method, characterized by comprising the following steps:
electrically connecting a conducting element to an electric connection area of a photosensitive chip, wherein the conducting element extends upwards from the electric connection area of the photosensitive chip in a direction away from the photosensitive chip;
forming a molded base to be integrally combined with the photosensitive chip, at least one resistance-capacitance device, and the conducting element;
forming an expanded wiring layer on the molded base to electrically connect the at least one resistance-capacitance device and the conducting element; and
forming a light hole in the expanded wiring layer, wherein the light hole corresponds to at least the photosensitive area of the photosensitive chip.

19. The photosensitive assembly manufacturing method of claim 18 , further including the following step before forming the molded base:
stacking a light-transmitting element on the photosensitive chip to cover at least the photosensitive area of the photosensitive chip.

20. The photosensitive assembly manufacturing method of claim 18 , further including the following step when the light-transmitting element is implemented as a sacrificial element:
removing the sacrificial element stacked on the photosensitive chip.

Assignees

• Ningbo Sunny Opotech Co Ltd

Inventors

• Wang Mingzhu
• Tanaka Takehiko
• Liu Xiaodi
• Huang Zhen
• Chen Zhenyu

Classifications

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H04N23/50 Primary

  Constructional details · CPC title