Method for producing electronic device comprising solar cell structure along with drive circuit

Patent metadata

Field	Value
Publication number	US-11990459-B2
Application number	US-202017600873-A
Country	US
Kind code	B2
Filing date	Mar 16, 2020
Priority date	Apr 9, 2019
Publication date	May 21, 2024
Grant date	May 21, 2024

Abstract

The present invention is a method for producing an electronic device having a drive circuit including a solar cell structure, the method including the steps of: obtaining a bonded wafer by bonding a first wafer having a plurality of independent solar cell structures including a compound semiconductor, the solar cell structures being formed on a starting substrate by epitaxial growth, and a second wafer having a plurality of independent drive circuits formed, so that the plurality of solar cell structures and the plurality of drive circuits are respectively superimposed; wiring the bonded wafer so that electric power can be supplied from the plurality of solar cell structures to the plurality of drive circuits respectively; and producing an electronic device having the drive circuit including the solar cell structure by dicing the bonded wafer. This provides a method for producing an electronic device including a drive circuit and a solar cell structure in one chip and having a suppressed production cost.

First claim

The invention claimed is:

1. A method for producing an electronic device having a drive circuit comprising a solar cell structure, the method comprising the steps of:
obtaining a bonded wafer by bonding a first wafer having a plurality of independent solar cell structures comprising a compound semiconductor, the plurality of independent solar cell structures being formed on a starting substrate by epitaxial growth, and a second wafer having a plurality of independent drive circuits formed, so that the plurality of independent solar cell structures and the plurality of independent drive circuits are respectively superimposed;
wiring the bonded wafer so that an electric power can be supplied from the plurality of independent solar cell structures to the plurality of independent drive circuits respectively; and
producing the electronic device having the drive circuit comprising the solar cell structure by dicing the bonded wafer.

2. The method for producing an electronic device according to claim 1 , wherein the bonding is carried out using a thermosetting adhesive.

3. The method for producing an electronic device according to claim 2 , wherein the thermosetting adhesive has a thickness of 2.0 μm or more.

4. The method for producing an electronic device according to claim 1 , wherein the starting substrate is isolated from the bonded wafer after carrying out the bonding.

5. The method for producing an electronic device according to claim 2 , wherein the starting substrate is isolated from the bonded wafer after carrying out the bonding.

6. The method for producing an electronic device according to claim 3 , wherein the starting substrate is isolated from the bonded wafer after carrying out the bonding.

7. The method for producing an electronic device according to claim 1 , wherein
the wiring is carried out by:
providing a pad electrode in the second wafer before carrying out the bonding so that the electric power can be supplied to the drive circuit;
forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that the electric power can be extracted from the solar cell structure of the first wafer; and
electrically connecting the pad electrode and the electrode for the solar cell structure.

8. The method for producing an electronic device according to claim 2 , wherein
the wiring is carried out by:
providing a pad electrode in the second wafer before carrying out the bonding so that the electric power can be supplied to the drive circuit;
forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that the electric power can be extracted from the solar cell structure of the first wafer; and
electrically connecting the pad electrode and the electrode for the solar cell structure.

9. The method for producing an electronic device according to claim 3 , wherein
the wiring is carried out by:
providing a pad electrode in the second wafer before carrying out the bonding so that the electric power can be supplied to the drive circuit;
forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that the electric power can be extracted from the solar cell structure of the first wafer; and
electrically connecting the pad electrode and the electrode for the solar cell structure.

10. The method for producing an electronic device according to claim 4 , wherein
the wiring is carried out by:
providing a pad electrode in the second wafer before carrying out the bonding so that the electric power can be supplied to the drive circuit;
forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that the electric power can be extracted from the solar cell structure of the first wafer; and
electrically connecting the pad electrode and the electrode for the solar cell structure.

11. The method for producing an electronic device according to claim 5 , wherein
the wiring is carried out by:
providing a pad electrode in the second wafer before carrying out the bonding so that the electric power can be supplied to the drive circuit;
forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that the electric power can be extracted from the solar cell structure of the first wafer; and
electrically connecting the pad electrode and the electrode for the solar cell structure.

12. The method for producing an electronic device according to claim 6 , wherein
the wiring is carried out by:
providing a pad electrode in the second wafer before carrying out the bonding so that the electric power can be supplied to the drive circuit;
forming an electrode for a solar cell structure at least either one of before or after carrying out the bonding so that the electric power can be extracted from the solar cell structure of the first wafer; and
electrically connecting the pad electrode and the electrode for the solar cell structure.

Assignees

• Shinetsu Handotai Kk

Inventors

• Ishizaki Junya
• Furuya Shogo
• Akiyama Tomohiro

Classifications

• H10W90/732

  between stacked chips · CPC title

• H10W90/22

  the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/874

  On different surfaces · CPC title