Thermosetting resin composition, resin sheet, laminate, and printed wiring board

Patent metadata

Field	Value
Publication number	US-12006433-B2
Application number	US-202017426917-A
Country	US
Kind code	B2
Filing date	Jan 30, 2020
Priority date	Jan 31, 2019
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.

First claim

The invention claimed is:

1. A thermosetting resin composition comprising:
a radical polymerizable unsaturated compound (A);
an organic radical compound (C), and
a styrene-based elastomer (E);
the radical polymerizable unsaturated compound (A) containing:
a copolymer (A1) having a structural unit derived from mono-olefin and a structural unit derived from diene; and
a terminal modified polyphenylene ether compound (A2), and
a content of the elastomer (E) falling within the range from 5 parts by mass to 100 parts by mass with respect to 100 parts by mass in total of the copolymer (A1) and the compound (A2).

2. The thermosetting resin composition of claim 1 , further containing a thermal radical polymerization initiator (B).

3. The thermosetting resin composition of claim 2 , wherein
the thermal radical polymerization initiator (B) contains at least one compound selected from the group consisting of: a t-amyl peroxide-based polymerization initiator; and a t-hexyl peroxide-based polymerization initiator.

4. The thermosetting resin composition of claim 1 , wherein
the organic radical compound (C) contains an organic nitroxide radical compound (C1).

5. The thermosetting resin composition of claim 1 , further containing a metal deactivator (D).

6. The thermosetting resin composition of claim 1 , further containing an inorganic filler (F).

7. The thermosetting resin composition of claim 6 , wherein
the inorganic filler (F) contains silica subjected to surface treatment with a polymerizable organic compound.

8. The thermosetting resin composition of claim 1 , further containing a flame retardant (G).

9. A resin sheet comprising a dried product or semi-cured product of the thermosetting resin composition of claim 1 .

10. A laminate comprising
an insulating layer and
a sheet of metal foil,
the insulating layer containing a cured product of the thermosetting resin composition of claim 1 .

11. A printed wiring board comprising an insulating layer and conductor wiring,
the insulating layer containing a cured product of the thermosetting resin composition of claim 1 .

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Aoki Kouichi
• Aoki Tomoyuki
• Saito Eiichiro

Classifications

• C08F255/06 Primary

  on to ethylene-propylene-diene terpolymers {(C08F255/023 takes precedence)} · CPC title

• C08F283/08

  on to polyphenylene oxides · CPC title

• H05K2201/0195

  Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure · CPC title

• H05K3/4673

  Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28) · CPC title

• H05K3/4611

  by laminating two or more circuit boards (H05K3/4652 takes precedence) · CPC title