Transferable light emitting device array and production method thereof

Patent metadata

Field	Value
Publication number	US-11990558-B2
Application number	US-202016908114-A
Country	US
Kind code	B2
Filing date	Jun 22, 2020
Priority date	Jun 24, 2019
Publication date	May 21, 2024
Grant date	May 21, 2024

Abstract

A method for producing a transferable array of light emitting devices includes forming a plurality of light emitting devices on a temporary substrate, forming at least one supporting member that is directly connected to a release layer of at least one of the light emitting devices, connecting a supporting substrate only with the at least one supporting member so that the at least one supporting member extends from the release layer of the at least one of the light emitting devices to the supporting substrate and so that the light emitting devices are spaced apart from the supporting substrate, and removing the temporary substrate. The transferable array produced by the method is also disclosed.

First claim

What is claimed is:

1. A method for producing a transferable array of light emitting devices, comprising:
forming, on a temporary substrate, a plurality of light emitting devices, each of which includes a light emitting structure and a release layer disposed over the light emitting structure;
forming at least one supporting member so that the at least one supporting member is directly connected to the release layer of at least one of the light emitting devices, the at least one supporting member being made from a curable resin;
connecting a supporting substrate only with the at least one supporting member so that the at least one supporting member extends from the release layer of the at least one of the light emitting devices to the supporting substrate for supporting the light emitting devices on the supporting substrate, and so that each of the light emitting devices is spaced apart from the supporting substrate by an air gap; and
removing the temporary substrate,
wherein the method further includes:
before formation of the light emitting devices, forming an intermediate layer on the temporary substrate such that the light emitting devices are formed on the intermediate layer opposite to the temporary substrate; and
after connection of the supporting substrate only with the at least one supporting member, removing the intermediate layer, and
wherein the intermediate layer has at least one recess indented from a top surface of the intermediate layer opposite to the temporary substrate, the at least one supporting member having a bottom part and embedded in the intermediate layer in a manner that the bottom part is disposed in the at least one recess.

2. The method of claim 1 , wherein the release layer of each of the light emitting devices is further disposed on the temporary substrate, and has a first portion that is disposed over the light emitting structure of a respective one of the light emitting devices, and at least one second portion that extends from the first portion to terminate at a terminal end and is disposed only on the temporary substrate, the at least one supporting member further having a top part connected with the supporting substrate, and an intermediate part interconnecting the top and bottom parts, one of the bottom and intermediate parts being directly connected to the second portion of the release layer of the at least one of the light emitting devices to form a bridge structure that supports the light emitting devices on the supporting substrate.

3. The method of claim 2 , wherein a plurality of the supporting members are disposed on the temporary substrate, the supporting members being selected from supporting pillars in an array, supporting mesa components for forming supporting mesas in an array, and patterned supporting frames.

4. The method of claim 2 , wherein the at least one supporting member has a height greater than that of each of the light emitting devices, and is connected only to the second portion of the release layer of the at least one of the light emitting devices.

5. The method of claim 2 , wherein the confronting second portions of the release layers of two adjacent ones of the light emitting devices are spaced apart from each other, the supporting member being disposed between the spaced apart confronting second portions to cooperatively form the bridge structure with the spaced apart confronting second portions.

6. The method of claim 5 , wherein the bottom part of the at least one supporting member is disposed completely on the temporary substrate, the at least one supporting member being connected only to the terminal ends of the spaced apart confronting second portions of the release layers of the two adjacent ones of the light emitting devices at the intermediate part of the at least one supporting member.

7. The method of claim 5 , wherein the intermediate part of the supporting member is connected to and partially disposed on the spaced apart confronting second portions of the release layers of the two adjacent ones of the light emitting devices.

8. The method of claim 2 , wherein the confronting second portions of the release layers of two adjacent ones of the light emitting devices have a reduced length that extends in a first direction, and that is shorter than a width of the corresponding light emitting structure extending in the first direction.

9. The method of claim 1 , wherein the light emitting devices have a width of not greater than 100 μm.

10. The method of claim 2 , wherein the at least one supporting member is directly connected to the release layer of the at least one of the light emitting devices only at the at least one second portion.

11. The method of claim 1 , further comprising disposing an adhesive layer between the at least one supporting member and the supporting substrate, so that the at least one supporting member is connected with the supporting substrate.

12. The method of claim 2 , wherein the release layer of each of the light emitting devices has at least one second portion that is disposed at one side of the respective one of the light emitting devices.

13. The method of claim 2 , wherein the release layer of each of the light emitting devices has at least two of the second portions that are respectively disposed at sides of a corresponding one of the light emitting devices.

14. The method of claim 1 , wherein the release layer of each of the light emitting devices is an insulation layer, and is disposed over a surface of the light emitting structure of a corresponding one of the light emitting devices.

Assignees

• Xiamen Sanan Optoelectronics Co Ltd

Inventors

• Meng Cheng
• Tsai Chingyuan
• Wu Chun-I

Classifications

• H10W90/00

  Package configurations · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/7428

  used to support diced chips prior to mounting · CPC title

• H10P72/741

  the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip · CPC title