Plasma chamber and chamber component cleaning methods

Patent metadata

Field	Value
Publication number	US-11984306-B2
Application number	US-202117562467-A
Country	US
Kind code	B2
Filing date	Dec 27, 2021
Priority date	Jun 9, 2021
Publication date	May 14, 2024
Grant date	May 14, 2024

Abstract

Embodiments provided herein generally include plasma processing systems configured to preferentially clean desired surfaces of a substrate support assembly by manipulating one or more characteristics of an in-situ plasma and related methods. In one embodiment, a plasma processing method includes generating a plasma in a processing region defined by a chamber lid and a substrate support assembly, exposing an edge ring and a substrate supporting surface to the plasma, and establishing a pulsed voltage (PV) waveform at the edge control electrode.

First claim

What is claimed is:

1. A processing cleaning method, comprising:
igniting and maintaining a plasma from cleaning gases or vapors delivered to a processing region, the processing region defined by a chamber lid and a substrate support assembly that faces the chamber lid;
partially elevating a substrate above the substrate support assembly, the substrate support assembly comprising:
a first portion of dielectric material that forms a substrate supporting surface;
a first electrode spaced apart from the substrate supporting surface by the first portion of dielectric material;
an edge ring that surrounds the substrate supporting surface, the edge ring having one or more edge pocket surfaces that define an edge pocket region with a circumferential edge of the partially lifted substrate disposed over the substrate supporting surface; and
a second electrode spaced apart from the edge ring by a second portion of dielectric material, wherein
the substrate support assembly is electrically coupled to a radio frequency (RF) generator that delivers an RF signal used to ignite and maintain the plasma,
the RF signal establishes a first RF waveform at the first electrode and a second RF waveform at the second electrode,
the second electrode is electrically coupled to an edge tuning circuit that is configured to adjust one or more characteristics of the second RF waveform relative to the first RF waveform to control a plasma density uniformity in the processing region, and
at least one characteristic of the second RF waveform is different from a characteristic of the first RF waveform; and

exposing the one or more edge pocket surfaces to the plasma.

2. The method of claim 1 , wherein the at least one different characteristic comprises a phase difference between the second RF waveform and the first RF waveform.

3. The method of claim 2 , wherein the phase difference between the second RF waveform and the first RF waveform causes an increase in plasma density in the edge pocket region.

4. The method of claim 1 , wherein the edge tuning circuit comprises one or more variable capacitors.

5. The method of claim 4 , wherein the edge tuning circuit is electrically coupled between the second electrode and ground.

6. The method of claim 4 , wherein the edge tuning circuit is electrically coupled between the second electrode and the RF generator.

7. The method of claim 4 , wherein the edge tuning circuit is electrically coupled to the second electrode, ground, and an RF generator.

8. The method of claim 1 , wherein the substrate support assembly comprises a support base, the RF signal is delivered to the support base, and the first electrode is capacitively coupled to the support base through a second portion of dielectric material disposed between the support base and the first electrode.

9. The method of claim 8 , wherein the first electrode is electrically coupled to a first bias generator configured to establish a first pulsed voltage (PV) waveform at the first electrode during substrate processing.

10. The method of claim 9 , wherein the second electrode is electrically coupled to a second bias generator configured to establish a second pulsed voltage (PV) waveform at the second electrode during substrate processing.

11. The method of claim 10 , further comprising maintaining a voltage established at one or both of the first electrode or edge control electrode at about 0+/−1 volts (V) while concurrently exposing the one or more edge pocket surfaces to the plasma.

12. The method of claim 1 , wherein the RF signal has a frequency of about 27 MHz or more.

13. A plasma processing chamber, comprising:
a chamber body and a chamber lid that define a processing volume;
a substrate support assembly disposed in the processing volume, the substrate support assembly comprising:
a support base; and
a substrate support disposed on the support base, the substrate support comprising a dielectric material that forms a substrate supporting surface, a bias electrode that is disposed in the dielectric material and is spaced apart from the substrate supporting surface and the support base by portions of the dielectric material, and an edge control electrode that is spaced a distance from a center of the bias electrode;

an edge tuning circuit electrically coupled to the edge control electrode; and
a non-transitory computer-readable medium having instructions for performing a cleaning method, the method comprising:
generating, by use of an RF signal delivered to the support base, a plasma from cleaning gases or vapors delivered to the processing volume, wherein the RF signal is delivered to the support base by an RF generator, and the RF signal establishes a first RF waveform at the bias electrode and a second RF waveform at the edge control electrode;
partially elevating a substrate above the substrate support assembly, wherein an edge pocket region is define along a circumferential edge of the partially lifted substrate; and
adjusting, by use of the edge tuning circuit, one or more characteristics of the second RF waveform relative to the first RF waveform.

14. The plasma processing chamber of claim 13 , wherein (b) comprises adjusting, by use of the edge tuning circuit, one or more of a voltage amplitude ratio, a current amplitude ratio, or a phase difference between the second RF waveform and the first RF waveform.

15. The plasma processing chamber of claim 14 , wherein (b) comprises adjusting the phase difference between the second RF waveform and the first RF waveform.

16. The plasma processing chamber of claim 15 , wherein adjusting the phase difference between the second RF waveform and the first RF waveform increases a concentration of a plasma formed in a gap region between an edge of the partially lifted substrate and an edge ring disposed on the substrate support.

17. The plasma processing chamber of claim 13 , wherein the edge tuning circuit comprises one or more variable capacitors.

18. The plasma processing chamber of claim 13 , wherein the edge tuning circuit is electrically coupled between the edge control electrode and ground.

19. The plasma processing chamber of claim 13 , wherein the edge tuning circuit is electrically coupled between the edge control electrode and the RF generator.

20. The plasma processing chamber of claim 13 , wherein the edge tuning circuit is electrically coupled to the edge control electrode, ground, and the RF generator.

Assignees

• Applied Materials Inc

Inventors

• Dhindsa Rajinder
• Cui Linying
• Rogers James

Classifications

• H10P14/6336

  in the presence of a plasma [PECVD] · CPC title

• H01J37/32862 Primary

  In situ cleaning of vessels and/or internal parts · CPC title

• H01J37/32128

  using particular waveforms, e.g. polarised waves · CPC title

• H01J37/32165

  Plural frequencies · CPC title

• H01J37/32174

  Circuits specially adapted for controlling the RF discharge · CPC title