Staircase etch control in forming three-dimensional memory device
US-2019051610-A1 · Feb 14, 2019 · US
US11996303B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11996303-B2 |
| Application number | US-202318328645-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 2, 2023 |
| Priority date | Jul 6, 2018 |
| Publication date | May 28, 2024 |
| Grant date | May 28, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A substrate cleaning device includes: a pressing member that cleans a substrate by contacting the substrate; a load measurement unit that measures a pressing load of the cleaning member; and a control unit that repeats an operation of comparing the measurement value of the load measurement unit with the setting load, changing the pressing amount of the cleaning member by a first movement amount so that a difference value decreases, when the difference value is larger than a first threshold value and equal to or smaller than a second threshold value, and changing the pressing amount of the cleaning member by a second movement amount larger than the first movement amount so that the difference value decreases, when the difference value is larger than the second threshold value, until the difference value becomes equal to or smaller than the first threshold value.
Opening claim text (preview).
What is claimed is: 1. A substrate cleaning device comprising: a first cleaning member configured to clean a first surface of a substrate by contacting the first surface of the substrate; a first member rotation unit configured to rotate the first cleaning member; a first member drive unit configured to press the first cleaning member against the first surface of the substrate; a first load measurement unit configured to measure a pressing load of the first cleaning member; a second cleaning member configured to clean a second surface of the substrate by contacting the second surface of the substrate; a second member rotation unit configured to rotate the second cleaning member; a second member drive unit configured to press the second cleaning member against the second surface of the substrate; a second load measurement unit configured to measure a pressing load of the second cleaning member; and a control unit configured to control a pressing amount of the first cleaning member by the first member drive unit and a pressing amount of the second cleaning member by the second member drive unit, on the basis of a measurement value of the first load measurement unit and a measurement value of the second load measurement unit, so that the pressing load of the first cleaning member becomes a first setting load and the pressing load of the second cleaning member becomes a second setting load, wherein the control unit is configured to execute a first step of controlling the first member drive unit and the second member drive unit so that the first cleaning member moves at a first movement speed from a first initial position separated from the first surface of the substrate by a first distance to a first proximity position separated from the first surface of the substrate by a third distance and the second cleaning member moves at a second movement speed from a second initial position separated from the second surface of the substrate by a second distance shorter than the first distance to a second proximity position separated from the second surface of the substrate by the third distance and a second step of controlling the first member drive unit and the second member drive unit so that the first cleaning member and the second cleaning member simultaneously start moving at a third movement speed lower than the first movement speed and simultaneously contact the first surface of the substrate and the second surface of the substrate, respectively, and the control unit is configured to determine, before the first step, the second movement speed of the second cleaning member by the second member drive unit, on the basis of the first movement speed of the first cleaning member by the first member drive unit, so that the first cleaning member disposed at the first initial position and the second cleaning member disposed at the second initial position simultaneously start the moving and the second cleaning member reaches the second proximity position at timing identical to timing when the first cleaning member reaches the first proximity position. 2. The substrate cleaning device according to claim 1 , wherein each of the first cleaning member and the second cleaning member is a roll cleaning member. 3. The substrate cleaning device according to claim 1 , wherein each of the first member drive unit and the second member drive unit is an electric actuator. 4. A substrate processing apparatus comprising the substrate cleaning device according to claim 1 .
comprising at least one polishing chamber · CPC title
using mainly scrubbing means, e.g. brushes · CPC title
Cleaning only by mechanical processes · CPC title
Process monitoring, e.g. flow or thickness monitoring · CPC title
using mainly spraying means, e.g. nozzles · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.