Method for producing 3d-structured thin films

US2016006016A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016006016-A1
Application numberUS-201414770238-A
CountryUS
Kind codeA1
Filing dateFeb 24, 2014
Priority dateFeb 25, 2013
Publication dateJan 7, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The method for producing a stack of films provided with at least one 3D-structured pattern including providing a first mould having a textured front face including a first 3D pattern, depositing a first layer of the stack on the textured front face so as to cover the first 3D pattern by a continuous layer, the first layer having a first face in contact with the front face of the mould, removing the first mould so as to release the first face of the first layer having a second 3D pattern complementary to the first 3D pattern and depositing a second layer of the stack on the first face of the first layer so as to cover the second 3D pattern by a continuous layer.

First claim

Opening claim text (preview).

1 . A method for producing a stack of layers comprising at least one structured 3D pattern, the method comprising the following steps: providing a first mould provided with a textured front surface comprising a first 3D pattern; depositing a first layer of the stack on the textured front surface so as to cover the first 3D pattern by means of a continuous layer, the first layer having a first surface in contact with the front surface of the mould; the method further comprises the following steps: removing the first mould so as to release the first surface of the first layer presenting a second 3D pattern complementary to the first 3D pattern; depositing a second layer of the stack on the first surface of the first layer so as to cover the second 3D pattern by means of a continuous layer. 2 . The method according to claim 1 , wherein before the removal of the first mould, at least one first additional layer is deposited on the first layer, the first layer separating the first additional layer from the first mould. 3 . The method according claim 1 , wherein the 3D pattern is formed by a blind hole opening onto the front surface ( 2 a ) of the first mould. 4 . The method according to claim 1 , wherein before the removal of the first mould a support substrate is arranged on the first layer so that the first layer is interposed between the mould and the support substrate. 5 . The method according to claim 4 , wherein the support substrate is an adhesive substrate configured so as to be bonded to a continuous layer of the stack. 6 . The method according to claim 4 , wherein the support substrate is removed after the removal of the first mould. 7 . The method according to claim 1 , wherein a third layer is deposited on the second layer forming an electrolyte layer, and in that the stack of first, second, and third layers forms an electrochemically active stack of layers of an electric microbattery. 8 . The method according to claim 7 , wherein the first and third layers form the anode and cathode of the electric microbattery. 9 . The method according to claim 8 , wherein the textured front surface of the mould is electrically conducting, and in that the first layer is deposited by electrodeposition by hydrothermal means. 10 . The method according to claim 9 , wherein the first layer comprises a lithiated oxide of at least one transition metal chosen from the group comprising nickel, cobalt, manganese, titanium and a mixture of these metals. 11 . The method according to claim 9 , wherein after electrodeposition by hydrothermal means, the first layer is heated to a temperature between 300° C. and 1100° C. 12 . The method according to claim 2 , wherein the first additional layer is an electrically conducting layer forming a first current collector of the electric microbattery. 13 . The method according to claim 4 , wherein the support substrate is electrically conducting, and in that it forms the first current collector of the electric microbattery. 14 . The method according to claim 12 , wherein the first additional layer has a thickness ranging from 10 nm to a few micrometres.

Assignees

Inventors

Classifications

  • with shapes other than plane or cylindrical · CPC title

  • C25D9/08Primary

    by cathodic processes · CPC title

  • H01M4/045Primary

    Electrochemical coating; Electrochemical impregnation · CPC title

  • Manufacturing or production processes characterised by the final manufactured product · CPC title

  • Construction or manufacture · CPC title

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What does patent US2016006016A1 cover?
The method for producing a stack of films provided with at least one 3D-structured pattern including providing a first mould having a textured front face including a first 3D pattern, depositing a first layer of the stack on the textured front face so as to cover the first 3D pattern by a continuous layer, the first layer having a first face in contact with the front face of the mould, removing…
Who is the assignee on this patent?
Commissariat À L En Atomique Et Aux En Alternatives, Centre Nat Rech Scient
What technology area does this patent fall under?
Primary CPC classification C25D9/08. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Jan 07 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).