Flip-chip semiconductor-on-insulator transistor layout

Patent metadata

Field	Value
Publication number	US-11973033-B2
Application number	US-202017138613-A
Country	US
Kind code	B2
Filing date	Dec 30, 2020
Priority date	Jan 3, 2020
Publication date	Apr 30, 2024
Grant date	Apr 30, 2024

Abstract

A flip-chip semiconductor-on-insulator die includes a substrate layer, an active layer, an insulator layer between the substrate layer and the active layer, a first metal layer, and a first via layer between the active layer and the first metal layer. The die at least first and second contact pads and a transistor including a first terminal formed within the active layer. A first portion of the first terminal falls within a footprint of the first contact pad and a second portion of the first terminal falls within a footprint of the second contact pad.

First claim

What is claimed is:

1. A flip-chip semiconductor-on-insulator die comprising:
a substrate layer, an active layer, an insulator layer between the substrate layer and the active layer, a first metal layer, and a first via layer between the active layer and the first metal layer;
at least first and second contact pads; and
a transistor including a first terminal, the first terminal formed within the active layer, a first portion of the first terminal falling within a footprint of the first contact pad and not within a footprint of the second contact pad, and a second portion of the first terminal falling within the footprint of the second contact pad and not within the footprint of the first contact pad.

2. The die of claim 1 wherein at least 25 percent of the first terminal falls within the combined footprints of the at least first and second contact pads.

3. The die of claim 1 wherein at least 50 percent of the first terminal falls within the combined footprints of the at least first and second contact pads.

4. The die of claim 1 wherein the transistor is divided into generally equally sized portions, each generally equally sized portion connected to a respective one of the at least first and second contact pads.

5. The die of claim 1 further comprising a conduction path extending between the first terminal and the first and second contact pads, the conduction path including a first via segment formed within the first via layer and a first metal segment formed within the first metal layer.

6. The die of claim 5 further comprising a second metal layer and a second via layer, the second via layer between the first metal layer and the second metal layer, the conduction path further including a second via segment formed from the second via layer and a second metal segment formed from the second metal layer.

7. The die of claim 6 wherein a portion of the conduction path including the first terminal, the first via segment, the first metal segment, the second via segment, and the second metal segment extends substantially completely orthogonal to a plane that is substantially parallel to the substrate layer.

8. The die of claim 6 wherein the surface area of an interface between the first metal segment and the second via segment is at least 15 percent of the surface area of the first metal segment.

9. The die of claim 5 wherein the surface area of an interface between the first via segment and the first terminal is at least 5 percent of the surface area of the first terminal.

10. The die of claim 1 wherein the transistor is a field effect transistor, the first terminal is a source of the transistor.

11. The die of claim 1 wherein the at least first and second contact pads are ground pads.

12. The die of claim 1 wherein the transistor includes a first part including the first portion of the first terminal and a second part including the second portion of the first terminal, a footprint of the first part of the transistor overlapping the footprint of the first contact pad and a footprint of the second part of the transistor overlapping the footprint of the second contact pad.

13. A packaged module comprising:
a semiconductor-on-insulator die including a substrate layer, an active layer, an insulator layer between the substrate layer and the active layer, a first metal layer, a first via layer between the active layer and the first metal layer, at least first and second contact pads, and a transistor including a first terminal, the first terminal formed within the active layer, a first portion of the first terminal falling within a footprint of the first contact pad and not within a footprint of the second contact pad, and a second portion of the first terminal falling within the footprint of the second contact pad and not within the footprint of the first contact pad;
a module metal layer electrically connected to the first and second contact pads of the die; and
a ground plane electrically connected to the module metal layer.

14. The packaged module of claim 13 further comprising a conduction path extending between the first terminal and the ground plane, the conduction path including a first via segment formed within the first via layer, a first metal segment formed within the first metal layer, and a module metal segment formed within the module metal layer.

15. The packaged module of claim 14 wherein the wherein the first portion of the first terminal falls within a footprint of a first portion of the module metal segment and the second portion of the first terminal falls within a footprint of a second portion of the module metal segment.

16. The packaged module of claim 13 wherein the transistor includes a first part including the first portion of the first terminal and a second part including the second portion of the first terminal, a footprint of the first part of the transistor overlapping the footprint of the first contact pad and a footprint of the second part of the transistor overlapping the footprint of the second contact pad.

17. A power amplifier system comprising:
a semiconductor-on-insulator die including a substrate layer, an active layer, an insulator layer between the substrate layer and the active layer, a first metal layer, a first via layer between the active layer and the first metal layer, and at least first and second contact pads; and
a power amplifier configured to amplify a radio frequency signal and including a first transistor formed in the semiconductor-on-insulator die, the first transistor including a first terminal formed within the active layer, a first portion of the first terminal falling within a footprint of the first contact pad and not within a footprint of the second contact pad, and a second portion of the first terminal falling within the footprint of the second contact pad and not within the footprint of the first contact pad.

18. The power amplifier system of claim 17 wherein the first transistor is a field effect transistor and the first terminal is a source terminal.

19. The power amplifier system of claim 18 wherein the power amplifier further includes a second transistor formed in the semiconductor-on-insulator die, the second transistor being a field effect transistor.

20. The power amplifier system of claim 19 wherein the first transistor is configured in a common source configuration and the second transistor is configured in a common gate configuration.

Assignees

• Skyworks Solutions Inc

Inventors

• Liu Yang
• Lee Yong Hee
• Obkircher Thomas

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H10W72/59

  Bond pads specially adapted therefor · CPC title