Anode for lithium metal battery, manufacturing method of the same, lithium metal battery including the same

Patent metadata

Field	Value
Publication number	US-11973229-B2
Application number	US-202117355982-A
Country	US
Kind code	B2
Filing date	Jun 23, 2021
Priority date	Feb 28, 2020
Publication date	Apr 30, 2024
Grant date	Apr 30, 2024

Abstract

The present disclosure relates to an anode for a lithium-metal battery, a manufacturing method of the same, and a lithium-metal battery including the anode. The anode for a lithium-metal battery includes a complex hierarchical structure current collector which includes an inverted pyramid-shaped micro hole pattern and nanostructures provided within the inverted pyramid-shaped micro hole pattern; and a lithium metal which is electrodeposited on the nanostructure of the current collector. As a result, it is possible to increase the life stability of the battery and increase the coulombic efficiency.

First claim

What is claimed is:

1. A method for manufacturing an anode for a lithium-metal battery, the method comprising:
manufacturing a copper electrode comprising an inverted pyramid-shaped micro hole pattern, wherein the manufacturing the copper electrode comprising the inverted pyramid-shaped micro hole pattern comprises:
applying an oxygen plasma treated Si x N y wafer on a silicon substrate,
coating a photo resistor pattern on the Si x N y wafer,
removing the Si x N y wafer in a region where there is no photo resistor pattern, by performing photolithography etching,
removing the photo resistor pattern,
forming the inverted pyramid-shaped micro hole pattern by etching the silicon substrate of a region where there is no Si x N y wafer,
depositing a composite of chromium and copper,
forming a nickel mold by performing nickel plating through an electrocast, and
forming the copper electrode comprising the inverted pyramid-shaped micro hole pattern by performing copper plating on the nickel mold through the electrocast;
electrodepositing nanostructures on the inverted pyramid-shaped micro hole pattern; and
electrodepositing a lithium metal on the nanostructures.

2. The method of claim 1 , wherein the electrodepositing nanostructures on the inverted pyramid-shaped micro hole pattern comprises:
growing the nanostructures on the copper electrode based on an electrodeposition method;
removing the nanostructures overgrown outside the inverted pyramid-shaped micro hole pattern of the copper electrode; and
performing mechanical polishing in order to remove the nanostructures remaining outside the inverted pyramid-shaped micro hole pattern of the copper electrode.

3. The method of claim 2 , wherein the removing the nanostructures overgrown outside the inverted pyramid-shaped micro hole pattern of the copper electrode comprises removing the nanostructures overgrown outside the inverted pyramid-shaped micro hole pattern of the copper electrode by using a polyimide tape and a rubber roller.

4. The method of claim 2 , wherein the growing the nanostructures on the copper electrode based on an electrodeposition method and the removing the nanostructures overgrown outside the inverted pyramid-shaped micro hole pattern of the copper electrode are performed repeatedly a plurality of number of times.

5. The method of claim 1 , wherein the manufacturing a copper electrode comprising an inverted pyramid-shaped micro hole pattern comprises manufacturing the inverted pyramid-shaped micro hole pattern such that a plurality of inverted pyramid-shaped micro holes are disposed at regular intervals,
and wherein the inverted pyramid-shaped micro hole has a quadrangular lower surface and a quadrangular upper surface wider than the lower surface, and has a side surface having an inclined structure.

6. The method of claim 5 ,
wherein the manufacturing a copper electrode comprising an inverted pyramid-shaped micro hole pattern comprises:
manufacturing such that center-to-center spacing between two adjacent inverted pyramid-shaped micro holes is 100 μm; and
manufacturing such that a length of one side of the upper surface of the inverted pyramid-shaped micro hole is between 40 μm to 50 μm, and a depth of the inverted pyramid-shaped micro hole is 20 μm.

7. The method of claim 6 ,
wherein the manufacturing a copper electrode comprising an inverted pyramid-shaped micro hole pattern comprises manufacturing such that the side surface of the inverted pyramid-shaped micro hole has an inclined structure of between 50 degrees and 60 degrees.

Assignees

• Korea Advanced Inst Sci & Tech

Inventors

• Seok Jae Young
• Kim Sanha
• Yang Inyeong
• Jeong Ji-Hun
• Lee Seung Seob

Classifications

• H01M4/80 Primary

  Porous plates, e.g. sintered carriers · CPC title

• H01M4/045

  Electrochemical coating; Electrochemical impregnation · CPC title

• H01M4/134 Primary

  Electrodes based on metals, Si or alloys · CPC title

• H01M4/382

  Lithium (H01M4/405 takes precedence) · CPC title

• H01M4/661 Primary

  Metal or alloys, e.g. alloy coatings (H01M4/669 take precedence) · CPC title