Method of manufacturing light emitting module, light emitting module, and projector

Patent metadata

Field	Value
Publication number	US-11967803-B2
Application number	US-202217985997-A
Country	US
Kind code	B2
Filing date	Nov 14, 2022
Priority date	Dec 12, 2018
Publication date	Apr 23, 2024
Grant date	Apr 23, 2024

Abstract

A light emitting module includes: a first light emitting device including: a first package, a plurality of first semiconductor laser elements mounted in the first package, and a first lens member having lens portions, a number of the lens portion is the same as a number of the first semiconductor laser elements; and a second light emitting device including: a second package, a plurality of second semiconductor laser elements mounted in the second package, wherein a quantity of the second semiconductor laser elements is fewer than a quantity of the first semiconductor laser elements, and a second lens member which is structured the same as the first lens member; and one or more mounting substrates in which the first light emitting device and the second light emitting device are mounted.

First claim

What is claimed is:

1. A light emitting module comprising:
a first light emitting device comprising:
a first package,
a plurality of first semiconductor laser elements mounted in the first package, and
a first lens member having lens portions, wherein a quantity of the lens portions is the same as a quantity of the first semiconductor laser elements mounted in the first package; and

a second light emitting device comprising:
a second package,
a plurality of second semiconductor laser elements mounted in the second package, wherein a quantity of the second semiconductor laser elements mounted in the second package is fewer than the quantity of the first semiconductor laser elements mounted in the first package, and
a second lens member which is structured the same as the first lens member, such that a quantity of the lens portions in the second lens member is the same as the quantity of the lens portions in the first lens member and greater than the quantity of the second semiconductor laser elements mounted in the second package; and

one or more mounting substrates on which the first light emitting device and the second light emitting device are mounted.

2. The light emitting module according to claim 1 , wherein the quantity of the second semiconductor laser elements is fewer by one than the quantity of the first semiconductor laser elements.

3. The light emitting module according to claim 1 , wherein the quantity of the second semiconductor laser elements is fewer by two than the quantity of the first semiconductor laser elements.

4. The light emitting module according to claim 1 , wherein;
the first light emitting device has four of the first semiconductor laser elements mounted in the first package, and the first lens member has four lens portions which is a same quantity as the quantity of the first semiconductor laser elements.

5. The light emitting module according to claim 1 , wherein;
the plurality of the second semiconductor laser elements in the second light emitting device are disposed at identical positions to a set of the plurality of the first semiconductor laser elements in the first light emitting device.

6. The light emitting module according to claim 1 , wherein the first semiconductor laser element emits the same color light as the second semiconductor laser element.

7. The light emitting module according to claim 1 , wherein a shape of the first package is the same as a shape of the second package in a top view.

8. The light emitting module according to claim 7 , wherein;
the shape of the first light emitting device and the shape of the second light emitting device are a quadrangular shape in a top view, and a shape of the first lens member and a shape of the second lens member are a quadrangular shape in a top view.

Assignees

• Nichia Corp

Inventors

• Kozuru Kazuma
• Hashimoto Takuya

Classifications

• H01S5/026

  Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers (stabilisation of output H01S5/06) · CPC title

• H01S5/02253

  using lenses · CPC title

• H01S5/02345

  Wire-bonding · CPC title

• H01S5/02335 Primary

  Up-side up mountings, e.g. epi-side up mountings or junction up mountings · CPC title

• H01S5/4093 Primary

  Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion · CPC title