Methods for manufacturing a display device

Patent metadata

Field	Value
Publication number	US-11973067-B2
Application number	US-202117410445-A
Country	US
Kind code	B2
Filing date	Aug 24, 2021
Priority date	Aug 1, 2017
Publication date	Apr 30, 2024
Grant date	Apr 30, 2024

Abstract

Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process:

0
≦



∫

T
⁢

⁢
1

T
⁢

⁢
2

⁢

A
⁡

(
T
)

⁢
dT

-

∫

T
⁢

⁢
1

T
⁢

⁢
3

⁢

E
⁡

(
T
)

⁢
dT

⁢



<
0.01

wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.

First claim

What is claimed is:

1. A method for manufacturing a display device, comprising:
providing a plurality of light-emitting units;
providing a substrate;
transferring the plurality of light-emitting units to a transfer head; and
attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process;
wherein the transfer head and the substrate satisfy the following equation during the bonding process:

0
≦



∫

T
⁢

⁢
1

T
⁢

⁢
2

⁢

A
⁡

(
T
)

⁢
dT

-

∫

T
⁢

⁢
1

T
⁢

⁢
3

⁢

E
⁡

(
T
)

⁢
dT

⁢



<
0.01

wherein A(T) is a coefficient of thermal expansion of the transfer head,
E(T) is a coefficient of thermal expansion of the substrate,
T1 is room temperature,
T2 is a temperature of the transfer head, and
T3 is a temperature of the substrate.

2. The method as claimed in claim 1 , wherein the transfer head and the substrate satisfy the following equation during the bonding process:

0
≦



∫

T
⁢

⁢
1

T
⁢

⁢
2

⁢

A
⁡

(
T
)

⁢
dT

-

∫

T
⁢

⁢
1

T
⁢

⁢
3

⁢

E
⁡

(
T
)

⁢
dT

⁢



<

0.005
.

3. The method as claimed in claim 1 , wherein a material of the transfer head is different from a material of the substrate.

4. The method as claimed in claim 1 , further comprising:
forming an adhesive layer on the transfer head; and
attaching the plurality of light-emitting units to the adhesive layer, wherein forming the adhesive layer comprises:
forming a spacer layer on the transfer head, wherein the spacer layer comprises a plurality of openings; and
filling an adhesive material into the plurality of openings to form the adhesive layer, and the adhesive layer comprising a plurality of adhesive patterns.

5. The method as claimed in claim 4 , wherein a height of the spacer layer is less than a height of the adhesive pattern.

6. The method as claimed in claim 4 , wherein a height of the spacer layer is greater than the height of the adhesive pattern.

Assignees

• Innolux Corp

Inventors

• Liu Tung-Kai
• Hsieh Tsau-Hua
• Lin Fang-Ying
• Cheng Kai
• Wang Hui-Chieh
• Hu Shun-Yuan

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/926

  Multiple bond pads having different sizes · CPC title

• H10W72/29

  Bond pads specially adapted therefor · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title